JPH0242448U - - Google Patents

Info

Publication number
JPH0242448U
JPH0242448U JP1988122049U JP12204988U JPH0242448U JP H0242448 U JPH0242448 U JP H0242448U JP 1988122049 U JP1988122049 U JP 1988122049U JP 12204988 U JP12204988 U JP 12204988U JP H0242448 U JPH0242448 U JP H0242448U
Authority
JP
Japan
Prior art keywords
resin
photoelectric conversion
conversion chip
refractive index
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988122049U
Other languages
English (en)
Other versions
JPH0751800Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988122049U priority Critical patent/JPH0751800Y2/ja
Publication of JPH0242448U publication Critical patent/JPH0242448U/ja
Application granted granted Critical
Publication of JPH0751800Y2 publication Critical patent/JPH0751800Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第1図は、この考案の一実施例に係るホトダイ
オードの横断面図、第2図は、同ホトダイオード
の正面図、第3図は、同ホトダイオードの外観斜
視図、第4図は、従来のホトダイオードの中央縦
断面図である。 2・3:リード、4:ホトダイオードチツプ、
6:第1の樹脂、6a:入射面、7:第2の樹脂
、8:境界面。

Claims (1)

    【実用新案登録請求の範囲】
  1. 光電変換チツプと、この光電変換チツプに導通
    するリードと、前記光電変換チツプ及び前記リー
    ド先端部とをモールドし、前記光電変換チツプ背
    面側を入射面とする第1の樹脂と、この第1の樹
    脂の屈折率より小さい屈折率を有し、前記第1の
    樹脂をモールドする第2の樹脂とを備え、この第
    1の樹脂と第2の樹脂との境界面を、前記光電変
    換チツプ正面に対向する凹面とした光電変換素子
JP1988122049U 1988-09-17 1988-09-17 光電変換素子 Expired - Lifetime JPH0751800Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988122049U JPH0751800Y2 (ja) 1988-09-17 1988-09-17 光電変換素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988122049U JPH0751800Y2 (ja) 1988-09-17 1988-09-17 光電変換素子

Publications (2)

Publication Number Publication Date
JPH0242448U true JPH0242448U (ja) 1990-03-23
JPH0751800Y2 JPH0751800Y2 (ja) 1995-11-22

Family

ID=31369614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988122049U Expired - Lifetime JPH0751800Y2 (ja) 1988-09-17 1988-09-17 光電変換素子

Country Status (1)

Country Link
JP (1) JPH0751800Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55158681A (en) * 1979-05-29 1980-12-10 Matsushita Electric Ind Co Ltd Solar cell both sides of which are illuminated
JPS6079756U (ja) * 1983-11-04 1985-06-03 三洋電機株式会社 光半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55158681A (en) * 1979-05-29 1980-12-10 Matsushita Electric Ind Co Ltd Solar cell both sides of which are illuminated
JPS6079756U (ja) * 1983-11-04 1985-06-03 三洋電機株式会社 光半導体装置

Also Published As

Publication number Publication date
JPH0751800Y2 (ja) 1995-11-22

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