JPH044767U - - Google Patents

Info

Publication number
JPH044767U
JPH044767U JP1990044402U JP4440290U JPH044767U JP H044767 U JPH044767 U JP H044767U JP 1990044402 U JP1990044402 U JP 1990044402U JP 4440290 U JP4440290 U JP 4440290U JP H044767 U JPH044767 U JP H044767U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
die pad
electrodes
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990044402U
Other languages
Japanese (ja)
Other versions
JP2520612Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990044402U priority Critical patent/JP2520612Y2/en
Publication of JPH044767U publication Critical patent/JPH044767U/ja
Application granted granted Critical
Publication of JP2520612Y2 publication Critical patent/JP2520612Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は本考案樹脂封止型半導体装置
の一つの実施例を説明するためのもので、第１図
は断面図、第２図は樹脂封止前における状態を示
す斜視図、第３図は樹脂封止型半導体装置の従来
例を示す断面図である。 符号の説明、１……ダイパツド、３……半導体
チツプ。 1 and 2 are for explaining one embodiment of the resin-sealed semiconductor device of the present invention. FIG. 1 is a sectional view, and FIG. 2 is a perspective view showing the state before resin encapsulation. , FIG. 3 is a sectional view showing a conventional example of a resin-sealed semiconductor device. Explanation of symbols: 1... Die pad, 3... Semiconductor chip.

Claims (1)

【実用新案登録請求の範囲】 半導体チツプ表面の電極が配置されていない領
域にダイパツドが接着された ことを特徴とする樹脂封止型半導体装置。[Claims for Utility Model Registration] A resin-sealed semiconductor device characterized in that a die pad is bonded to an area on the surface of a semiconductor chip where no electrodes are arranged.
JP1990044402U 1990-04-24 1990-04-24 Resin-sealed semiconductor device Expired - Fee Related JP2520612Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990044402U JP2520612Y2 (en) 1990-04-24 1990-04-24 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990044402U JP2520612Y2 (en) 1990-04-24 1990-04-24 Resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPH044767U true JPH044767U (en) 1992-01-16
JP2520612Y2 JP2520612Y2 (en) 1996-12-18

Family

ID=31557672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990044402U Expired - Fee Related JP2520612Y2 (en) 1990-04-24 1990-04-24 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JP2520612Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01286342A (en) * 1988-05-12 1989-11-17 Hitachi Ltd Surface mounting ultrathin type semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01286342A (en) * 1988-05-12 1989-11-17 Hitachi Ltd Surface mounting ultrathin type semiconductor device

Also Published As

Publication number Publication date
JP2520612Y2 (en) 1996-12-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees