JPH0243214A - Epoxy resin with highly reliable fire resistance - Google Patents
Epoxy resin with highly reliable fire resistanceInfo
- Publication number
- JPH0243214A JPH0243214A JP3049389A JP3049389A JPH0243214A JP H0243214 A JPH0243214 A JP H0243214A JP 3049389 A JP3049389 A JP 3049389A JP 3049389 A JP3049389 A JP 3049389A JP H0243214 A JPH0243214 A JP H0243214A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- novolak
- epoxy
- brominated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 29
- 229920005989 resin Polymers 0.000 claims abstract description 56
- 239000011347 resin Substances 0.000 claims abstract description 56
- 229920003986 novolac Polymers 0.000 claims abstract description 47
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 27
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 27
- 239000004593 Epoxy Substances 0.000 claims abstract description 20
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 15
- 239000003513 alkali Substances 0.000 claims abstract description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 13
- 239000003063 flame retardant Substances 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 abstract description 2
- 239000011810 insulating material Substances 0.000 abstract description 2
- 239000012778 molding material Substances 0.000 abstract description 2
- 230000009970 fire resistant effect Effects 0.000 abstract 4
- 238000007789 sealing Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 28
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 21
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 18
- 150000002989 phenols Chemical class 0.000 description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 10
- 241000238557 Decapoda Species 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000009835 boiling Methods 0.000 description 8
- 239000004843 novolac epoxy resin Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 235000011121 sodium hydroxide Nutrition 0.000 description 7
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000006735 epoxidation reaction Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 150000003944 halohydrins Chemical class 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- -1 i.e. Polymers 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000007363 ring formation reaction Methods 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000031709 bromination Effects 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010908 decantation Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 150000002085 enols Chemical class 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- DDFYFBUWEBINLX-UHFFFAOYSA-M tetramethylammonium bromide Chemical compound [Br-].C[N+](C)(C)C DDFYFBUWEBINLX-UHFFFAOYSA-M 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Fireproofing Substances (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、耐熱、高信頼性のM燃性に優れた難燃性エポ
キシ樹脂に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flame-retardant epoxy resin that is heat resistant, highly reliable, and has excellent M flame resistance.
[従来の技術]
臭素化ノボラック型エポキシ樹脂は、耐熱、難燃性に優
れた特性を有することから、とりわけ半導体の封止用樹
脂として広く用いられ、近年の電子機器の発展に大きく
貢献している。[Prior Art] Brominated novolak epoxy resins have excellent heat resistance and flame retardant properties, so they are widely used as encapsulating resins for semiconductors, and have greatly contributed to the development of electronic devices in recent years. There is.
[発明が解決しようとする課題]
しかし、ここ数年の目ざましい電子機器の進歩は、半導
体の高集積化、高密度化によるところが大きく、これは
、封止用樹脂に対して一段と厳しい品質要求として現わ
れてきている。とりわけ、高集積化、高密度化による信
頼性の向りの問題は、高耐熱化および高温煮沸下での抽
出法(PCT)による遊離ハロゲンの軽減という要求と
なって現われてきている。[Problem to be solved by the invention] However, the remarkable progress of electronic devices in recent years has largely been due to the increased integration and density of semiconductors, which has led to even stricter quality requirements for encapsulating resins. It's starting to appear. In particular, the problem of reliability due to high integration and high density has emerged as a demand for higher heat resistance and reduction of free halogen by high temperature boiling extraction method (PCT).
[課題を解決するための手段J
本発明者らは、この信頼性の向上を目指し、鋭意検討を
加えた結果、一方において、耐熱性に悪影響を及ぼす低
分子体すなわち2核体成分を減少させ、しかも、九分子
体ずなわち11核体以上のノボラックも減少させること
により、高耐熱性を有し、しかも空位な0位及びp位の
数を水酸基に対して増加させることにより臭素含右階を
増加せしめ難燃性を一段と向上さt!得ることを見い出
した。[Means for Solving the Problems J] As a result of intensive studies aimed at improving this reliability, the present inventors have, on the one hand, reduced the low-molecular substance, that is, the dinuclear component, which has an adverse effect on heat resistance. In addition, by reducing the number of novolaks, i.e., novolaks with 11 or more nuclear bodies, it has high heat resistance, and by increasing the number of vacant 0- and p-positions relative to the hydroxyl group, it has no bromine content. The flame retardance has been further improved by increasing the number of layers. I found out what I can get.
また、他方において、樹脂のエボギシ当徴を理論的な値
にできるだけ近づけた樹脂を硬化物にした場合にも上記
にいう高信頼性を有することを見い出したものである。On the other hand, we have also found that the above-mentioned high reliability can be achieved even when a cured product is made of a resin in which the epoch characteristic of the resin is as close to the theoretical value as possible.
即ち、本発明は、一方において、−最大で表わされるノ
ボラック型樹脂を臭素化し、ざらにエビハロヒドリンを
アルカリ存在下に反応させて得られる難燃性エポキシ樹
脂において、当該ノボラック型樹脂の空位な0位および
p位の数が水m &<に対して1,25〜1.45であ
り、実質的にnが1〜〜8であるノボラック型樹脂より
得られる高信頼性難燃性エポキシ樹脂に関する。これに
よれば、従来のノボラック型樹脂より得られる難燃性エ
ポキシ樹脂に較べて、高耐熱性でしがも臭素含有量の高
いH燃性エポキシ樹脂を得ることができる。That is, the present invention provides, on the one hand, a flame-retardant epoxy resin obtained by brominating a novolak-type resin represented by -maximum and reacting it with Zara-ebihalohydrin in the presence of an alkali, in which the vacant 0-position of the novolac-type resin is and a highly reliable flame-retardant epoxy resin obtained from a novolac type resin in which the number of p-positions is 1.25 to 1.45 relative to water m &<, and n is substantially 1 to 8. According to this method, it is possible to obtain an H-flammable epoxy resin that is highly heat resistant and has a high bromine content compared to flame-retardant epoxy resins obtained from conventional novolak-type resins.
また、本発明は、他方において、−最大で表わされるノ
ボラック型樹脂を臭素化し、さらにエビハロヒドリンを
アルカリ存在下に反応させて得られる難燃性エポキシ樹
脂において、平均値としてのnが1以上、好ましくは1
〜3oであり、臭素含有率をX重量%とじた場合のエポ
キシ当量1ボ4−シ樹脂にも関する。On the other hand, the present invention provides a flame-retardant epoxy resin obtained by brominating a novolak type resin represented by -maximum and further reacting shrimp halohydrin in the presence of an alkali, wherein n is preferably 1 or more as an average value. is 1
~3o, and also relates to a resin with an epoxy equivalent of 1 to 4 when the bromine content is reduced to X weight %.
前記エポキシ当ffl (y)の値は、好まIノくは従
来より、信頼性を付与する為の手段として、加水分解性
ハロゲンを軽減する方法が知られている。たとえば、特
開昭60−210615号では加水分解性臭素の軽減化
が提案されている。しかしながら、依然として、より高
信頼化を計る手段としては充分とは右えず、実際に樹脂
を硬化した時のP CTにおけるハロゲンの遊離は避け
られない。ところが、驚くべきことに本発明の上記高信
頼性難燃性エポキシ樹脂を使用した硬化物は、耐熱性の
ひとつの指標であるToの向上による信頼性の付与と同
時にPCTによるTI離ハロゲン、特に脱臭素イオンの
量を著しく減少させることができる。従って、本発明の
難燃性■ボキシ樹脂を使用すれば、i%信頼性の硬化物
を得ることができる。The value of the epoxy ffl (y) is preferably determined by a conventional method of reducing hydrolyzable halogen as a means for imparting reliability. For example, JP-A-60-210615 proposes reducing the amount of hydrolyzable bromine. However, this method is still not sufficient as a means for achieving higher reliability, and it is inevitable that halogens will be liberated from PCT when the resin is actually cured. Surprisingly, however, the cured product using the highly reliable flame-retardant epoxy resin of the present invention has improved reliability by improving To, which is one index of heat resistance, and at the same time has been shown to be resistant to TI-releasing halogens, especially by PCT. The amount of debrominated ions can be significantly reduced. Therefore, by using the flame-retardant boxy resin of the present invention, a cured product with i% reliability can be obtained.
以下、本発明の詳細な説明する。The present invention will be explained in detail below.
フェノールとホルムアルデヒドを酸又はアルカリ触媒の
存在下公知の方法で反応させて得られるフェノールノボ
ラック樹脂(軟化点70℃〜120’C)を、アセトン
及びイソプロピルエーテルの好適な混合溶媒で沈澱、分
離することにより、高分子体すなわち11核体以上の成
分が戸別される。更に、高分子体が除去された樹脂を回
収して、煮沸水下において抽出操作を行うと、低分子体
すなわち2核体成分が煮沸水側に抽出され、樹脂を戸別
、回収すると高分子体及び低分子体が除去されたフェノ
ールノボラック樹脂が得られる。この操作を1回もしく
は数回くり返し実施することにより、フェノールノボラ
ック樹脂のH−NMRによる水酸基に対する空位な0位
及びp位の数は1.25〜1.45に高められる。Precipitating and separating a phenol novolac resin (softening point 70°C to 120'C) obtained by reacting phenol and formaldehyde in the presence of an acid or alkali catalyst by a known method with a suitable mixed solvent of acetone and isopropyl ether. By this, polymer bodies, that is, components having 11 or more nuclear bodies, are separated. Furthermore, when the resin from which the polymer has been removed is collected and extracted under boiling water, the low molecular weight, or dinuclear component, is extracted into the boiling water, and when the resin is collected from house to house, the polymer is removed. A phenol novolac resin from which low molecular weight substances have been removed is obtained. By repeating this operation once or several times, the number of vacant 0-positions and p-positions relative to hydroxyl groups of the phenol novolac resin as determined by H-NMR is increased to 1.25 to 1.45.
かくして得られるフェノールノボラック樹脂を公知の方
法たとえば特公昭50−10635号公報に記載されて
いる方法により臭素化し、臭素化フェノールノボラック
樹脂溶液を得る。かくして得られた臭素化フェノールノ
ボラック樹脂溶液は、そのままあるいは必要により樹脂
を回収後、エビハロヒドリンとアルカリの存在下公知の
方法によりエポキシ化され、容易に本発明の臭素化フェ
ノールノボラックエポキシ樹脂(ガ燃性エポキシ樹脂)
を得ることができる。The phenol novolak resin thus obtained is brominated by a known method, for example, the method described in Japanese Patent Publication No. 10635/1983, to obtain a brominated phenol novolak resin solution. The thus obtained brominated phenol novolac resin solution is epoxidized as it is or after recovering the resin if necessary, by a known method in the presence of shrimp halohydrin and an alkali to easily convert the brominated phenol novolac epoxy resin of the present invention (flammable Epoxy resin)
can be obtained.
他方、上記したように高分子体および低分子体を除去し
なかったフェノールノボラック樹脂を同様に臭素化、エ
ポキシ化して粗臭素化フェノールノボラックエボキシ樹
脂(M燃性1ボキシ樹脂)とした場合には、エポキシ化
の反応の過程で形成されたエポキシ基とフェノール性水
M基との間で一部反応を生じ、高分子体が生成する。こ
れは、エボ4シ樹脂のエポキシ当ωの増大の要因となっ
ている。従って、前記粗臭素化フェノールノボラックエ
ボキシ樹脂から、このような副反応物を除去することに
よってエポキシ5口を低下させることができる。On the other hand, when the phenol novolac resin from which the high molecular weight and low molecular weight substances have not been removed as described above is similarly brominated and epoxidized to produce a crude brominated phenol novolac epoxy resin (M-flammable 1-boxy resin), A partial reaction occurs between the epoxy group formed during the epoxidation reaction and the phenolic water M group, and a polymer is produced. This is a factor in increasing the epoxy equivalent ω of the Evo4 resin. Therefore, by removing such side reactants from the crude brominated phenolic novolac epoxy resin, the epoxy 5-unit content can be reduced.
そこで、上記で得られた粗臭素化フェノールノボラック
エボギシ樹脂をアセトン及びイソプロピルエーテルの好
適な混合溶媒で沈澱、分11Tることにより比較的高分
子体の成分を除去した樹脂を回収する。回収した樹脂を
更に煮沸水下において抽出操作を実施して耐熱性に悪影
響を及ぼす比較的低分子体の成分を煮沸水側に抽出し、
樹脂を戸別、回収する。これらの操作を1回もしくは数
回くり返し実施することにより、本発明の高信頼性臭素
化フェノールノボラックエポキシ樹脂(fl燃性エポキ
シ樹脂)を得ることができる。Therefore, the crude brominated phenol novolac epoxy resin obtained above is precipitated with a suitable mixed solvent of acetone and isopropyl ether for 11 hours to recover a resin from which relatively high molecular weight components have been removed. The recovered resin is further subjected to an extraction operation under boiling water to extract relatively low-molecular components that have a negative effect on heat resistance into the boiling water.
