JPH057889B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing piezoelectric vibrating components such as resonators and filters, and more particularly to an improvement in a method for attaching lead terminals of piezoelectric vibrating components.

Two piezoelectric ceramic filters in which filter elements using an energy-trapped thickness-shear vibration mode are connected in two stages and are constructed on a single piezoelectric substrate.
Two manufacturing methods are shown in FIGS. 1 and 2, respectively.

The piezoelectric ceramic filter described above, as shown in FIG.
The lead electrodes 4 and 3 of the vibrating body main bodies 2 and 3 are respectively drawn out near one end of the opposing sides on the front side, which is the first main surface of the piezoelectric ceramic plate (hereinafter referred to as piezoelectric plate) 1. 5. Further, the piezoelectric ceramic filter has a second main surface of the piezoelectric substrate 1, and a common part of the vibrating section bodies 2 and 3 drawn out to a position between the other ends of the sides on the back surface. It has an extraction electrode 6. The extraction electrodes 4 and 5 and the common extraction electrode 6 are connected to one end of each of copper foils 8, 9 and 10 provided on the printed circuit board 7 by solder or conductive paint, and the piezoelectric substrate 1 is attached to the printed circuit board 7. . Then, the printed circuit board 7 is sandwiched between the tips of the lead terminals 12, 13, and 14 that protrude in a comb-teeth shape from one side of the band-shaped coupling member 11.
2, 13 and 14 as above copper foils 8, 9 and 10
Solder each other end of each. Thereafter, the lead terminals 12, 13 and 14 are separated from the coupling member 11 at the positions indicated by the two-dot chain lines, and the lead terminals 1
2, 13 and 14 are attached to the piezoelectric substrate 1, respectively.

In addition, in FIG. 1, 15 indicates the vibrating section main body 2,
3. This is a slit to prevent mutual interference.

In this case, a printed circuit board 7 is required in addition to the piezoelectric substrate 1, and the back surface of the piezoelectric substrate 1 comes into contact with the printed circuit board 7, damping the vibrations of the vibrating section bodies 2 and 3, resulting in poor characteristics. There was a problem that it was easy to

In order to solve the above problem, as shown in FIG. 2, the protruding length of the lead terminals 12, 13 is increased, and the tip ends are shaped like the copper foils 8, 9 of the printed circuit board 7 in FIG. It is also conceivable to connect the lead terminals 12 and 13 directly to the extraction electrodes 4 and 5 of the piezoelectric substrate 1 by soldering or conductive paint, thereby omitting the printed circuit board 7.

However, in this case, even if the piezoelectric substrate 1 is inserted between the three lead terminals 12, 13, and 14, the piezoelectric substrate 1 receives the moment due to the spring force of the lead terminals 12, 13, and 14, and the lead terminals 12, 13, and 14, and the piezoelectric substrate 1 could not be inserted by an automatic machine.

An object of the present invention is to provide a method for manufacturing a piezoelectric vibrating component that enables insertion of a piezoelectric substrate into a lead terminal by an automatic machine without using a printed circuit board.

Therefore, in the present invention, two sets of vibrating parts are formed on a piezoelectric substrate having a substantially rectangular shape, and two sets of vibrating parts are formed on the first main surface side of the piezoelectric substrate, and two sets of vibrating parts are formed on two opposite sides of the first main surface side of the piezoelectric substrate. An extraction electrode is drawn out from the two sets of vibrating parts near one end of each side, and an electrode is drawn out from the two sets of vibrating parts near one end of each side, and the second electrode is drawn out at a position between each other end of the two sides on the second main surface side of the piezoelectric substrate. A common lead electrode is drawn out from the set of vibrating parts, and a pair of lead terminals are respectively connected to the lead electrodes on the first main surface side and drawn out along the two sides; A method for manufacturing a piezoelectric vibrating component having an intermediate lead terminal connected to an extraction electrode and pulled out substantially parallel to the pair of lead terminals, the pair of lead terminals and the intermediate lead terminal having the intermediate lead terminal in between. a first support piece and a second support piece that are pulled out to one side of the band-shaped joint and project from a longitudinally intermediate portion of the pair of lead terminals toward the vicinity of each other end of the two sides; A lead terminal member having a lead terminal member is prepared, the first support piece and the second support piece are brought into contact with either one of the first and second main surfaces, and the tip of the intermediate lead terminal is The piezoelectric substrate is temporarily held in contact with the other of the first and second main surfaces, and the pair of lead terminals are respectively connected to the extraction electrodes on the first main surface side; After the intermediate lead terminal is connected to the common extraction electrode, the pair of lead terminals and the intermediate lead terminal are separated from the joint portion.

Embodiments of the present invention will be described below with reference to the accompanying drawings.

An embodiment in which the present invention is applied to the piezoelectric ceramic filter described in FIG. 2 will be described with reference to FIG.

Note that in FIG. 3, parts corresponding to those in FIG. 2 are designated by corresponding reference numerals, and redundant explanation will be omitted.

First, a lead terminal member 31 as shown in FIG.
Prepare.

