JPH0242658A - Substrate with protective film for production of optical memory element - Google Patents

Abstract

PURPOSE:To continuously produce an optical memory element by opening apertures only in the parts of protective films corresponding to recording layers to be formed on a substrate and functioning the same as the mask to form the recording layers in a process for forming the recording layers. CONSTITUTION:Front and rear surfaces 11, 12 of the substrate 10 are respectively covered by the protective films 21, 22 and the apertures 211 are opened to the protective film 21 covering the front surface 11. The positions of the apertures 211 are set in accordance with the positions where the recording layers 111 to be formed on the substrate 10 are formed. The end parts of the substrate 10 are covered by the protective film 21. On the other hand, the protective film 22 covering the rear surface 12 of the substrate 10 is covered on the rear surface 12 over the entire surface. The need for the mask is, therefore, eliminated at the time of producing the optical memory element. The continuous production of the optical memory element is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a substrate with a protective film used for manufacturing optical memory elements such as optical cards and optical disks.

<Conventional technology> Conventional substrate with protective film for manufacturing optical memory elements (hereinafter referred to as
The substrate 10j will be simply explained with reference to FIGS. 3 to 5.

Optical memory elements are read-only ROM types such as CDs and CD-Rs.
It has been commercialized as OM and VD. Furthermore, the development of optical memory elements in which information can be written and erased is progressing rapidly.

An optical memory element such as an optical card has a recording layer 111 as a recording area formed on a substrate 10.

This recording layer 111 is irradiated with a laser beam or the like to perform reproduction or recording.

A substrate 10 on which a recording layer 111 is formed to become an optical memory element
The front and back surfaces 11 and 12 are covered with protective films 21 and 22. The protective film 21.22 is
Before forming the recording layer 111, the front and back surfaces 11 and 12 of the substrate 10 are
This is to protect it from being scratched.

The protective films 21 and 22 are peeled off from the substrate 10, and the substrate 10 is sent to an optical memory device manufacturing apparatus (see FIG. 3(a)).
reference). The substrate 10 is covered with a mask 30 in which only the portion corresponding to the recording layer 111 to be formed on the substrate 10 is opened in the manufacturing apparatus, and is sent to the recording layer forming process section 50. By this recording layer forming process section 50, a recording layer 111 is formed on the surface 11 of the substrate 10 (third
(See figure (b)). Thereafter, the substrate 10 is divided into a guide track forming process section 51 for forming guide tracks, a cutting process section 52 using a cutter (see FIG. 3(C)),
An optical memory element is obtained through a plurality of processes including a protective layer forming process section (not shown) that forms a protective layer 13 made of transparent synthetic resin.

Furthermore, if the recording layer 111 is formed without covering the surface 11 of the substrate 10 with the mask 30, the recording layer 111 will be formed over the entire surface of the substrate 10 as shown in FIG. Even if the recording layer 111 is formed on the substrate 10, the recording layer 111 is directly exposed to the outside air at the end of the substrate 10, resulting in an optical memory element with poor environmental resistance.

<Problems to be Solved by the Invention> Since the conventional mask described above is configured in a plate shape, it is impossible to continuously manufacture optical memory elements from a long sheet-shaped substrate such as a flexible substrate, for example. . Furthermore, if a mask is not used, the optical memory element will have poor environmental resistance as described above.

That is, in the conventional substrate with a protective film for manufacturing an optical memory element, a mask was an essential element.

Therefore, optical memory devices manufactured using conventional substrates with protective films for manufacturing optical memory devices have low production efficiency, and it has been difficult to reduce costs.

The present invention was devised in view of the above circumstances, and an object of the present invention is to provide a substrate with a protective film for manufacturing an optical memory element, which allows optical memory elements to be continuously manufactured from a sheet-like substrate.

Means for Solving the Problems> The surface of the substrate with a protective film for manufacturing an optical memory element according to the present invention is covered with a protective film. The protective film has an opening formed only in a portion corresponding to the recording layer to be formed on the substrate, and functions as a mask for forming the recording layer in the recording layer forming process.

<Operation> Since the protective film functions as a mask in the recording layer forming process, the recording layer is formed on the substrate only in the portions corresponding to the openings formed in the protective film.

<Example> Hereinafter, an example according to the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of a substrate with a protective film for manufacturing an optical memory device according to the present invention, and FIG. 2 shows a process for manufacturing an optical memory device using the substrate with a protective film for manufacturing an optical memory device according to the present invention. FIG. 2 is a schematic configuration diagram of the device. For convenience of explanation, the thickness of the protective film is exaggerated in FIG. 1.

