JPH0241907Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a turret-type electronic component retrieval device in which a container for accommodating electronic components is fixed to the tip of a swingable arm.

Conventional technology Ultra-small electronic components, for example, the leads of a semiconductor device having about 64 leads, are generally formed with a thickness of about 100μ, and are extremely thin and easily bent. The equipment used to handle the lead was designed to avoid bending the lead.

An example of such a device is shown in FIG. The illustrated device includes a magazine b that stores electronic components a at regular intervals in the vertical direction, an elevator mechanism c that moves the magazine b up and down, and a push rod d that pushes out the electronic components a stored in the magazine b from the magazine b. is provided on the supply side of the electronic component a..., and the electronic component a... pushed out from the magazine b by the push rod d is placed in a container f of a turret with a container f fixed at the tip of an arm e that is swingably supported. The electronic component a was received, rotated to a vertical position by the swing of the arm e along the guide rail g, and dropped into the chute h side through the opening f of the container f, which opened downward. .

An electronic component a that has fallen onto a chute h is received by a pre-stopper i, and then, by withdrawal of the pre-stopper i, it is dropped onto a measurement position stopper j. At this position, various properties are checked using an electrode k for performance measurement, and whether it is a good product or not. They were sorted into defective products or categorized.

Problems to be Solved by the Invention In the conventional electronic component removal device described above, when the container f that receives the electronic component a is rotated, an inertial force acts on the electronic component a.
sometimes shifted toward the opening f of the container f.

In particular, if the swinging speed of arm e is increased in order to shorten the working time, the positional deviation of electronic component a within container f will increase, and in extreme cases, electronic component a will protrude from container f. Therefore, it slides completely on the lead part and guide rail g, and,
As mentioned above, these lead portions were extremely thin and could bend completely.

Also, when electronic component a was dropped into chute h with container f in a vertical position, electronic component a was not stabilized within turret f, so side wall f of turret f, etc. In some cases, the lead may fall while in contact with the lead, and even in such a case, the lead may be bent.

As shown in FIG. 5, the electronic component h is mounted on the conductive land n of the resin board m, but the lead a
The bending of ... caused soldering defects during soldering.

Means for Solving the Problems The present invention was devised in view of the above-mentioned problems, and it prevents bending of the leads and makes it possible to take out electronic components. It has a turret in which a container with an opening in the swinging direction is fixed at the tip of the arm, and the electronic components stored in the container are moved to the take-out position by rotation of the arm, and the electronic components are removed from the opening of the container. In a device that is dropped and taken out, a spring material that elastically presses the electronic component is provided in the container, and a pressing member that presses the spring material and releases the electronic component is disposed at the electronic component removal position. This is a characteristic feature.

Embodiments Hereinafter, embodiments of the present invention will be described based on the drawings.

Reference numeral 1 denotes a magazine for storing electronic components 2 at regular intervals in the vertical direction, and shelf-like protrusions 1b for placing the electronic components 2 on both side walls 1a, 1a of the magazine 1 are provided in the vertical direction. They are placed inside at regular intervals.

Reference numeral 3 denotes an elevator mechanism for vertically moving the magazine 1. By vertically moving the elevator mechanism 3, the electronic components 2... stored in the magazine 1 are positioned at a predetermined height, and the electronic components 2... are moved up and down by the push rod 4. It is pushed out from magazine 1.

The electronic components 2 pushed out from the magazine 1 are received by a turret, that is, a box-shaped container 6 fixed to the tip of an arm 5 that is swingably supported, with the container 6 positioned horizontally. Then, along the guide rail 7, the arm 5 swings to a vertical position. This container 6 has only the side wall portion on the side that receives the electronic components 2 from the magazine 1 opened, and a leaf spring 8 is attached to the inner surface 6a of the upper wall. The electronic component 2 is pressed against the resin frame 2a to prevent the electronic component 2 from moving within the container 6 even when the container 6 is driven and rotated. As shown in FIG. 2, the planar shape of the leaf spring 8 is bifurcated so that it can be pressed against the resin frame 2a of the electronic component 2. In addition, two notches 6c are bored in the front part of the bottom wall 6b to allow a pressing member 9 (to be described later) to enter the inside of the container 6. It is made to open by pressing the leaf spring 8.