Collect resin door-to-door. By repeating these operations once or several times, a highly reliable brominated phenol novolak epoxy resin (fl flammable epoxy resin) of the present invention can be obtained.
臭素化およびエポキシ化の前後において高分子体J3よ
び低分子体を除去するいずれの場合にあっても、エポキ
シ化は、常法に従い、臭素化ノボラック型樹脂と、臭素
化ノボラック型樹脂の水酸基当間に対して過剰七ル部の
エビハロヒドリンとをテトラメチルアンモニラムク0リ
ド、テトラメチルアンモニウムプロミド、トリエチルア
ンモニウムクロリドなどの第4級アンモニ・クム塩また
は水酸化プトリウム、水酸化カリウムなどのアルカリ金
属水酸化物などの存在下で反応させることによって行な
うことができる。第4級アンエニウム塩などを用いた場
合は開環付加反応の段階で反応がとまるので次いで上記
アルカリ金属水酸化物を加えて閉環反応させる。Regardless of whether the polymer J3 and the low molecular weight substance are removed before or after bromination and epoxidation, the epoxidation is carried out in accordance with a conventional method to remove the brominated novolac type resin and the hydroxyl groups of the brominated novolac type resin. Excess amount of shrimp halohydrin and quaternary ammonium salts such as tetramethylammonium chloride, tetramethylammonium bromide, triethylammonium chloride or alkali metals such as putrium hydroxide, potassium hydroxide, etc. This can be carried out by reacting in the presence of a hydroxide or the like. When a quaternary anenium salt or the like is used, the reaction stops at the stage of the ring-opening addition reaction, so the alkali metal hydroxide is then added to carry out the ring-closing reaction.
また最初からアルカリ金属水酸化物を加えて反応する場
合は、開環付加反応および閉環反応を一気に行わI!得
る。In addition, when reacting by adding an alkali metal hydroxide from the beginning, the ring-opening addition reaction and the ring-closing reaction are performed at once.I! obtain.
エビへ〇ヒドリンの使用割合は臭素化ノボラック型樹脂
の水酸基当用1に対して通常1〜50モル、好ましくは
3〜15モルの範囲である。The proportion of shrimp hydrin used is usually 1 to 50 moles, preferably 3 to 15 moles per 1 mole of hydroxyl group in the brominated novolak resin.
エビへ〇ヒドリンとしては、エピクロルヒドリン、エピ
ブロムヒドリン等が使用できる。As the shrimp hydrin, epichlorohydrin, epibromohydrin, etc. can be used.
アルカリ金属水酸化物の使用酸は臭素化ノボラック型樹
脂の水III塁当J11に対して通常0.8〜1.5モ
ル、好ましくは0,9〜1.3モルの範囲であり、第4
級アンモニウム塩を使用する場合その使用義は臭素化ノ
ボラック型樹脂の水酸基当針1に対して通常0.00T
〜1モル、好ましくはo、 oos〜0.5モルの範囲
である。The amount of the alkali metal hydroxide used is usually 0.8 to 1.5 mol, preferably 0.9 to 1.3 mol, based on the water III base J11 of the brominated novolac type resin.
When using class ammonium salt, its usage is usually 0.00T per 1 hydroxyl group needle of brominated novolac type resin.
~1 mol, preferably o, oos ~ 0.5 mol.
反応温度は通常30〜130℃、好ましくは40〜80
℃である。The reaction temperature is usually 30 to 130°C, preferably 40 to 80°C.
It is ℃.
また反応で生成した水を反応系外に除去しながら反応を
進行させることもぐきる。反応終了後副生した塩を、水
洗、e過等により除去し過剰のエビへロヒドリンを留去
する。It is also possible to allow the reaction to proceed while removing water generated in the reaction from the reaction system. After completion of the reaction, by-produced salts are removed by washing with water, e-filtration, etc., and excess shrimp herohydrin is distilled off.