The substrate 10 is made of a flexible and transparent resin, such as polycarbonate resin, and its front and back surfaces 11 and 12 are covered with protective films 21 and 22, respectively. An opening 211 is formed in the protective film 21 that covers the surface 11 of the substrate 100. The position of this opening 211 is determined by the position of the recording layer 1 formed on the substrate 10.
11 is set corresponding to the position where it should be formed,
The ends of the substrate 10 are always covered with the protective film 21.

On the other hand, a protective film 2 covering the back surface 12 of the substrate 10
2 covers the entire back surface 12.

Note that the thickness of the substrate 10 is preferably set to about 0.2 to 1.0 mm, but is not limited to this.

It is preferable that the protective films 21 and 22 have a heat resistance temperature higher than the temperature at which the recording layer 111 is formed on the substrate 10 and a coefficient of thermal expansion that is between the substrate 10 and the gap. For example, vinyl, polyethylene, nylon, duracon, polypropylene,
Among synthetic resins such as acetate, polyester, and ABS, one that satisfies the above-mentioned conditions is appropriately selected and used. Note that the thickness of this protective film 21.22 is 0.
．． Approximately 01 to 0.3 nun is preferable.

In this way, the front and back surfaces 11 and 12 are each protected by a protective film 2.
The substrate 10 covered by 1.22 is stored in a wound state around the substrate supply shaft 41 as shown in FIG. Then, the substrate 10 is processed by a recording layer forming process section 42 that forms the recording layer 111 on the surface 11 by feeding means such as rollers 45, 46, 47, a guide track forming process section 43 that forms guide tracks on the substrate 10, An optical memory element is obtained through a plurality of processes including a cutting process section 44 for cutting the substrate 10 with a cut 441 and a process for forming a protective layer using a transparent synthetic resin (not shown).

In the recording layer forming process section 42, the protective film 21 functions as a mask, so the recording layer 111 is formed on the substrate 10 only in the portion corresponding to the opening 211 by appropriate means such as sputtering or vapor deposition. That is, since the portion other than the opening 211 is covered by the protective film 21, the recording layer 111 is not formed.

In addition, in the embodiment described above, the opening 2 is provided in the protective film 21.
Although it is assumed that the opening 11 is opened in advance, it is also possible to provide a cut corresponding to the opening 211 in the protective film 21 and cut out the cut immediately before inserting the substrate 10 into the manufacturing apparatus to form the opening. In this case, there is less possibility that the substrate 10 will be contaminated.

Further, the above-mentioned four processes, that is, the recording layer forming process, the guide track forming process, the cutting process, and the protective layer forming process, are not limited to this order, and can be arbitrarily replaced.

Optical memory devices manufactured using this substrate with a protective film for optical memory device manufacturing include optical cards, optical disks, etc., and are particularly suitable for optical cards that require mass production and low cost.

<Effects of the Invention> In the substrate with a protective film for manufacturing an optical memory element according to the present invention, since the surface of the substrate is covered in advance with a protective film that functions as a mask, a mask is not required when manufacturing the optical memory element.

Therefore, if this substrate is made into a flexible substrate, it becomes possible to continuously manufacture optical memory elements, thereby increasing production efficiency and reducing costs.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of a substrate with a protective film for manufacturing an optical memory device according to the present invention, and FIG. 2 shows a process for manufacturing an optical memory device using the substrate with a protective film for manufacturing an optical memory device according to the present invention. A schematic configuration diagram of the apparatus, FIG. 3 is a schematic explanatory diagram of the manufacturing process of an optical memory device using a conventional substrate with a protective film for manufacturing an optical memory device, and FIG. 4 is a schematic diagram of the manufacturing process of a conventional optical memory device with a protective film FIG. 5 is a cross-sectional view of the optical memory element when a mask is used on the substrate, and FIG. 5 is a cross-sectional view of the optical memory element when no mask is used. DESCRIPTION OF SYMBOLS 10... Substrate, 11... Surface, 111... Recording layer, 21... Protective film, 211... Opening.

Claims (1)

[Claims] (1) In a substrate with a protective film for manufacturing an optical memory element whose surface is covered with a protective film, the protective film has an opening only in a portion corresponding to the recording layer to be formed on the substrate, and A substrate with a protective film for manufacturing an optical memory element, which functions as a mask for forming a recording layer in a process.