JPH0242808A - Manufacture of piezoelectric oscillating parts - Google Patents

Abstract

PURPOSE:To automatically insert a piezoelectric substrate between a supporting piece and an intermediate lead terminal without using a printed board by temporarily holding the piezoelectric substrate with the supporting piece from a pair of lead terminals and the tip part of the intermediate lead terminal and executing electric connection. CONSTITUTION:A pair of lead terminals 12' and 13' and an intermediate lead terminal 14' are led-out in one side of a band-shaped coupling part 11 with causing the terminal 14' to be middle. The terminals 12' and 13' has protruded supporting parts 21 and 22 from an intermediate part in a length-wise direction toward the closed parts of respective other edges in the side of a piezoelectric substrate 1. The supporting pieces 21 and 22 are abutted to the main surface side of the substrate 1 and the tip part of the terminal 14' is abutted to the back side of the substrate 1. Then, the length-wise tip parts of the terminals 12' and 13' are abutted to electrodes 4 and 5, which are faced and drawn-out from the main surface side of the substrate 1, and temporarily held with sandwiching the substrate 1. The respective tip parts of the terminals 12' and 13' are adhered to the electrodes 4 and 5 by a solder 23 and the tip part of the terminal 14' is adhered to a common drawing electrode 6 on the back of the substrate 1 by the solder 23 respectively conductively.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing piezoelectric vibrating components such as resonators and filters, and more particularly relates to an improvement in the method for attaching lead terminals to piezoelectric vibrating components.

Two methods of manufacturing a piezoelectric ceramic filter in which filter elements using an energy-trapped thickness-shear vibration mode are connected in two stages and are constructed on a single piezoelectric substrate are shown in FIGS. 1 and 2, respectively. .

As shown in FIG. 1, the piezoelectric ceramic filter is arranged in the vicinity of each end of the opposing sides on the surface side, which is one main surface of a piezoelectric ceramic plate (hereinafter referred to as a piezoelectric plate) l. It has lead electrodes 4 and 5 of the vibrating part main bodies 2 and 3 that are drawn out. Further, the piezoelectric ceramic filter has a common connection between the vibrating body bodies 2 and 3, which is drawn out to a position between the other end portions of the side sides on the back surface, which is the other main surface of the piezoelectric substrate l. It has an extraction electrode 6. The extraction electrode 4.5 and the common extraction electrode 6 are connected to one end of copper foils 8.9 and 10 provided on the printed circuit board 7 by solder or conductive paint, respectively, and the piezoelectric substrate l is attached to the printed circuit board 7. . Then, the printed circuit board 7 is sandwiched between the tip ends of the lead terminals 12, 13 and 14 which protrude in a comb-teeth shape from one side of the band-shaped coupling member +1.
2° 13 and 14 are soldered to the other ends of the copper foils 8.9 and 10, respectively. After that, the lead terminal 12.
138 and 14 are separated from the coupling member 11 at the positions shown by two-dot chain lines, and the lead terminals 12, 13 and 14 are attached to the piezoelectric substrate l, respectively.

In FIG. 1, reference numeral 15 denotes a slit for preventing interference between the vibrating section bodies 2.3.

In this case, a printed circuit board 7 is required in addition to the piezoelectric substrate 1, and the back surface of the piezoelectric substrate 1 comes into contact with the above-mentioned printed circuit board 7, damping the vibrations of the vibrating section bodies 2 and 3, resulting in poor characteristics. There was a problem that it was easy to

In order to solve the above problem, as shown in FIG. 2, the protruding length of the lead terminals 12 and 13 is increased, and the tips thereof are shaped like the copper foils 8 and 9 of the printed circuit board 7 in FIG. year,
The above lead terminal 12. is attached to the extraction electrode 4.5 of the piezoelectric substrate l.
It is also conceivable that the printed circuit board 7 may be omitted by directly connecting the terminals 13 with soldering or conductive paint.

However, in this case, even if the piezoelectric substrate 1 is inserted between the three lead terminals 12, 138, and 14, the piezoelectric substrate 1 receives the moment due to the spring force of the lead terminals 12, 13, and 14, and There was a problem in that the piezoelectric substrate 1 fell off from 12, 13 and 14, and the piezoelectric substrate 1 could not be inserted by an automatic machine.

An object of the present invention is to provide a method for manufacturing a piezoelectric vibrating component that enables insertion of a piezoelectric substrate into a lead terminal by an automatic machine without using a printed circuit board.

Therefore, in the present invention, two sets of vibrating parts are formed on a piezoelectric substrate having a substantially rectangular shape, and an extraction electrode drawn out from each of the vibrating parts on one main surface side of the piezoelectric substrate is attached to the piezoelectric substrate. The two sides are pulled out near one end of each of the two opposing sides on one main surface side, and the two sides are placed at one position between the other ends of the sides on the other main surface of the piezoelectric substrate.
A common extraction electrode is drawn out from the vibrating part of the set,
A pair of lead terminals connected to the lead electrodes on the one main surface side and drawn out along each side, and an intermediate lead terminal drawn out from the common lead electrode almost parallel to the pair of lead terminals. A method for manufacturing a piezoelectric vibrating component having the above-described method, wherein the pair of lead terminals and the intermediate lead terminal are pulled out to one side of the band-shaped joint with the intermediate lead terminal in between, and first portions protruding from the intermediate portion toward the vicinity of each other end of the side edges of the piezoelectric substrate;
A lead terminal member having a supporting piece and a second supporting piece is prepared, and the first supporting piece and the second supporting piece are brought into contact with the same main surface side of the piezoelectric substrate, and the tip of the intermediate lead terminal is brought into contact with the same main surface side of the piezoelectric substrate. part is brought into contact with the other main surface of the piezoelectric substrate to temporarily hold the piezoelectric substrate between them, and the pair of lead terminals are respectively connected to the extraction electrodes on one main surface side of the piezoelectric substrate, and the intermediate lead The present invention is characterized in that after the terminals are connected to the common extraction electrode, the pair of lead terminals and the intermediate lead terminal are separated from the joint portion.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

An embodiment in which the present invention is applied to the piezoelectric ceramic filter described in FIG. 2 will be described with reference to FIG.

Note that in FIG. 3, parts corresponding to those in FIG. 2 are designated by corresponding reference numerals, and redundant explanation will be omitted.

First, a lead terminal member 31 as shown in FIG. 3 is prepared.

The lead terminal member 31 is connected to an extraction electrode 4.5 drawn out to each end of two opposing sides of one main surface of the piezoelectric substrate l having a substantially square shape, and It has a pair of lead terminals 12', 13' drawn out along the sides, and an intermediate lead terminal 14' drawn out from the common lead electrode 6 substantially parallel to the pair of lead terminals 12', 13'. The pair of lead terminals 12', 13' and the intermediate lead terminal 14'
is pulled out to one side of the band-shaped joint 11 with this intermediate lead terminal 14' in between. Above-pair lead terminal 1
2', 13' are the piezoelectric substrate 1 from the middle part in the longitudinal direction.
It has a first support piece 21 and a second support piece 22 that respectively protrude toward the vicinity of the other ends of the sides.

The first support piece 21 and the second support piece 22 are connected to the piezoelectric substrate 1.
At the same time, the tip of the intermediate lead terminal 14' is brought into contact with the other main surface of the piezoelectric substrate 1, and is temporarily held with the piezoelectric substrate 1 sandwiched therebetween.

The tips of the lead terminals 12' and 13' are adhered to the lead electrodes 4 and 5 on the surface of the piezoelectric substrate l, respectively, with solder 23, 23, and the intermediate lead terminals 1
The tip end portion 4' is electrically conductively bonded to the common extraction electrode 6 on the back surface of the piezoelectric substrate l by solder 23.

Although not shown in detail, the outside of the piezoelectric substrate 1 is coated with an elastic material such as silicone rubber to ensure the vibration of the vibrating parts bodies 2 and 3 of the piezoelectric substrate 1, and a resin film made of epoxy powder resin is coated thereon. After forming the lead terminals 12', 1
3' and the intermediate lead terminal 14' are separated from the lead terminal coupling member 11 at the position shown by the two-dot chain line.

