JPH0242794A - Method of soldering parts - Google Patents
Method of soldering partsInfo
- Publication number
- JPH0242794A JPH0242794A JP19267088A JP19267088A JPH0242794A JP H0242794 A JPH0242794 A JP H0242794A JP 19267088 A JP19267088 A JP 19267088A JP 19267088 A JP19267088 A JP 19267088A JP H0242794 A JPH0242794 A JP H0242794A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder
- component
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は部品のハンダ付方法、とくに電子機器に使用さ
れる部品を印刷配線板にハンダ付する部品のハンダ付方
法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for soldering parts, and particularly to a method for soldering parts used in electronic equipment to a printed wiring board.
（従来の技術）
第６図には、従来技術により電子部品４を印刷配線板ｌ
にハンダ付したときの側断面図が示されている１部品４
は、金属ケース５に覆われており、端子７およびその動
作特性上根元までハンダ付する必要のある端子６を有す
る。印刷配線板ｌは、端子６が挿入されるスルーホール
８および端子７が挿入される非スルーホール９が穿設さ
れている。印刷配線板１はまた、ハンダ付される部分に
導体２のパターンが電着され、ハンダ付されない部分に
はハンダレジスト３がコーティングされている。部品４
をたとえばハンダ槽に浸すことにより印刷配線板ｌにハ
ンダ付すると、部品４の下面とこれと向かい合う印刷配
線板ｌの上面とがハンダｌＯにより密着した状態でハン
ダ付される。(Prior art) FIG.
Part 4 shows a side cross-sectional view when soldered to
is covered with a metal case 5, and has a terminal 7 and a terminal 6 that needs to be soldered to its base due to its operating characteristics. The printed wiring board 1 has through holes 8 into which the terminals 6 are inserted and non-through holes 9 into which the terminals 7 are inserted. The printed wiring board 1 also has a pattern of conductors 2 electrodeposited on the parts to be soldered, and a solder resist 3 is coated on the parts not to be soldered. Part 4
When soldered to the printed wiring board l by immersing it in a solder bath, for example, the lower surface of the component 4 and the upper surface of the printed wiring board l facing it are soldered in a state in which they are in close contact with each other by the solder lO.
（発明が解決しようとする課題）
このような従来技術による部品のハンダ付方法では、部
品４の下面とこれと向かい合う印刷配線板ｌの上面とが
密着した状態でハンダ付される。(Problems to be Solved by the Invention) In the component soldering method according to the prior art, the lower surface of the component 4 and the upper surface of the printed wiring board l facing the component 4 are soldered in close contact with each other.
このため、ハンダ槽に浸しただけではスルーホール８内
の空気が抜けず、空気がスルーホール８内に残り、ハン
ダ１０が端子の根元まで届かない。部品４は、端子４が
根元までハンダ付されることを想定して動作設計されて
いるため、このようなハンダ付では動作特性が安定しな
い。したがって、端子４の根元までハンダ付されていな
いときには、人手により印刷配線板１に追加ハンダ付す
ることにより端子４の根元までハンダ付するか、もしく
は端子４の根元までハンダ付けしたのと同等の動作特性
を得るため印刷配線板ｌに金属ケース５を人手により追
加ハンダ付しなければならない。For this reason, the air in the through hole 8 will not escape just by immersing it in the solder bath, the air will remain in the through hole 8, and the solder 10 will not reach the base of the terminal. Since the operation of the component 4 is designed on the assumption that the terminal 4 will be soldered to the base, the operation characteristics will not be stable with such soldering. Therefore, if the terminal 4 is not soldered to the base, the terminal 4 may be soldered to the base by additional soldering on the printed wiring board 1 manually, or the terminal 4 may be soldered to the base of the terminal 4. In order to obtain operational characteristics, the metal case 5 must be additionally soldered to the printed wiring board l by hand.