That is, when the container 6 rotates and reaches the vertical position, the pressing member 9 is disposed at a position where it can press the leaf spring 8, and the electronic component 2 is released from the leaf spring 8. This pressing member 9 is also formed into a bifurcated shape to match the shape of the leaf spring 8, and its tip portion is formed into a tapered shape in order to make smooth contact with the leaf spring 8.

Note that 10 is a stopper that restricts the turret 6 to a vertical position.

As a result, the leaf spring 8 is released, and the chute 11
The electronic component 2 that has fallen is caught by the pre-stopper 12 and then dropped onto the measurement position stopper 13 by the withdrawal of the pre-stopper 12.
At this position, various properties of the electronic component 2 are checked using the electrode element 14 for performance measurement, and the electronic component 2 is classified into good products, defective products, or classified into grades.

In addition, the lead 2b of the electronic component 2 is attached to the pre-stopper 12 and the measurement position stopper 13 at the frame 2a of the electronic component 2 so that the lead 2b of the electronic component 2 will not be bent even when the electronic component 2 falls onto the stoppers 12 and 13. A supporting portion (not shown) is formed to support the device.

In the device for taking out electronic components configured as described above, even when the container 6 is rotated, the electronic components 2 received in the container 6 will not be displaced within the container 6, and therefore, the electronic components 2 will not be displaced within the container 6. Part 2 lead 2
If b... contacts the guide rail 7 and bends, no accident will occur, and since the electronic component 2 is stable within the container 6, even if it falls into the chute 11, the side wall of the container 6 will not break. If the lead 2b falls while contacting the lead 6d, no accident will occur.

Therefore, a situation where the leads 2b of the electronic component 2 are bent will not occur, and even when the electronic component 2 is soldered to be placed on another board, problems such as poor soldering will not occur. It does not occur.

In the above-mentioned embodiment, the guide rail 7 is added to the requirements, but in the retrieval device according to the present invention, since the electronic component 2 is stably fixed within the turret 6, the electronic component The guide rail 7 for preventing the device from falling is unnecessary and may be omitted.

In addition, it is not necessary for the pressing member 9 to always protrude toward the vertical position of the container 6, and by configuring the pressing member 9 to protrude immediately after the container 6 is positioned vertically, electronic components can be more stably 2 can be dropped onto the chute 11 side.

Effects of the invention As is clear from the above explanation, the electronic component removal device according to the present invention can completely prevent the electronic components from moving within the turret even when the turret rotates. This allows the lead to fall stably to the chute side, and prevents the lead from coming into contact with other objects and causing damage when bent.

[Brief explanation of the drawing]

Fig. 1 is a schematic explanatory diagram showing an embodiment of the present invention, Fig. 2 is a plan view showing a state in which a leaf spring presses an electronic component, and Fig. 3 is an operation diagram showing the relationship between the leaf spring and a pressing member. , FIG. 4 is a schematic explanatory diagram showing a conventional example, and FIG. 5 is a side view showing how the electronic component is used. 1... Magazine, 2... Electronic component, 3... Elevator mechanism, 5... Arm, 6... Container, 5, 6
... Turret, 8 ... Leaf spring, 9 ... Pressing member.

Claims (1)

[Scope of utility model registration request] The tip of a swingable arm has a turret fixed to a container with an opening in the swinging direction, and the electronic components stored in the container are moved to the removal position by rotation of the arm, and the electronic components are removed from the opening of the container. In the device for removing components by dropping them, a spring material for elastically pressing the electronic components is provided in the container, and a pressing member for pressing the spring material and releasing the electronic components is arranged at the electronic component removal position. An electronic component extraction device characterized by: