JPH0242704A - mutual induction coil - Google Patents

mutual induction coil

Info

Publication number
JPH0242704A
JPH0242704A JP63192512A JP19251288A JPH0242704A JP H0242704 A JPH0242704 A JP H0242704A JP 63192512 A JP63192512 A JP 63192512A JP 19251288 A JP19251288 A JP 19251288A JP H0242704 A JPH0242704 A JP H0242704A
Authority
JP
Japan
Prior art keywords
coil
mutual induction
wiring board
induction coil
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63192512A
Other languages
Japanese (ja)
Other versions
JP2594331B2 (en
Inventor
Tomio Wada
和田 富夫
Mitsuhisa Idesawa
出澤 光久
Teruhiro Satou
佐藤 照裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63192512A priority Critical patent/JP2594331B2/en
Publication of JPH0242704A publication Critical patent/JPH0242704A/en
Application granted granted Critical
Publication of JP2594331B2 publication Critical patent/JP2594331B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Coils Or Transformers For Communication (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 この発明は、各棟の電子機器に使用される相互誘導コイ
ルに関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to mutual induction coils used in electronic equipment in each building.

従来の技術 第4図は一般的な相互誘導コイルの回路図であり、 L
lは一次コイル、L2は二次コイル、Tlt。
Conventional technology Figure 4 is a circuit diagram of a general mutual induction coil, and L
l is the primary coil, L2 is the secondary coil, Tlt.

T12は一次コイルLtの端子、T21 、 T22は
二次コイルL2の端子を示す。
T12 indicates a terminal of the primary coil Lt, and T21 and T22 indicate terminals of the secondary coil L2.

第5図は第4図に示した従来の相互誘導コイルを示す断
面図であシ、1は配線基板を示し、第1゜第2.第3.
第4の半田付用ランド2,3.4および5が設けられて
いる。
FIG. 5 is a sectional view showing the conventional mutual induction coil shown in FIG. Third.
A fourth soldering land 2, 3.4 and 5 is provided.

6は一次コイルL1を示し、絶縁導体、例えばポリウレ
タン被覆銅線を円筒状に巻回して構成され、両端部分は
絶縁被覆が剥離されて第1.第2の半田付用ランド2,
3に半田7で半田付けされている。
Reference numeral 6 indicates a primary coil L1, which is constructed by winding an insulated conductor, for example, a polyurethane-coated copper wire, into a cylindrical shape, and the insulation coating is peeled off at both ends of the primary coil L1. second soldering land 2,
It is soldered to 3 with solder 7.

8は二次コイルL2を示し、絶縁導体、例えばポリウレ
タン被覆銅線を円筒状に巻回して構成され、両端部分は
絶縁被覆が剥離されて第3.第4の半田付用ランド4,
5に半田7で半田付けされている。
8 indicates a secondary coil L2, which is constructed by winding an insulated conductor, for example, a polyurethane-coated copper wire, into a cylindrical shape, and the insulation coating is peeled off at both ends, and the secondary coil L2 is formed by winding an insulated conductor such as a polyurethane-coated copper wire into a cylindrical shape. Fourth soldering land 4,
It is soldered to 5 with solder 7.

なお、−次コイル6、二次コイル8は磁気的に結合され
て配線基板lに配設されている。
Note that the secondary coil 6 and the secondary coil 8 are magnetically coupled and arranged on the wiring board l.

第6図は相互誘導コイルの他の回路図であり、第4図と
同一部分には同一符号が付しである。
FIG. 6 is another circuit diagram of the mutual induction coil, in which the same parts as in FIG. 4 are given the same reference numerals.

第6図において、Luは一部コイルを示し、二次コイル
L21の一部を共用して構成したものである。
In FIG. 6, Lu indicates a part of the coil, which is constructed by sharing a part of the secondary coil L21.

なお、この第6図は第4図に示した回路図と等価である
Note that this FIG. 6 is equivalent to the circuit diagram shown in FIG. 4.