また、スルーホール８内の空気を抜き端子４の根元まで
ハンダ１０を届かせようとすると、部品４が印刷配線板
１より浮き上がってしまうため、ハンダ付不良が発生し
やすくなる。第７図にはハンダ付不良の側断面図が示さ
れている。同図に示すようなハンダ付不良が発生すると
、ハンダ１０は金属ケース５の下面を伝わり端子７の方
に流れる。Furthermore, if the air in the through hole 8 is removed and the solder 10 is made to reach the base of the terminal 4, the component 4 will rise above the printed wiring board 1, making soldering defects likely to occur. FIG. 7 shows a side sectional view of defective soldering. When a soldering failure as shown in the figure occurs, the solder 10 flows along the lower surface of the metal case 5 toward the terminal 7.
これにより、端子６と７との間にハンダブリッジが生じ
るため、これを取り除く改修作業をやはり人手により行
なわなければならなかった。As a result, a solder bridge is formed between the terminals 6 and 7, and repair work to remove this must be performed manually.
このように従来技術ではハンダ槽に浸すだけでは完全に
ハンダ付されないため、人手により追加ハンダ付を行な
う組立工数が多くなる。またハンダブリッジが容易に発
生するため品質の維持が難しく、検査および改修による
組立工数が増えるという問題点があった。As described above, in the conventional technology, soldering is not completed by simply immersing the device in a soldering bath, and therefore the number of assembly steps for additional soldering increases manually. In addition, solder bridges easily occur, making it difficult to maintain quality and increasing assembly man-hours due to inspection and repair.
本発明はこのような従来技術の欠点を解消し、人手によ
り追加ハンダ付を行なう組立工数を削減し、ハンダブリ
ッジの発生を防止する部品のハンダ付方法を提供するこ
とを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for soldering components that eliminates the drawbacks of the prior art, reduces the number of assembly steps required for additional manual soldering, and prevents the occurrence of solder bridges.
（課題を解決するための手段および作用）本発明は上述
の課題を解決するために、根元までハンダ付する必要の
ある端子を有する部品を、印刷配線板にハンダ付する部
品のハンダ付方法であり、部品を印刷配線板に取り付け
る際、部品の端子を除く部分と印刷配線板との間に、ハ
ンダになじまない材料を含む間隙形成材を介挿して間隙
を形成する工程と、部品を印刷配線板にハンダ付し、間
隙に端子の根元までハンダを浴する工程とを含む。(Means and effects for solving the problems) In order to solve the above-mentioned problems, the present invention provides a component soldering method for soldering a component having a terminal that needs to be soldered to the root to a printed wiring board. Yes, when attaching a component to a printed wiring board, there is a process in which a gap is formed by inserting a gap-forming material containing a material that is not compatible with solder between the part of the component excluding the terminals and the printed wiring board, and a process in which the component is printed. The method includes the steps of soldering to a wiring board and applying solder to the gaps up to the bases of the terminals.
（実施例）
次に添付図面を参照して本発明による部品のハンダ付方
法の実施例を詳細に説明する。(Example) Next, an example of the method for soldering parts according to the present invention will be described in detail with reference to the accompanying drawings.
第１図を参照すると、本発明による部品のハンダ付方法
の第１実施例により、印刷配線板１に部品４をハンダ付
したときの側断面図が示されている。部品４は、端子６
および７を有するたとえば電子部品であり、金属ケース
５などの導電性材質で覆われている。なお端子６は、部
品４の動作特性上、その根元までハンダ付する必要があ
る。Referring to FIG. 1, there is shown a side sectional view when a component 4 is soldered to a printed wiring board 1 according to a first embodiment of the component soldering method according to the present invention. Part 4 is terminal 6
and 7, and is covered with a conductive material such as a metal case 5. Note that the terminal 6 needs to be soldered to its base due to the operating characteristics of the component 4.
印刷配線板１は、部品４などの電子部品がハンダ付され
る基板であり、絶縁材料に導体２のパターンが形成され
ている。また、印刷配線板１には同図に示すようにハン
ダレジスト３が形成され、部品４をハンダ付した場合、
レジスト３により導体２の所望の部分にのみハンダｌＯ
が融着される。印刷配線板１はさらに、端子６が挿入さ
れるスルーホール８、および端子７が挿入される非スル
ーホール９が穿設されている。両面粘着テープ１１は、
部品４と印刷配線板１とを接合する適度な厚みを有する
テープであり、これにより部品４と印刷配線板ｌとの間
に適切な間隙１２が形成される。粘着テープ】１はまた
、端子６と７との間にハンダブリッジが発生しないよう
に部品４と印刷配線板ｌとの間に配設される。The printed wiring board 1 is a board to which electronic components such as components 4 are soldered, and has a pattern of conductors 2 formed on an insulating material. Further, as shown in the figure, a solder resist 3 is formed on the printed wiring board 1, and when parts 4 are soldered,
Apply solder lO only to the desired part of the conductor 2 using the resist 3.