The lead terminal member 31 includes two parts facing each other on the first main surface of the piezoelectric substrate 1 having a substantially rectangular shape.
A pair of lead terminals 12', 1 are connected to lead electrodes 4, 5 drawn out at one end of each of the two sides, and drawn out along the two sides, respectively.
3' and an intermediate lead terminal 14' drawn out from the common lead-out electrode 6 substantially parallel to the pair of lead terminals 12' and 13'. The pair of lead terminals 12', 13' and the intermediate lead terminal 1
4' is pulled out to one side of the band-shaped joint 11 with this intermediate lead terminal 14' in between. The pair of lead terminals 12', 13' have a first support piece 21 and a second support piece 21, which respectively protrude from the middle portion in the longitudinal direction toward the vicinity of each other end of the side edge of the piezoelectric substrate 1.
It has a support piece 22 of.

While bringing the first support piece 21 and the second support piece 22 into contact with the first main surface side of the piezoelectric substrate 1,
The tip of the intermediate lead terminal 14' is connected to the piezoelectric substrate 1.
The piezoelectric substrate 1 is temporarily held in contact with the second main surface of the piezoelectric substrate 1 .

The tips of the lead terminals 12' and 13' are bonded to the lead electrodes 4 and 5 on the surface of the piezoelectric substrate 1 by solders 23 and 23, respectively, and the tip of the intermediate lead terminal 14' is Handa 23
Therefore, a common extraction electrode 6 on the back surface of the piezoelectric substrate 1
conductively adhere to the

Although not specifically shown, the outside of the piezoelectric substrate 1 is coated with an elastic material such as silicone rubber that ensures the vibration of the vibrating parts bodies 2 and 3 of the piezoelectric substrate 1, and is coated with an epoxy powder resin on top. After forming the resin film, the lead terminals 12', 13' and the intermediate lead terminal 14' are separated from the lead terminal coupling member 11 at the positions indicated by the two-dot chain lines.

In this way, before the lead terminals 12', 13' and the intermediate lead terminal 14' are soldered, the piezoelectric substrate 1 is connected to the lead terminals 12', 13' on its first and second main surfaces. The intermediate lead terminal 14' is sandwiched and temporarily held between the first support piece 21 and the second support piece 22 and the tip of the intermediate lead terminal 14'.

Therefore, the piezoelectric substrate 1 is manufactured by an automatic machine without using the printed circuit board 7 as shown in FIG.
It can be inserted between the distal ends of 4' and temporarily held.

Note that the support pieces 21 of the lead terminals 12' and 13'
22 and the tip of the intermediate lead terminal 14', as shown in FIG. It may also be held in place.

The present invention can be widely applied to piezoelectric vibrating components such as resonators in addition to magnetic filters.

As is clear from the above detailed description, according to the present invention, the first and second support pieces respectively protrude from the longitudinally intermediate portion of a pair of lead terminals, and the distal end portion of the intermediate lead terminal. Since the piezoelectric board is temporarily held in place and electrical connections are made between the lead terminals and intermediate lead terminals, the piezoelectric board can be inserted between the support piece and the intermediate lead terminals using an automatic machine without using a printed circuit board. This makes it possible to reduce the number of piezoelectric vibrating parts and automate assembly.

[Brief explanation of the drawing]

1 and 2 are explanatory diagrams, respectively, of a conventional method for manufacturing a piezoelectric vibrating component, and FIG. 3 and FIG. 4 are explanatory diagrams, respectively, of two embodiments of a method for manufacturing a piezoelectric vibrating component according to the present invention. . 1... Piezoelectric substrate, 2, 3... Vibrating section main body, 4,
5, 6... Extraction electrode, 11... Coupling member, 1
2', 13'... Lead terminal, 14'... Intermediate lead terminal, 21, 22... First and second support pieces, 23... Solder, 31... Lead terminal member.

Claims (1)

[Claims] 1. Two sets of vibrating parts are formed on a piezoelectric substrate having a substantially rectangular shape, and two sets of vibrating parts are formed on a first main surface side of the piezoelectric substrate, and two sets of vibrating parts are formed on two opposite sides of the first main surface side of the piezoelectric substrate. An extraction electrode is drawn out from the two sets of vibrating parts near one end of each side, and an electrode is drawn out from the two sets of vibrating parts near one end of each side, and the second electrode is drawn out at a position between each other end of the two sides on the second main surface side of the piezoelectric substrate. A common lead electrode is drawn out from the set of vibrating parts, and a pair of lead terminals are respectively connected to the lead electrodes on the first main surface side and drawn out along the two sides; A method for manufacturing a piezoelectric vibrating component having an intermediate lead terminal connected to an extraction electrode and pulled out substantially parallel to the pair of lead terminals, wherein the pair of lead terminals and the intermediate lead terminal are connected to each other with the intermediate lead terminal in between. a first support piece and a second support piece that are pulled out to one side of the band-shaped joint and project from a longitudinally intermediate portion of the pair of lead terminals toward the vicinity of each other end of the two sides; Prepare a lead terminal member having a piece, and
and a second support piece are brought into contact with one of the first and second main surfaces, and the tip of the intermediate lead terminal is brought into contact with the other of the first and second main surfaces. The pair of lead terminals were connected to the lead electrodes on the first main surface side, and the intermediate lead terminal was connected to the common lead electrode. After that, the pair of lead terminals and the intermediate lead terminal are separated from the joint portion.