JPH0241872B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a thin film magnetic head, and more particularly to a method for forming a lead wire and an apparatus therefor to facilitate the method for connecting the lead wire.

Structure of conventional example and its problems Recently, after forming a ferromagnetic layer, an insulating layer, and a conductive layer on a substrate into a flat plate using photoablation techniques such as vapor deposition, sputtering, and photoetching, Thin film magnetic heads processed into predetermined shapes have been put into practical use. In such a thin film magnetic head, (a) the track width is determined by the vapor deposition pattern, so a smaller track width can be obtained compared to a conventional bulk head, thus enabling high-density recording, and (b) the actual gap width can be reduced. (c) high-density multitrack is possible; and (d) batch method is possible in which multiple heads are simultaneously formed on the same substrate, which reduces man-hours. It has advantages such as being able to save money.
However, in thin-film magnetic heads, the terminal processing part of the conductive layer is formed only on one plane on the substrate, and because the head is ultra-miniaturized and the pattern pitch is fine, the lead connection method is called formation of the leads for connection. There is a problem with the law.

As an example, a thin film magnetic head for a flying computer and its terminal tangents will be described. Ferromagnetic layer, insulator layer, and conductor layer are deposited on the substrate.
FIG. 7 shows a completed chip 1 of a thin film magnetic head for a flying type computer, which was formed on a flat plate using photoabsorption techniques such as sputtering and photoetching, and then processed into a predetermined shape. In FIG. 7, reference numeral 2 indicates a terminal portion of the conductor layer on one side of the head chip 1. In FIG. A lead wire 3 is divided into conductor portions 3A and 3B and is tangentially connected to the terminal portion 2 by means such as soldering.

FIG. 5 is a diagram for explaining details of the tangential surface of the leads of the head chip 1 shown in FIG. Thin film magnetic heads 4A and 4B are formed on both the left and right sides, and the entire surface of the thin film magnetic heads except for the terminal portion 2 of the conductor layer is covered with an insulating protective layer. 5 indicates a conductor layer of the thin film magnetic head.

Normally, the dimensions of this type of head are small, for example, width W = 3 mm, thickness Z = 1 mm, length l = 4 mm, and the dimensions of the terminal portion 2 are also as follows: width y = 0.1 mm,
The length x = 0.6 mm, the pitch between the terminals P = about 0.21 mm, the spacing is very small, and the terminal portion 2 is also small. Therefore, as shown in FIG. 6, the lead wire 3 connected to the terminal portion 2 is usually coated with an insulating film 3C of polyurethane or the like having a thickness of about 5 to 10 μm on conductor portions 3A and 3B made of copper wires with a diameter of about 50 μm. is coated, and the two conductor parts 3A and 3B are unified in parallel by the insulating film 3C (hereinafter referred to as a double conductor wire)
is used.

In order to facilitate the connection between the terminal portion 2 of the head chip 1 and the double conductor wire 3, the insulating film 3C at the end of the double conductor wire 3 is removed, and the conductor portion 3A,
It is necessary to perform a molding operation to expose the conductor parts 3B and to spread them parallel to the conductor parts 3A and 3B in accordance with the pitch P of the terminal part 2. Previously, this work had been done one by one by hand under a magnifying glass.

Purpose of the Invention The present invention solves the above-mentioned problems, and provides a conductor that can be completely mechanized and automatically carried out, significantly shortening working time, achieving accurate finishing, and improving yield. The object of the present invention is to provide a forming method and an apparatus therefor.

Structure of the Invention In order to achieve the above object, the present invention removes the coating film by spraying or spraying a coating film stripping agent (liquid) on the end of the double conductor wire, and then sequentially sprays a drying fluid after cleaning. Clean the coating film removal part of the double conductor wire.
The coating film removal process involves drying, and the double conductor wire is rotated at high speed around the rotation center, and the centrifugal force is used to separate the two closely parallel conductors of the double conductor wire from which the coating film has been removed, and widen the gap between them. In the process, a mold is placed between the two expanded conductive wires, a fluid stream is injected onto the two conductive wires and the mold, and the two conductive wires are made to follow the shape of the mold. A double conductor wire of the required length is formed by forming the double conductor wire parallel to the required spacing, grasping the end of the double conductor wire on the formed side, letting out the wire by one length, and cutting the other end. At the same time, the double conductor wire is fed out and cut, and one end of the cut wire is used as the coating film removal portion of the next double conductor wire.