are fused. The printed wiring board 1 further has through holes 8 into which the terminals 6 are inserted, and non-through holes 9 into which the terminals 7 are inserted. The double-sided adhesive tape 11 is
This is a tape having an appropriate thickness that joins the component 4 and the printed wiring board 1, thereby forming an appropriate gap 12 between the component 4 and the printed wiring board 1. Adhesive tape 1 is also placed between component 4 and printed wiring board 1 to prevent solder bridges from occurring between terminals 6 and 7.
部品４の端子６および７をそれぞれ印刷配線板１のスル
ーホール８および非スルホール９に挿入し、印刷配線板
１と部品４との間にテープ１１を挟着すると、部品４の
金属ケース５の下面と印刷配線板１との間には同図に示
すように間隙１２が形成される。また、このとき端子６
と７の間は両面粘着テープ１１で塞がれている。このた
め、部品４が印刷配線板ｌに取付けられた状態で印刷配
線板１がたとえばハンダ槽に浸されると、スルーホール
８内にハンダ１０が浸透することにより、スルーホール
８内の空気が間隙１２を通りスルーホール８ノ外に抜け
、スルーホール８内にハンダ１０が充填する。スルーホ
ール８内に充填したハンダ１０はさらに、金属ケース５
の下面部、すなわち端子６の根元まで達し、部品４を印
刷配線板１にハンダ付する。また、両面粘着テープＩＩ
で部品４が印刷配線板ｌに粘着されているため印刷配線
板ｌより浮き上がることはなく、この両面粘着テープ１
１により端子６と７との間が塞がれているため、ハンダ
１０が端子６から端子７へ流れてゆかずハンダブリッジ
も発生しない。When terminals 6 and 7 of component 4 are inserted into through holes 8 and non-through holes 9 of printed wiring board 1, and tape 11 is sandwiched between printed wiring board 1 and component 4, metal case 5 of component 4 is inserted. A gap 12 is formed between the lower surface and the printed wiring board 1, as shown in the figure. Also, at this time, terminal 6
The space between and 7 is closed with double-sided adhesive tape 11. Therefore, when the printed wiring board 1 is immersed in, for example, a solder bath with the component 4 attached to the printed wiring board l, the solder 10 permeates into the through holes 8, and the air inside the through holes 8 is removed. The solder 10 passes through the gap 12 and exits the through hole 8, filling the inside of the through hole 8. The solder 10 filled in the through hole 8 is further inserted into the metal case 5.
, and the component 4 is soldered to the printed wiring board 1. Also, double-sided adhesive tape II
Since component 4 is adhered to printed wiring board l, it will not rise above printed wiring board l, and this double-sided adhesive tape 1
1 closes the space between the terminals 6 and 7, the solder 10 does not flow from the terminal 6 to the terminal 7, and no solder bridge occurs.
第２図には、本発明の第２実施例により、印刷配線板１
に部品４をハンダ付したときの側断面図が示されている
。同実施例では、部品４を印刷配線板１にハンダ付した
ときに、印刷配線板１と部品４の金属ケース５との間に
間隙１２が形成されるとともにハンダブリッジが端子間
に発生しないように印刷配線板１にシルク印刷１５が施
されている。また、部品４の端子６および７は、それぞ
れスルホール８および非スルーホール９に挿入された後
、部品４がハンダ付の際に浮き上がらないようにたとえ
ば外側に折り曲げられる。このため、同実施例によりハ
ンダ付した場合でも１部品４が印刷配線板１より浮き上
がることはなく、シルク印刷１５により端子６の根元ま
でハンダ付されるとともに端子６と７との間にハンダブ
リッジが発生しない、したがって同実施例でも第１実施
例と同様の効果を得ることができる。FIG. 2 shows a printed wiring board 1 according to a second embodiment of the present invention.
A side cross-sectional view is shown when the component 4 is soldered. In this embodiment, when the component 4 is soldered to the printed wiring board 1, a gap 12 is formed between the printed wiring board 1 and the metal case 5 of the component 4, and a solder bridge is not generated between the terminals. A silk printing 15 is applied to a printed wiring board 1. Further, after the terminals 6 and 7 of the component 4 are inserted into the through hole 8 and the non-through hole 9, respectively, they are bent, for example, outward so that the component 4 does not come up during soldering. Therefore, even when soldering is performed using the same embodiment, one component 4 will not be lifted from the printed wiring board 1, and the silk printing 15 will allow soldering to the base of the terminal 6, and a solder bridge will be formed between the terminals 6 and 7. Therefore, the same effect as in the first embodiment can be obtained in this embodiment.
第３図には、本発明の第３実施例による部品４の側断面
図が示されている。同実施例は同図に示すように部品４
の金属ケース５の下面に粘着テープ１Ｂを貼りつけたも
のである。また同実施例では、部品４を印刷配線板１に
挿入した後、第２実施例と同様に部品４が印刷配線板１
より浮き上がらないように端子６および７を外側に曲げ
る。このため、同実施例によりハンダ付した場合でも、
部品４が印刷配線板１より浮き上がることはない。また
、テープ１６により端子６側に間隙が形成されるため端
子６の根元までハンダ付されるとともに、このテープ１
８により端子６と７との間にハンダブリッジが発生しな
い、したがって同実施例でも第２実施例と同様の効果を
得ることができる。FIG. 3 shows a side sectional view of a component 4 according to a third embodiment of the invention. In this embodiment, as shown in the figure, part 4 is
An adhesive tape 1B is attached to the lower surface of the metal case 5. Further, in the same embodiment, after the component 4 is inserted into the printed wiring board 1, the component 4 is inserted into the printed wiring board 1 as in the second embodiment.
Bend terminals 6 and 7 outward so that they do not lift up. Therefore, even if soldered according to the same example,
The component 4 does not rise above the printed wiring board 1. In addition, since a gap is formed on the terminal 6 side by the tape 16, the terminal 6 can be soldered to the base, and this tape 1
8, a solder bridge does not occur between the terminals 6 and 7. Therefore, this embodiment can also achieve the same effect as the second embodiment.
第４図には、本発明による部品のハンダ付方法の第４実
施例による部品４の側断面図が示されている。同実施例
では、第３実施例の粘着テープ１８の代わりに絶縁スペ
ーサ１７を部品４の金属ケース５の下面と印刷配線板１
との間に挟んだものである。同実施例の場合にも、部品
４を印刷配線板１に挿入した後、第２実施例と同様に部
品４が印刷配線板１より浮き上がらないように端子６お
よび７を外側に曲げる。このため、同実施例により部品
４を印刷配線板１にハンダ付した場合でも、第３実施例
と同様の効果を得ることができる。FIG. 4 shows a side sectional view of a component 4 according to a fourth embodiment of the method for soldering components according to the invention. In this embodiment, an insulating spacer 17 is placed between the lower surface of the metal case 5 of the component 4 and the printed wiring board 1 instead of the adhesive tape 18 of the third embodiment.
It is sandwiched between. In the same embodiment, after the component 4 is inserted into the printed wiring board 1, the terminals 6 and 7 are bent outward so that the component 4 does not rise above the printed wiring board 1, as in the second embodiment. Therefore, even when the component 4 is soldered to the printed wiring board 1 according to the same embodiment, the same effects as in the third embodiment can be obtained.
第５図には、本発明による部品のハンダ付方法の第５実
施例により、印刷配線板ｌに部品１８をハンダ付したと
きの一部側断面図が示されている。FIG. 5 shows a partial side sectional view when a component 18 is soldered to a printed wiring board 1 according to a fifth embodiment of the component soldering method according to the present invention.