第7図は第6図に示した従来の相互誘導コイルを示す断
面図であり、IAは配線基板を示し、第1、第2の半田
付用ランド2A 、 3Aが設けられている。
FIG. 7 is a sectional view showing the conventional mutual induction coil shown in FIG. 6, where IA indicates a wiring board, and first and second soldering lands 2A and 3A are provided.

6Aは、−次コイルLll 、二次コイルL21を構成
するコイルを示し、絶縁導体、例えばポリウレタン被覆
銅線を円筒状に巻回して構成され、コイル6Aの両端部
分は絶縁被覆が剥離されて第1゜第2の半田付用ランド
2A、3Aに半田7で半田付けされ、中間部分の絶縁被
覆が剥離されて中間タップとなるリード線9が半田7で
半田付けされている。
6A indicates a coil constituting the primary coil Lll and the secondary coil L21, and is constructed by winding an insulated conductor, for example, a polyurethane-coated copper wire, into a cylindrical shape, and the insulation coating is peeled off at both ends of the coil 6A. 1. The leads 9 are soldered to the second soldering lands 2A and 3A with the solder 7, and the insulation coating at the intermediate portion is peeled off to form the intermediate tap.

なお、コイル6への第1の半田付用ランド2Aに半田付
けされた部分からリード線9が半田付けされた部分で一
部コイルL11が構成され、コイル6Aのリード線9が
半田付けされた部分から第2の半田付用ランド3Aに半
田付けされた部分、で二次コイルL21が構成される。
Incidentally, a part of the coil L11 is formed by the part where the lead wire 9 is soldered from the part soldered to the first soldering land 2A to the coil 6, and the lead wire 9 of the coil 6A is soldered. The secondary coil L21 is comprised of the portion soldered to the second soldering land 3A.

発明が解決しようとする課題 しかしながら、上記従来の相互誘導コイルでは次のよう
な問題があった。
Problems to be Solved by the Invention However, the above-mentioned conventional mutual induction coil has the following problems.

まず、第4図、第5図に示す相互誘導コイルは、2つの
一部、二次コイル6.8によって構成されているので、
各コイル6.8のコストおよび配線基板lに各コイル6
.8を搭載するコストが高価となる。
First, since the mutual induction coil shown in FIGS. 4 and 5 is composed of two parts, the secondary coil 6.8,
The cost of each coil 6.8 and the cost of each coil 6 on the wiring board l
.. 8 becomes expensive.

そして、相互誘導コイルを構成するのに必要な配線基板
10面積が広くなり、大形化する。
Then, the area of the wiring board 10 required to configure the mutual induction coil becomes larger, and the size of the wiring board 10 becomes larger.

さらに、−次、二次コイル6.8の巻き数が少ない場合
は、各コイル6.8を配線基板1へ直立させることがで
きず、各コイル6.8の搭載が困難である。
Furthermore, if the number of turns of the negative and secondary coils 6.8 is small, each coil 6.8 cannot be made to stand upright on the wiring board 1, making it difficult to mount each coil 6.8.

次に、第6図、第7図に示す相互誘導コイルは、コイル
6Aの中間部分から中間タップ用のリード線9を引き出
すのが実際上は困難であり、コイル6Aが高価になる。
Next, in the mutual induction coil shown in FIGS. 6 and 7, it is actually difficult to draw out the lead wire 9 for the intermediate tap from the intermediate portion of the coil 6A, making the coil 6A expensive.

この発明は、このような従来の問題を解決するものであ
シ、低コストで、コイルの搭載が容易な相互誘導コイル
を提供することを目的とするものである。
The present invention is intended to solve these conventional problems, and it is an object of the present invention to provide a mutual induction coil that is low cost and easy to mount.

課題を解決するための手段 この発明は、上記目的を達成するため、第1のコイルを
配線パターンで設けた配線基板に、絶縁導体を円筒状に
巻回した第2のコイルを第1のコイルと磁気的に結合さ
せて配設したものである。
Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides a wiring board in which a first coil is provided in a wiring pattern, and a second coil in which an insulated conductor is wound in a cylindrical shape is connected to the first coil. It is arranged in such a way that it is magnetically coupled with.