Further, the present invention provides a means for sequentially paying out the double conductor wire stored in a bobbin or the like, a rotating means for causing each double conductor paying out means to rotate at high speed around the payout double conductor wire as a center of rotation, and a tip of the double conductor wire for feeding out the double conductor wire, A means for spraying or spraying a coating film stripping agent, a means for spraying a cleaning liquid and a drying fluid, and a mold for forming the two conductors of the double conductor in parallel at a required interval are brought out and moved toward or backward from the double conductor. means for injecting a fluid stream to press the conducting wire against the mold to form it; and means for grasping the end of the formed conducting wire and drawing out a required length of one double conducting wire; This structure includes a means for cutting the other end of the drawn-out double conductor wire.

DESCRIPTION OF EMBODIMENTS Hereinafter, one embodiment of the present invention will be described based on the drawings. FIG. 4 is a diagram for explaining the principle of the method of the present invention, and FIG. 8 is a diagram for explaining the outline of the process of the present invention, which will be explained below. Insulating film 3C (for example, polyurethane) at the end of the double conductor wire 3
After removing the insulating film 3C by injecting or spraying a stripping agent (liquid) from the nozzles 6A and 6B, the nozzle 6
Water or the like is sprayed from nozzles A and 6B for cleaning, and dry air is further sprayed from nozzles 6A and 6B to expose the conductor parts 3A and 3B without the coating film (coating film removal step of the first step). . In this state, the conductor portion 3A,
3B is separated, but it is not in a sufficient state to connect to the terminal portion 2 of the head chip 1. Therefore, after clearly separating the conductor parts 3A and 3B (second step, conductor separation step), the conductor parts are formed to be parallel to each other at the required pitch P (third step). conductor forming process).

The second step of separating the conductors will be explained. 7 is a hollow rotating shaft, inside which is a pipe 8 that guides the multi-conductor wire 3, the multi-conductor wire 3, guide pipe 8, and rotating shaft 7 are rotated together at high speed, with the multi-conductor wire 3 as the center of rotation. It is configured as follows. After the coating film is removed in the first step, the conductor portions 3A and 3B are relatively close to each other. By rotating the rotating shaft 7 at high speed, the conductor parts 3A and 3B are arranged as shown in 3A' and 3B' in FIG.
They can be separated from each other by centrifugal force and the distance between them can be increased.

As shown in FIG. 4, the mold tip 9A is brought close to the state where the two conductor parts 3A and 3B are clearly separated and expanded as 3A' and 3B'. Therefore, by injecting fluid (for example, water) from the nozzles 6A and 6B and hitting the conductor parts 3A' and 3B' with its kinetic energy, the conductor parts are deformed and made to follow the mold, thereby forming two conductors. 3A and 3B in Fig. 4 and 3A and 3 in Fig. 6.
Shape them in parallel with the required spacing as shown in B. This is the third step, the conductor forming step.

Finally, the fourth step, the line cutting step, is entered. Here, the molded double conductor wire 3 is pulled out by the required length of one wire and cut. This is constructed so that the double conducting wire 3 can be drawn out from the guide pipe 8.

The above is an outline of the process of the present invention. Next, the equipment that realizes this process is shown in Figures 1 and 2.
This will be explained using FIG. FIG. 1 is an overall front view of an apparatus for carrying out the method of the present invention, FIG. 2 is a plan view thereof, and the right half is a view taken along the line A--A in FIG. Third
The figure is a perspective view for explaining the wire cutting unit 38 and the wire clamping unit 34.

Reference numeral 11 denotes a bobbin on which the double conductor wire 3 is wound, and the double conductor wire 3 can be fed out through a guide pipe 8. A bobbin holder 12 is fixed to a rotating shaft 7 that holds a guide pipe 8 and rotates integrally.
A bobbin fixing plate 13 is further screwed to the bobbin holder 12. Reference numeral 14 is a stand for fixing the bobbin 11 to the bobbin fixing plate 13, and although the details are omitted, it rotatably holds the bobbin 11 so that the double conductor wire 3 can be drawn out. 15 is a driven pulley fixed to the rotating shaft 7, 16 is a belt, 17 is a motor, 18 is a motor support stand, 19 is a motor fixing screw, 20 is a drive side pulley fixed to the motor shaft, 21 is a motor support stand 18 to the board 22. 23 is a screw for fixing the support column 24 to the substrate 22, and 25 is a lower substrate having a screw portion on which the support column 24 can be erected.

A housing 26 has ball bearings 27A and 27B that rotatably hold the rotating shaft 7. 28 is a bearing holding plate. 29 is the third
This is the upper blade of a double conductor wire cutter having the shape shown in detail in the figure, and 29A indicates the upper blade portion.

