JPH0363968U - - Google Patents
Info
- Publication number
- JPH0363968U JPH0363968U JP12326789U JP12326789U JPH0363968U JP H0363968 U JPH0363968 U JP H0363968U JP 12326789 U JP12326789 U JP 12326789U JP 12326789 U JP12326789 U JP 12326789U JP H0363968 U JPH0363968 U JP H0363968U
- Authority
- JP
- Japan
- Prior art keywords
- flexible wiring
- slit
- wiring board
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000006071 cream Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の接続構造を示す斜視図であつ
て、ＰＣＢの端部に設けたスリツトにＦＰＣを挿
入する前の状態を示す図である。第２図は本考案
の接続構造を示すスリツト部の断面図であつて、
同図ａはＰＣＢ電極上にクリーム半田印刷後、ス
リツトにＦＰＣ挿入前の状態、同図ｂはＦＰＣを
ＰＣＢのスリツトに挿入し、リフロー加熱処理後
の状態を示す図である。第３図は従来の接続構造
を示す斜視図である。
符号の説明、１……フレキシブル配線基板、２
……プリント回路基板、３……チツプ部品、４…
…フレキシブル配線基板の電極、５……プリント
回路基板の電極、６……スリツト、７……貫通穴
、８……クリーム半田、９……溶融後の半田。
FIG. 1 is a perspective view showing the connection structure of the present invention, and shows the state before the FPC is inserted into the slit provided at the end of the PCB. FIG. 2 is a sectional view of the slit portion showing the connection structure of the present invention,
Figure a shows the state after cream solder is printed on the PCB electrode and before the FPC is inserted into the slit, and Figure b shows the state after the FPC is inserted into the slit of the PCB and reflow heat treatment is performed. FIG. 3 is a perspective view showing a conventional connection structure. Explanation of symbols, 1...Flexible wiring board, 2
...Printed circuit board, 3...Chip parts, 4...
... Electrode of flexible wiring board, 5 ... Electrode of printed circuit board, 6 ... Slit, 7 ... Through hole, 8 ... Cream solder, 9 ... Solder after melting.
Claims (1)
続するための接続構造であつて、プリント回路基
板の少なくとも１つの端面にフレキシブル配線基
板の端部を挿入できるスリツトを形成し、かつプ
リント回路基板上前記端面付近に複数の電極を互
いに平行に配置し、これら電極の各々に上記スリ
ツトに通じる貫通穴を形成し、前記フレキシブル
配線基板はその端部の電極保持面が前記スリツト
に挿入できるようにつくり、その挿入後に行うリ
フロー加熱処理によつて前記貫通孔内に濡れ拡が
る溶融半田が、プリント回路基板上の電極と、前
記フレキシブル配線基板端部に設けられた複数の
電極との電気的接続を行うように構成したことを
特徴とするフレキシブル配線基板の接続構造。 A connection structure for connecting a flexible wiring board to a printed circuit board, wherein a slit into which an end of the flexible wiring board can be inserted is formed on at least one end surface of the printed circuit board, and a slit is formed on the printed circuit board near the end surface. A plurality of electrodes are arranged parallel to each other, a through hole is formed in each of these electrodes leading to the slit, and the flexible wiring board is made so that the electrode holding surface at the end thereof can be inserted into the slit. The molten solder that wets and spreads in the through hole by the reflow heat treatment performed electrically connects the electrodes on the printed circuit board and the plurality of electrodes provided at the ends of the flexible wiring board. A flexible wiring board connection structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12326789U JPH0710515Y2 (en) | 1989-10-21 | 1989-10-21 | Flexible wiring board connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12326789U JPH0710515Y2 (en) | 1989-10-21 | 1989-10-21 | Flexible wiring board connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0363968U true JPH0363968U (en) | 1991-06-21 |
| JPH0710515Y2 JPH0710515Y2 (en) | 1995-03-08 |
Family
ID=31671254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12326789U Expired - Lifetime JPH0710515Y2 (en) | 1989-10-21 | 1989-10-21 | Flexible wiring board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710515Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5879663B2 (en) * | 2013-05-07 | 2016-03-08 | 住友電工プリントサーキット株式会社 | Printed wiring board for hard disk device and hard disk device |
-
1989
- 1989-10-21 JP JP12326789U patent/JPH0710515Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710515Y2 (en) | 1995-03-08 |