JPH0242448U - - Google Patents

Info

Publication number
JPH0242448U
JPH0242448U JP1988122049U JP12204988U JPH0242448U JP H0242448 U JPH0242448 U JP H0242448U JP 1988122049 U JP1988122049 U JP 1988122049U JP 12204988 U JP12204988 U JP 12204988U JP H0242448 U JPH0242448 U JP H0242448U
Authority
JP
Japan
Prior art keywords
resin
photoelectric conversion
conversion chip
refractive index
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988122049U
Other languages
Japanese (ja)
Other versions
JPH0751800Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988122049U priority Critical patent/JPH0751800Y2/en
Publication of JPH0242448U publication Critical patent/JPH0242448U/ja
Application granted granted Critical
Publication of JPH0751800Y2 publication Critical patent/JPH0751800Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、この考案の一実施例に係るホトダイ
オードの横断面図、第２図は、同ホトダイオード
の正面図、第３図は、同ホトダイオードの外観斜
視図、第４図は、従来のホトダイオードの中央縦
断面図である。 ２・３：リード、４：ホトダイオードチツプ、
６：第１の樹脂、６ａ：入射面、７：第２の樹脂
、８：境界面。 Fig. 1 is a cross-sectional view of a photodiode according to an embodiment of the invention, Fig. 2 is a front view of the photodiode, Fig. 3 is an external perspective view of the photodiode, and Fig. 4 is a conventional photodiode. FIG. 2/3: Lead, 4: Photodiode chip,
6: first resin, 6a: entrance surface, 7: second resin, 8: boundary surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 光電変換チツプと、この光電変換チツプに導通
するリードと、前記光電変換チツプ及び前記リー
ド先端部とをモールドし、前記光電変換チツプ背
面側を入射面とする第１の樹脂と、この第１の樹
脂の屈折率より小さい屈折率を有し、前記第１の
樹脂をモールドする第２の樹脂とを備え、この第
１の樹脂と第２の樹脂との境界面を、前記光電変
換チツプ正面に対向する凹面とした光電変換素子
。 A first resin molded with a photoelectric conversion chip, a lead electrically connected to the photoelectric conversion chip, the photoelectric conversion chip and the tip of the lead, and whose entrance surface is the back side of the photoelectric conversion chip; a second resin having a refractive index smaller than the refractive index of the resin and molding the first resin, and an interface between the first resin and the second resin is placed in front of the photoelectric conversion chip. A photoelectric conversion element with opposing concave surfaces.
JP1988122049U 1988-09-17 1988-09-17 Photoelectric conversion element Expired - Lifetime JPH0751800Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988122049U JPH0751800Y2 (en) 1988-09-17 1988-09-17 Photoelectric conversion element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988122049U JPH0751800Y2 (en) 1988-09-17 1988-09-17 Photoelectric conversion element

Publications (2)

Publication Number Publication Date
JPH0242448U true JPH0242448U (en) 1990-03-23
JPH0751800Y2 JPH0751800Y2 (en) 1995-11-22

Family

ID=31369614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988122049U Expired - Lifetime JPH0751800Y2 (en) 1988-09-17 1988-09-17 Photoelectric conversion element

Country Status (1)

Country Link
JP (1) JPH0751800Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55158681A (en) * 1979-05-29 1980-12-10 Matsushita Electric Ind Co Ltd Solar cell both sides of which are illuminated
JPS6079756U (en) * 1983-11-04 1985-06-03 三洋電機株式会社 Optical semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55158681A (en) * 1979-05-29 1980-12-10 Matsushita Electric Ind Co Ltd Solar cell both sides of which are illuminated
JPS6079756U (en) * 1983-11-04 1985-06-03 三洋電機株式会社 Optical semiconductor device

Also Published As

Publication number Publication date
JPH0751800Y2 (en) 1995-11-22

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