30 is a line cutting unit, which is fixed to the piston rod 32 of the air cylinder 31 with a set screw 33. The overall shape of the line cutting unit 30 and cutter upper blade 29 is almost the same as the line clamp unit 34 and line clamp right piece 35 shown in FIG. The upper blade portion 29A of the blade 29 is configured to engage with each other, and the clamp is configured such that the right portion 35A of the right clamp portion 35 and the left portion 34A of the wire clamp unit 34 are butted against each other and can be clamped. There is. The right piece 35 of the wire clamp and the upper cutter blade 29 are guided by the groove 34B of the wire clamp unit 34 and the groove 30B of the wire cutting unit 30 so that they can slide.
Pins 36B and 37 are attached to plungers 36A and 37A of solenoid 36 and solenoid 37.
Connected by B. 36C is a spring that returns the solenoid 36 to its original position. Wire clamp unit 34
is fixed to the piston rod 39 of the air cylinder 38 with a set screw 40.

Reference numeral 41 denotes a stand for fixedly holding the air cylinder 38, which is fixed to the piston rod 44 of the air cylinder 43 via a joint 42, and
With the vertical movement of the joint 42, the entire part after the joint 42 moves up and down, and after the wire clamp unit 34 clamps the wire, the piston rod 44 is operated so as to pull out the double conductor wire 3 by the required length for one wire.
45 is a screw that fixes the air cylinder 43 to the lower substrate 25.

9 is a mold for molding the conductor parts 3A and 3B;
It is fixed to the piston rod 47 of the air cylinder 46 with a set screw, and its tip 9A is the fourth piston rod.
It has a shape for molding as shown in the figure. 48 is a metal fitting for fixing the air cylinder 46 to the lower substrate 25. 49 is the air cylinder 31
This is a screw for fixing the board 22 to the board 22. 6A,
Reference numeral 6B corresponds to the nozzle in FIG. 4, from which a release agent, cleaning liquid, dry air, and molding fluid can be injected or sprayed. Note that specific means for doing this, such as a pressurizing device, liquid holding tanks, and switching valves, will be omitted.

Next, its operation will be briefly explained. Guide pipe 8
to the place where the double conductor wire 3 of the required length comes out,
Inject or spray a release agent from nozzles 6A and 6B,
After removing the insulating film 3C, a cleaning liquid such as water is sprayed from the nozzles 6A and 6B for cleaning, and dry air is further sprayed from the nozzles to clean the conductor portions 3A and 3C without the coating film.
Expose 3B.

Next, the motor 17 is rotated to rotate the rotary shaft 7, that is, the guide pipe 8 and the double conducting wire 3 at high speed, and the conductor parts 3A and 3B are spread and separated by centrifugal force.

Next, the air cylinder 46 is operated to raise the piston rod 47, that is, the mold 9, and bring its tip 9A closer to between the separated conductor parts 3A' and 3B', as shown in FIG. Here, fluid such as water is again injected from the nozzles 6A and 6B to generate fluid flows as shown at 50A and 50B in FIG. to obtain parallel conductor parts with the required spacing. At this point, the piston rod 47 of the air cylinder 46 is moved back, and the mold 9A is returned to its original position.

Next, the air cylinder 38 is operated, and the piston rod 39, that is, the wire clamp unit 34
is moved forward and stopped at the base of the conductor parts 3A, 3B, that is, at a position where the guide pipe 8 and the nearby double conducting wire 3 are between the clamp right piece part 35A and the clamp left part part 34A. Here, the solenoid 36 is operated to pull the plunger 36A, that is, the right clamp part 35A, and the left clamp part 34A.
The multi-conductor wire 3 is held between the clamp right-hand portion 35A and the clamp right-hand portion 35A.

After that, the air cylinder 43 is operated, and the piston rod 44, that is, the wire clamp unit 3
4 is lowered, and the double conductor wire 3 is let out from the guide pipe 8, that is, the bobbin 11, by the required length for one wire. In this state, the air cylinder 31 is operated to advance the piston rod 32, that is, the wire cutting unit 30, and cut the double conductor wire near the guide pipe 8.
is stopped at a position where it is sandwiched between the cutter upper blade portion 29A and lower blade portion 30A. Then operate the solenoid 37 to pull the cutter upper blade part 29A,
The cutter upper blade portion 29A and lower blade portion 30A are engaged to cut the double conductor wire 3. This cutting position is different from the above-mentioned wire clamping position, and as shown in FIG. It is arranged as follows. Therefore, after cutting, the next operation, ie, the first step, can be started without having to feed out the wire anew.

After cutting the line, the solenoid 37 is deactivated and the cutter upper blade 29 is returned to its original position. Subsequently, the air cylinder 31 is operated, the piston rod 32 is moved backward, and the wire cutting unit 30 is returned to its original position.

After that, or in parallel with this operation, the solenoid 36
The right piece 35 of the wire clamp is returned to its original position so that the double conductor wire with the conductor portion formed thereon can be removed, and the clamp is released. Now, take out the completed double conductor wire. Then, the air cylinder 38 is operated, the piston rod 39 is moved back, and the wire clamp unit 34 is returned to its original position. Finally, the air cylinder 43 is operated to raise the piston rod 44 and return the wire clamp unit 34 to its original height.

1, 2, and 3 each show the state before operation, that is, in the original position. The above is an explanation of the operation of the present invention, but the details of how to manually operate this series of operations and sequences while checking each operation, or to configure a control circuit sequence so that the entire process is performed automatically are not explained in detail. Although not described here, this can be easily done using normal means.

Effects of the Invention The present invention has the following advantages.

(1) Conventionally, the coating film was removed one by one under a magnifying glass, and the conductor parts were spread out in parallel to the required spacing by hand to form them, but with the present invention, this is all done. It can be mechanized and done automatically.

(2) By automating manual tasks, work time can be significantly reduced, and humans can be freed from having to perform extremely detailed and tiring tasks.

(3) Automation makes it possible to obtain double-conductor conductors with a more accurate finish and a constant shape compared to manual work, resulting in stable quality and easy and reliable connection to the head chip terminals. Therefore, the overall yield can be improved.

[Brief explanation of the drawing]

Fig. 1 is an overall front view showing an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a perspective view for explaining a line cutting unit and a line clamp unit, and Fig. 4 is an embodiment of the invention. A diagram for explaining the principle, FIG. 5 is a diagram for explaining details of the lead tangential surface of a completed chip of a thin film magnetic head for a flying type computer, and FIG. 6 is a diagram for explaining the state of a double conductor wire. FIG. 7 is a diagram showing the lead connection state of a completed chip of a thin film magnetic head for a flying type computer, and FIG. 8 is a diagram for explaining the outline of the process of the present invention. 1...Head chip, 2...Conductor layer terminal part, 3
...Double conductor wire (lead wire), 3A, 3B...Conductor part,
3C... Insulating film, 6A, 6B... Nozzle, 7...
Rotating shaft, 8... Guide pipe, 9... Molding mold, 9A
...Mold tip, 29...Cutter upper blade, 29
A... Upper blade part, 30... Line cutting unit, 30
A...Lower blade part, 34...Wire clamp unit,
34... Left piece part, 35... Line clamp right piece, 3
5A...Right side part.

Claims (1)

[Scope of Claims] 1. A conductor forming method in which a multi-conductor wire made of parallel ultrafine wires coated with an insulating resin is pre-formed in order to be connected to a required electrode terminal, the method comprising peeling off the coating film at the end of the multi-conductor wire. A coating film removal step in which the coating film is removed by spraying or spraying an agent (liquid), and then a cleaning liquid and a drying fluid are sequentially sprayed to clean and dry the coating film removed part of the double conductor wire; The process of rotating the double conductor wire at high speed around the center of rotation, and using the centrifugal force to separate the two closely parallel conductors of the double conductor wire from which the double coating film has been removed, and widening the distance between them.
A mold is placed between the main conductors, a fluid stream is injected onto the two conductors and the mold, and the two conductors are made to follow the shape of the mold, making the two conductors parallel to each other at the required distance. The process of forming, grasping the end of the double conductor wire on the molded side, letting out the wire by one length, and cutting the other end to obtain one double conductor wire of the required length, and cutting at the same time. 1. A method for forming a conductive wire, comprising the step of feeding out and cutting a double conductor wire in which the latter end is used as a coating film removal portion of the next double conductor wire. 2. A conductor forming device that preforms a multi-conductor wire made of parallel ultra-fine wires double-covered with insulating resin in order to connect it to a required electrode terminal, and means for sequentially paying out the multi-conductor wire stored in a bobbin or the like; A rotating means for causing each double conductor paying out means to rotate at high speed with the paid out double conductor as a rotation center, a means for spraying or spraying a coating film stripping agent on the tip of the double conductor fed out, and a means for spraying a cleaning liquid and a drying fluid. ,
A means for drawing out a mold for shaping the two conductors of the double conductor in parallel at a required interval and causing it to approach or retreat from the double conductor, and a means for injecting a fluid stream to press the conductor against the mold and form it. A conductor forming device characterized by having means for grasping the end of the formed conductor and feeding out a required length of one double conductor, and means for cutting the other end of the fed double conductor. .