JPH024277U - - Google Patents
Info
- Publication number
- JPH024277U JPH024277U JP8166788U JP8166788U JPH024277U JP H024277 U JPH024277 U JP H024277U JP 8166788 U JP8166788 U JP 8166788U JP 8166788 U JP8166788 U JP 8166788U JP H024277 U JPH024277 U JP H024277U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- soldering iron
- soldering
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 9
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のプリント配線板上に表面実装
部品を半田付けしている状態を要部を破断して示
す断面図、第２図は同じくプリント配線板上に表
面実装部品が位置決めされた状態を示す平面図で
ある。
１……プリント配線板、２……半田付け用ラン
ド、３……ＱＦＰ型半導体装置、３ａ……リード
端子、４……半田こて、５……糸半田、６……ダ
ミーランド。
Figure 1 is a cross-sectional view showing the surface mount components soldered onto the printed wiring board of the present invention, with the main parts cut away, and Figure 2 shows the surface mount components positioned on the printed wiring board. It is a top view showing a state. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Soldering land, 3... QFP type semiconductor device, 3a... Lead terminal, 4... Soldering iron, 5... Solder thread, 6... Dummy land.
Claims (1)
面実装部品のリードと対応するよう複数並設され
、この半田付け用ランドにリードを重ねた状態で
半田こてを順次接触させて表面実装部品が半田付
けされるプリント配線板において、前記プリント
配線板本体における半田こての送り方向側末端の
ランドより半田こての送り方向下流側に、半田こ
てが引き続き接触される半田こて離脱用ランドを
設けたことを特徴とするプリント配線板。 A plurality of soldering lands are arranged in parallel on the printed wiring board body so as to correspond to the leads of the surface mount components, and a soldering iron is successively brought into contact with the leads stacked on the soldering lands to solder the surface mount components. In the printed wiring board to be attached, a land for removing the soldering iron, which the soldering iron continues to contact, is provided on the downstream side in the feeding direction of the soldering iron from the land at the end of the printed wiring board main body on the feeding direction side of the soldering iron. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8166788U JPH024277U (en) | 1988-06-22 | 1988-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8166788U JPH024277U (en) | 1988-06-22 | 1988-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024277U true JPH024277U (en) | 1990-01-11 |
Family
ID=31306442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8166788U Pending JPH024277U (en) | 1988-06-22 | 1988-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024277U (en) |
-
1988
- 1988-06-22 JP JP8166788U patent/JPH024277U/ja active Pending