作    用 したがって、この発明によれば、配線基板に設けた配線
パターンの第1のコイルと、絶縁導体で構成した第2の
コイルとが磁気的に結合され、相互誘導コイルが構成さ
れる。
Therefore, according to the present invention, the first coil of the wiring pattern provided on the wiring board and the second coil made of an insulated conductor are magnetically coupled to form a mutual induction coil.

実施例 第1図はこの発明の一実施例による相互誘導コイルを示
す断面図、第2図は配線基板に設けられだ第1のコイル
の配線パターンの平面図である。
Embodiment FIG. 1 is a sectional view showing a mutual induction coil according to an embodiment of the present invention, and FIG. 2 is a plan view of a wiring pattern of a first coil provided on a wiring board.

第1図において、11は配線基板を示し、例えば銅張紙
フエノール積層板であり、エツチングすることによって
第2図に示すような第1のコイルを形成する円形状の配
線パターン12および第1゜第2の半田付用ランド13
 、14が設けられている。
In FIG. 1, reference numeral 11 indicates a wiring board, for example, a copper-clad paper phenol laminate, and a circular wiring pattern 12 and a first coil that form a first coil as shown in FIG. 2 by etching. Second soldering land 13
, 14 are provided.

15は横置きに配置された第2のコイルを示し、絶縁導
体、例えばポリウレタン被覆銅線を円筒状に巻回して構
成され、両端部分は絶縁被覆が剥離されて第1.第2の
半田付用ランド13 、14に半田16で半田付けされ
ている。
Reference numeral 15 indicates a second coil arranged horizontally, and is constructed by winding an insulated conductor, for example, a polyurethane-coated copper wire, into a cylindrical shape, and the insulation coating is peeled off at both ends of the first coil. It is soldered to second soldering lands 13 and 14 with solder 16.

なお、第2のコイル15の絶縁被覆は機械的な切削、研
摩、熱的な溶解または化学的な溶解等の方法で剥離され
る。
Note that the insulating coating of the second coil 15 is removed by mechanical cutting, polishing, thermal melting, chemical melting, or the like.

そして、配線パターン12の第1のコイルと第2のコイ
ル15とは磁気的に結合されている。
The first coil and second coil 15 of the wiring pattern 12 are magnetically coupled.

次に、上記実施例の製作について説明する。Next, manufacturing of the above embodiment will be explained.

まず、第2のコイル15の両端部分の絶縁被覆を剥離し
、配線基板11の第1.第2の半田付用ランド13 、
14の上にペースト半田を塗布した後、第2のコイル1
5の両端部分をそれぞれ第1.第2の半田付用ランド1
3 、14の上に載せて全体を加熱、半田リフローする
と、第2のコイル15ノ両端部分は第1.第2の半田付
用ランド13 、14に半田付けされる。
First, the insulation coating on both ends of the second coil 15 is peeled off, and the first coil on the wiring board 11 is peeled off. second soldering land 13,
After applying paste solder on top of 14, the second coil 1
5, both end portions of 1. Second soldering land 1
3 and 14, heat the entire body, and reflow the solder, so that both end portions of the second coil 15 become the same as the first coil 15. It is soldered to the second soldering lands 13 and 14.

このように、上記実施例によれば、2つのコイルのうち
の1つを配線パターン12として配線基板11に設けた
ので、搭載しなければならないコイルは第2のコイル1
5のみとなるため、第2のコイル15の搭載が容易にな
るとともに、配線基板11の面積が少なくて済み、小形
化できる。
As described above, according to the above embodiment, since one of the two coils is provided on the wiring board 11 as the wiring pattern 12, the coil that must be mounted is the second coil 1.
5, it becomes easy to mount the second coil 15, and the area of the wiring board 11 can be reduced, resulting in miniaturization.

そして、中間タップ引き出し用のリード線を用いなくて
済むので、安価に製作できる。
Further, since there is no need to use a lead wire for drawing out the intermediate tap, it can be manufactured at low cost.