In this way, before the lead terminals 12', 13' and the intermediate lead terminal 14' are soldered, the piezoelectric substrate l is placed on its bidirectional surface so that the first supporting piece of the lead terminals 12', 13' 21 and second support piece 22 and intermediate lead terminal 1
4' and is temporarily held.

Therefore, the piezoelectric substrate 1 is manufactured by an automatic machine without using the printed circuit board 7 as shown in FIG.
．． 22 and the distal ends of the intermediate lead terminals 14' to temporarily hold them.

Note that the supporting pieces 21 and 22 of the lead terminals 12' and 13' and the tip of the intermediate lead terminal 14' are attached to the piezoelectric substrate l from the back side and front side of the piezoelectric substrate l, respectively, as shown in FIG. It may also be held in place.

The present invention can be widely applied to piezoelectric vibrating components such as resonators in addition to magnetic filters.

As is clear from the above detailed description, according to the present invention, the first and second support pieces respectively protrude from the longitudinally intermediate portion of a pair of lead terminals, and the distal end portion of the intermediate lead terminal. Since the piezoelectric board is temporarily held in place and electrical connections are made between the lead terminals and intermediate lead terminals, the piezoelectric board can be inserted between the support piece and the intermediate lead terminals using an automatic machine without using a printed circuit board. This makes it possible to reduce the number of piezoelectric vibrating parts and automate assembly.

[Brief explanation of the drawing]

1 and 2 are explanatory diagrams, respectively, of a conventional method for manufacturing a piezoelectric vibrating component, and FIG. 3 and FIG. 4 are explanatory diagrams, respectively, of two embodiments of a method for manufacturing a piezoelectric vibrating component according to the present invention. . ■...Piezoelectric substrate, 2.3...Vibration unit main body. 4.5.6... Extraction electrode, 11... Coupling member. 12', 13'...Lead terminals. 14'...Intermediate lead terminal. 21.22...First and second support pieces. 23...Solder, 31...Lead terminal member. Patent applicant Murata Manufacturing Co., Ltd. Representative Patent attorney Aoyama Haji and two others Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] (1) Two sets of vibrating parts are formed on a piezoelectric substrate having a roughly rectangular shape, and an extraction electrode drawn out from each vibrating part on one main surface side of the piezoelectric substrate is connected to one main surface of the piezoelectric substrate. A common vibrator is pulled out from the two sets of vibrating parts near one end of each of the two opposite sides of the piezoelectric substrate, and at a position between the other ends of the two sides on the other main surface of the piezoelectric substrate. A pair of lead terminals are drawn out and connected to the lead electrodes on the one main surface side, respectively, and a pair of lead terminals are drawn out along each of the sides, and a pair of lead terminals are connected to the lead electrodes from the common lead electrode. A method for manufacturing a piezoelectric vibrating component having an intermediate lead terminal pulled out substantially parallel to the above, the pair of lead terminals and the intermediate lead terminal being pulled out to one side of a band-shaped joint with the intermediate lead terminal in between, First projecting portions protrude from the longitudinally intermediate portions of the pair of lead terminals toward the vicinity of each other end of the side edges of the piezoelectric substrate.
A lead terminal member having a supporting piece and a second supporting piece is prepared, and the first supporting piece and the second supporting piece are brought into contact with the same main surface side of the piezoelectric substrate, and the tip of the intermediate lead terminal is brought into contact with the same main surface side of the piezoelectric substrate. part is brought into contact with the other main surface of the piezoelectric substrate to temporarily hold the piezoelectric substrate between them, and the pair of lead terminals are respectively connected to the extraction electrodes on one main surface side of the piezoelectric substrate, and the intermediate lead A method for manufacturing a piezoelectric vibrating component, comprising: connecting the terminals to a common extraction electrode, and then separating the pair of lead terminals and the intermediate lead terminal from the coupling portion.