部品１８は、たとえば２つの端子２０および動作特性上
根元までハンダ付する必要のある端子１９を有する３端
子の電子部品であり、金属ケース５の代わりにたとえば
合成樹脂などのプラスチックケース２１により覆われて
いる。同実施例では、部品１８の下面に両面粘着テープ
１１が同図に示すように貼られる。これにより１間隙１
２が端子１９側に形成されるとともに部品１８が印刷配
線板ｌより浮き上がることもない。また両面粘着テープ
１１は端子間のハンダブリッジが発生しないよう端子間
を塞ぐように配設されている。同実施例では、ケース２
１がプラスチックのため部品１日の下面にハンダは付か
ないが、この場合にも端子１９の根元までハンダ付され
、かつ粘着テープ１１により端子１９と２０との間のハ
ンダブリッジを防止する効果を第１実施例と同様に得る
ことができる。The component 18 is a three-terminal electronic component having, for example, two terminals 20 and a terminal 19 that must be soldered to the base due to its operating characteristics, and is covered with a plastic case 21 made of synthetic resin instead of the metal case 5. ing. In this embodiment, double-sided adhesive tape 11 is attached to the lower surface of component 18 as shown in the figure. This allows 1 gap 1
2 is formed on the terminal 19 side, and the component 18 does not rise above the printed wiring board l. Further, the double-sided adhesive tape 11 is placed so as to close the spaces between the terminals so that solder bridges between the terminals do not occur. In the same example, case 2
1 is made of plastic, so no solder is applied to the bottom surface of the component 1, but in this case too, the base of the terminal 19 is soldered, and the adhesive tape 11 has the effect of preventing solder bridges between the terminals 19 and 20. It can be obtained in the same manner as in the first embodiment.
（発明の効果）
このように本発明によれば、印刷配線板をハンダ槽に浸
すだけで間隙により端子の根元までハング付できるとと
もに、端子間のハンダブリッジも防止できる。このため
、人手により追加ハンダ付を行なう組立工数が不要とな
り、また検査および改修による組立工数増の問題点を防
ぐこともできる、したがって本発明により部品を印刷配
線板にハンダ付すれば、動作特性に優れ、かつ信頼性の
高い製品を安価に提供することができる。(Effects of the Invention) As described above, according to the present invention, by simply dipping the printed wiring board in a solder bath, it is possible to hang up to the base of the terminals due to the gaps, and it is also possible to prevent solder bridging between the terminals. This eliminates the need for assembly man-hours for additional manual soldering, and also prevents the problem of increased assembly man-hours due to inspection and repair. It is possible to provide products with excellent performance and high reliability at low cost.
第１図は本発明による部品のハンダ付方法の第１実施例
によりハンダ付したときの側断面図、第２図は本発明の
第２実施例によりハンダ付したときの側断面図、
第３図は本発明の第３実施例による部品の側断面図、
第４図は本発明の第４実施例による部品の側断面図、
第５図は本発明の第５実施例によりハンダ付したときの
一部側断面図、
第６図は従来技術によりハンダ付したときの側断面図、
第７図は従来技術によりハンダ付したときのハンダ不良
例を示す側断面図である。
主要部分の符号の説明
１１１１０．印刷配線板
１．１００．導体
０１１１．、ハンダレジスト
＋８．、、、、部品
３．１００．金属ケース
７．１９，２０． 、端子
１６０１０．スルーホール
１６９０６．非スルホール
・・・・・・″ンダ
０１０００９両面粘着テープ
６１０９１９間隙
・・・・・、シルク印刷
２６００４．粘着テープ
９１１０９．絶縁スペーサ
０１９０１．プラスチックケース
特許出願人 沖電気工業株式会社
代 理 人 香取 孝雄
火山 隆夫
ｙｆ１２芙色伊いミリへン９”ＡＲｆ−、−乙Ｉ（貧１
町両第 ２ 図
石１寅も＄１ ＋＝ Ｌ ｋ３ハン７゛付したｔ’２ｑ
ｆ嗟′１町１幻第 １ｖ！Ｊ
全６３９芝 ３キ４、イクＩ Ｉミ る 部品 ・）
狙’ｓ ａデｒｈ第３図
も４実尭卸Ｓ口仰品町１１伺幻
第４ 図
１？
名５宍、オヒ」使い；工′１１＼ンγ−イＡしに乙きり
イｖ°（喧句第 ５ 図
促東改付１：より昌ンｒイ牛しＲしさ−１ｆｌ’Ｉ Ｑ
第６ 図
友東更財１号５１＼ンγ不えり便ｔｑｉ第γ図FIG. 