なお、上記実施例では、第2のコイル15を横置きに配
置した例で説明したが、第3図に示すように直立して配
置してもよく(コイル15A)また、ポリウレタン被覆
銅線で中空状に構成した例で説明したが、絶縁導体はポ
リウレタン被覆銅線以外の他のものであっても、コア入
シ、ボビンに巻回したり、モールド構造であってもよい
In the above embodiment, the second coil 15 is arranged horizontally, but it may also be arranged upright as shown in FIG. 3 (coil 15A). Although an example in which the insulated conductor is hollow has been described, the insulated conductor may be made of something other than a polyurethane-coated copper wire, or may have a cored structure, may be wound around a bobbin, or may have a molded structure.

そして、配線基板11は銅張紙フエノール積層板のエツ
チングに限定されず銀張ガラスエポキシ積層板、セラミ
ック基板等であってもよい。
The wiring board 11 is not limited to an etched copper-clad paper phenol laminate, but may also be a silver-clad glass epoxy laminate, a ceramic substrate, or the like.

また、配線基板11に配線パターン12を利用して形成
される第1のコイルは円形1円形以外、例えば正方形等
の同心状、または多層状に形成された複数巻きでもよい
Further, the first coil formed on the wiring board 11 using the wiring pattern 12 may be formed in a concentric shape other than a circular shape, such as a square shape, or a plurality of turns formed in a multilayered shape.

さらに、第1のコイルと第2のコイル15とは磁気的に
結合されていれば、第2のコイル15は配線パターン1
2の真上からずれた位置に配置してもよい。
Further, if the first coil and the second coil 15 are magnetically coupled, the second coil 15 is connected to the wiring pattern 1.
It may be placed at a position shifted from directly above 2.

そして、第2のコイル15の両端部分の配線基板11へ
の接続方法は、面付方法ではなく、挿入方法等の他の方
法であってもよい。
The method of connecting both end portions of the second coil 15 to the wiring board 11 may be other methods such as an insertion method instead of the surface mounting method.

発明の効果 この発明は、上記実施例より明らかなように、第1のコ
イルを配線パターンで設けた配係基板に、絶縁導体を円
筒状に巻回した第2のコイルを第1のコイルと磁気的に
結合させて配設したので、搭載しなければならないコイ
ルは第2のコイルのみとなるため、コイルの搭載が容易
となってコイル搭載コストが安価になるという効果があ
る。
Effects of the Invention As is clear from the above-mentioned embodiments, the present invention has a second coil in which an insulated conductor is wound in a cylindrical shape on a distribution board on which a first coil is provided in a wiring pattern. Since they are arranged in a magnetically coupled manner, the only coil that needs to be mounted is the second coil, which makes mounting the coil easier and reduces the cost of mounting the coil.

そして、配線パターンを利用して形成した第1のコイル
の上部に導体を巻回して構成した第2のコイルを重ねて
配置することができるので、第2のコイルを搭載する配
線基板の面積が少なくて済むため、小形化できるととも
に、両コイルの距離を縮めることができるため、両コイ
ルの磁気的な結合を密にすることができるという効果が
ある。
In addition, since the second coil formed by winding a conductor can be placed over the first coil formed using the wiring pattern, the area of the wiring board on which the second coil is mounted can be reduced. Since the number of coils is small, the size can be reduced, and since the distance between the two coils can be shortened, there is an effect that the magnetic coupling between the two coils can be made tighter.

また、第1.第2のコイルの巻き数が少ない場合におい
て、第1のコイルが配線基板に配線パターンで設けられ
ているので、第2のコイルを直立させることができると
いう効果がある。
Also, 1st. When the number of turns of the second coil is small, since the first coil is provided in a wiring pattern on the wiring board, there is an effect that the second coil can be made to stand upright.

