JPH0242478U - - Google Patents
Info
- Publication number
- JPH0242478U JPH0242478U JP12134888U JP12134888U JPH0242478U JP H0242478 U JPH0242478 U JP H0242478U JP 12134888 U JP12134888 U JP 12134888U JP 12134888 U JP12134888 U JP 12134888U JP H0242478 U JPH0242478 U JP H0242478U
- Authority
- JP
- Japan
- Prior art keywords
- guide
- guide pin
- bush
- attached
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012856 packing Methods 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Elimination Of Static Electricity (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図はこの考案による電子機器後面の取付構造の
詳細を示す図、第３図は第２図のＢ部詳細を示す
図、第４図は従来の電子機器の取付構造を示す断
面図である。
図において、１は電子機器、２はハンドル、３
はフツク、４はブツシユ、５はガイド穴、６は取
付台、７はリテーナ、８はリベツト、９はガイド
ピン、１０はブラケツト、１１はナツト、１２は
ワツシヤ、１３はネジ、１４はガイドプレート、
１５はネジ、１６は平あみ線、１７はネジ、１８
は圧着端子、１９はガイドピン、２０はフランジ
部、２１はガイド部、２２はブツシユ、２３はブ
ツシユ穴、２４はガイド穴、２５は溝部、２６は
導通パツキンである。なお各図中同一符号は同一
または相当部分を示す。
Figure 1 is a sectional view showing an embodiment of this invention, Figure 2 is a diagram showing details of the mounting structure on the rear side of an electronic device according to this invention, Figure 3 is a diagram showing details of part B in Figure 2, FIG. 4 is a sectional view showing a conventional mounting structure for electronic equipment. In the figure, 1 is an electronic device, 2 is a handle, and 3
is a hook, 4 is a bush, 5 is a guide hole, 6 is a mounting base, 7 is a retainer, 8 is a rivet, 9 is a guide pin, 10 is a bracket, 11 is a nut, 12 is a washer, 13 is a screw, 14 is a guide plate ,
15 is a screw, 16 is a flat wire, 17 is a screw, 18
19 is a crimp terminal, 19 is a guide pin, 20 is a flange portion, 21 is a guide portion, 22 is a bush, 23 is a bushing hole, 24 is a guide hole, 25 is a groove portion, and 26 is a conductive packing. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
はブラケツトを具備する取付台と、後端に形成さ
れたねじ部により上記ブラケツトに取付けられ、
かつ中央には円筒形のフランジ部を有し、さらに
前端には上記フランジ部より小さい径のガイド部
を有するガイドピンと、上記取付台の上に取付ら
れるとともに、前面には上記取付ネジと係合する
フツクが配され、かつ後面には上記ガイドピンと
適合する部位にブツシユ穴が設けられた箱状の電
子機器と、上記ブツシユ穴に装着されるとともに
、上記ガイドピンのガイド部とかん合するガイド
穴を具備し、かつ上記ガイド穴の中央に円筒状の
溝部を有するブツシユと、上記ブツシユの溝部に
装着され、かつ上記ガイドピンのガイド部の外周
面との間に触圧するように挾持されるとともに、
銀粒子をシリコンゴムに混入させた導電性ゴム材
料からなる導通パツキンとで構成したことを特徴
とする電子機器の取付構造。 The front part is equipped with a mounting screw, and the rear part is equipped with a mounting base having a bracket, and is attached to the bracket by a threaded part formed at the rear end,
and a guide pin having a cylindrical flange portion in the center and a guide portion having a smaller diameter than the flange portion at the front end, and a guide pin that is mounted on the mounting base and engages with the mounting screw on the front surface. a box-shaped electronic device having a hook arranged thereon, and a bushing hole provided on the rear surface at a portion that fits with the guide pin, and a guide that is attached to the bushing hole and engages with the guide portion of the guide pin. A bush having a hole and a cylindrical groove in the center of the guide hole, and a bush that is attached to the groove of the bush and is held in contact with the outer circumferential surface of the guide portion of the guide pin. With,
A mounting structure for electronic equipment characterized by comprising a conductive packing made of a conductive rubber material in which silver particles are mixed into silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12134888U JPH0242478U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12134888U JPH0242478U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242478U true JPH0242478U (en) | 1990-03-23 |
Family
ID=31368275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12134888U Pending JPH0242478U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242478U (en) |
-
1988
- 1988-09-16 JP JP12134888U patent/JPH0242478U/ja active Pending
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