1 is a side sectional view when soldering is performed according to the first embodiment of the method for soldering parts according to the present invention, FIG. 2 is a side sectional view when soldering is performed according to the second embodiment of the present invention, and FIG. The figure is a side sectional view of a component according to a third embodiment of the present invention, FIG. 4 is a side sectional view of a component according to a fourth embodiment of the present invention, and FIG. 5 is a side sectional view of a component according to a fifth embodiment of the present invention. FIG. 6 is a side sectional view when soldering is performed using the conventional technique. FIG. 7 is a side sectional view showing an example of a defective solder when soldering is performed using the conventional technique. Explanation of symbols of main parts 11110. Printed wiring board 1.100. Conductor 0111. , solder resist +8. , , , Part 3.100. Metal case 7.19,20. , terminal 16010. Through hole 16906. Non-through hole...''nda 010009 Double-sided adhesive tape 610919 Gap...Silk printing 26004.Adhesive tape 91109.Insulating spacer 01901.Plastic case Patent applicant Oki Electric Industry Co., Ltd. Agent Takao Katori Volcano Takao yf12 dark blue color 9”ARf-,-Otsu I (poor 1
Town Ryodai 2nd figure stone 1 tiger also $1 += L k3 han 7゛ t'2q
f 嗟'1 town 1 phantom 1v! J All 639 Shiba 3 Ki 4, Iku I Miru Parts ・)
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Figure 6 Tomo Tosarazai No. 1 51\nγFeribintqi Figure γ
Claims (1)
印刷配線板にハンダ付する部品のハンダ付方法において
、該方法は、 前記部品を前記印刷配線板に取り付ける際、該部品の前
記端子を除く部分と該印刷配線板との間に、ハンダにな
じまない材料を含む間隙形成材を介挿して間隙を形成す
る工程と、 前記部品を前記印刷配線板にハンダ付し、前記間隙に前
記端子の根元までハンダを浴する工程とを含むことを特
徴とする部品のハンダ付方法。[Claims] A component having a terminal that needs to be soldered to the root,
In a method for soldering components to a printed wiring board, the method includes: when attaching the component to the printed wiring board, a portion of the component other than the terminal is placed between the printed wiring board and a part of the component that is compatible with the solder. a step of forming a gap by inserting a gap forming material containing a material that does not contain the material; and a step of soldering the component to the printed wiring board and applying solder to the gap up to the base of the terminal. How to solder parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19267088A JPH0242794A (en) | 1988-08-03 | 1988-08-03 | Method of soldering parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19267088A JPH0242794A (en) | 1988-08-03 | 1988-08-03 | Method of soldering parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242794A true JPH0242794A (en) | 1990-02-13 |
Family
ID=16295091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19267088A Pending JPH0242794A (en) | 1988-08-03 | 1988-08-03 | Method of soldering parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242794A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015103566A (en) * | 2013-11-21 | 2015-06-04 | 三菱電機株式会社 | Semiconductor device and method for manufacturing semiconductor device |
| JP5832607B1 (en) * | 2014-08-12 | 2015-12-16 | ファナック株式会社 | Printed wiring board |
| JP2019187990A (en) * | 2018-04-27 | 2019-10-31 | 株式会社三共 | Game machine |
-
1988
- 1988-08-03 JP JP19267088A patent/JPH0242794A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015103566A (en) * | 2013-11-21 | 2015-06-04 | 三菱電機株式会社 | Semiconductor device and method for manufacturing semiconductor device |
| JP5832607B1 (en) * | 2014-08-12 | 2015-12-16 | ファナック株式会社 | Printed wiring board |
| US9374897B2 (en) | 2014-08-12 | 2016-06-21 | Fanuc Corporation | Printed wiring board |
| JP2019187990A (en) * | 2018-04-27 | 2019-10-31 | 株式会社三共 | Game machine |
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