さらに、中間タップ付の単巻型相互誘導コイルの場合に
おいても、複巻型に等価変換して構成することができる
ので、面倒な中間タップを設ける必要がなくなり、配線
基板上に小形化して安価に構成できるという効果がある
Furthermore, even in the case of a single-turn type mutual induction coil with a center tap, it can be equivalently converted to a compound-turn type, so there is no need to provide a troublesome center tap, and it can be made smaller and cheaper on the wiring board. This has the effect that it can be configured as follows.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、この発明の一実施例による相互誘導コイルを
示す断面図、第2図は、配線基板に設けられた第1のコ
イルの配線パターンを示す平面図、第3図は、この発明
の他の実施例による相互誘導コイルを示す断面図、第4
図は、相互誘導コイルの回路図、第5図は第4図に示し
た従来の相互誘導コイルを示す断面図、第6図は、相互
誘導コイルの他の回路図、第7図は、第6図に示した従
来の相互誘導コイルを示す断面図である。 11  ・配線基板、12・・・配線パターン、13 
・・・第1の半田付用ランド、14・・・第2の半田付
用ランド、15,15A・・・第2のコイル、16・・
・半田。 代理人の氏名 弁理士 粟 野 重 孝 ほか1名第 図 第 図 第 、> Cハ
FIG. 1 is a cross-sectional view showing a mutual induction coil according to an embodiment of the present invention, FIG. 2 is a plan view showing a wiring pattern of a first coil provided on a wiring board, and FIG. 3 is a cross-sectional view showing a mutual induction coil according to an embodiment of the present invention. A cross-sectional view showing a mutual induction coil according to another embodiment of
5 is a cross-sectional view showing the conventional mutual induction coil shown in FIG. 4, FIG. 6 is another circuit diagram of the mutual induction coil, and FIG. 7 is a circuit diagram of the mutual induction coil. FIG. 7 is a sectional view showing the conventional mutual induction coil shown in FIG. 6; 11 - Wiring board, 12... Wiring pattern, 13
...First soldering land, 14...Second soldering land, 15, 15A...Second coil, 16...
·solder. Name of agent: Patent attorney Shigetaka Awano and one other person

Claims (2)

【特許請求の範囲】[Claims] (1)第1のコイルが配線パターンで設けられるととも
に、第1の半田付用ランドおよび第2の半田付用ランド
が設けられている配線基板と、絶縁導体を円筒状に巻回
し、両端部分の絶縁被覆を剥離して前記第1、第2の半
田付用ランドに半田付けするとともに、前記第1のコイ
ルと磁気的に結合させて配設した第2のコイルとを備え
た相互誘導コイル。
(1) A wiring board on which a first coil is provided in a wiring pattern, a first soldering land and a second soldering land, an insulated conductor is wound in a cylindrical shape, and both ends are a mutual induction coil having an insulating coating peeled off and soldered to the first and second soldering lands, and a second coil arranged to be magnetically coupled with the first coil. .
(2)第2のコイルは、配線基板に略直立させて配設し
たことを特徴とする請求項1記載の相互誘導コイル。
(2) The mutual induction coil according to claim 1, wherein the second coil is disposed substantially upright on the wiring board.
JP63192512A 1988-08-01 1988-08-01 Mutual induction coil Expired - Fee Related JP2594331B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63192512A JP2594331B2 (en) 1988-08-01 1988-08-01 Mutual induction coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63192512A JP2594331B2 (en) 1988-08-01 1988-08-01 Mutual induction coil

Publications (2)

Publication Number Publication Date
JPH0242704A true JPH0242704A (en) 1990-02-13
JP2594331B2 JP2594331B2 (en) 1997-03-26

Family

ID=16292520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63192512A Expired - Fee Related JP2594331B2 (en) 1988-08-01 1988-08-01 Mutual induction coil

Country Status (1)

Country Link
JP (1) JP2594331B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016131208A (en) * 2015-01-14 2016-07-21 株式会社村田製作所 Junction type coil component, coil component mounting method, and wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5131754U (en) * 1974-08-30 1976-03-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5131754U (en) * 1974-08-30 1976-03-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016131208A (en) * 2015-01-14 2016-07-21 株式会社村田製作所 Junction type coil component, coil component mounting method, and wiring board

Also Published As

Publication number Publication date
JP2594331B2 (en) 1997-03-26

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