本発明の高信頼性難燃性エポキシ樹脂は、単独で又は他
のエポキシ化合物との併用で、通常のエポキシ樹脂と同
様に、脂肪族ポリアミン、芳香族ポリアミン、ポリアミ
ドポリアミン等のポリアミン系硬化剤、無水へキサヒド
ロフタル酸、無水メチルテトラヒドロフタル酸等の酸無
水物系硬化剤、フェノールノボラック、クレゾールノボ
ラック等のフェノール系硬化剤、三フッ化ホウ素等のル
イス酸又はそれらの塩類、ジシアンジアミド類等の硬化
剤等により硬化させることができる。又、必要に応じて
硬化促進剤、無機又は有機の充填剤等の種々の配合剤を
添加することかできる。The highly reliable flame-retardant epoxy resin of the present invention can be used alone or in combination with other epoxy compounds, as well as polyamine curing agents such as aliphatic polyamines, aromatic polyamines, and polyamide polyamines, as well as ordinary epoxy resins. Acid anhydride curing agents such as hexahydrophthalic anhydride and methyltetrahydrophthalic anhydride, phenolic curing agents such as phenol novolak and cresol novolac, Lewis acids such as boron trifluoride or their salts, dicyandiamide, etc. It can be hardened using a hardening agent or the like. Moreover, various compounding agents such as a curing accelerator and an inorganic or organic filler can be added as necessary.
本発明の難燃性エポキシ樹脂は、高信頼性の要求される
広範な分野に用いることができる。具体的には、絶縁材
料、@層板、封止材料、成型材料、複合材料等を例示す
ることができる。The flame-retardant epoxy resin of the present invention can be used in a wide range of fields requiring high reliability. Specifically, insulating materials, @layer plates, sealing materials, molding materials, composite materials, etc. can be exemplified.
[実施例〕 以下、実施例を挙げて説明する。[Example〕 Examples will be described below.
合成例1
500ccの4つロフラスコにフェノールノボラック樹
脂(日本化薬(■)、軟化点98℃、水III当tii
1069/eq) 100g及びアセトン200C
Cを仕込み、溶解する。該アセトン溶液を激しく攪拌し
ながらイソプロピルエーテル100ccを滴下する。そ
のまま30分間攪拌を続けた後、沈澱物を戸別する。Synthesis Example 1 Phenol novolac resin (Nippon Kayaku (■), softening point 98°C, water
1069/eq) 100g and acetone 200C
Charge C and dissolve. While stirring the acetone solution vigorously, 100 cc of isopropyl ether is added dropwise. After continuing to stir for 30 minutes, the precipitate was removed from house to house.
P液を減圧下で濃縮し、樹脂909を得た。得られた樹
脂を沸騰した水500cc中に仕込み、激しく攪拌する
。30分間攪拌後、デカンデージョンにより水を分離し
、得られた樹脂を再び減圧’Ft%濃縮することにより
、樹脂(A)80gを得た。The P solution was concentrated under reduced pressure to obtain resin 909. The resulting resin was poured into 500 cc of boiling water and stirred vigorously. After stirring for 30 minutes, water was separated by decandation, and the resulting resin was again concentrated under reduced pressure 'Ft% to obtain 80 g of resin (A).
得られたフェノールノボラック樹脂(A>の水Wa基に
対する空位な0位及びp位の数は1.30であった。・
ここで水酸基に対する空位な0位及びp位の数はH−N
M Rの測定により求めた。ずなわら、空位な0位、
0位1m位のプロトン数からm位のプロトン数を差し引
いた値と水酸基のプロトン数との比である。The number of vacant 0-position and p-position relative to the water Wa group of the obtained phenol novolak resin (A> was 1.30.・
Here, the number of empty positions 0 and p for the hydroxyl group is H-N
It was determined by measuring MR. Zunawara, vacant position 0,
It is the ratio of the value obtained by subtracting the number of protons at the m-position from the number of protons at the 0-1m position and the number of protons of the hydroxyl group.
なお、NMRは以下の条件により測定した。Note that NMR was measured under the following conditions.
NMR条件
NMR:日本電子ftl製J NM−GX270溶媒;
DMSO−d S温度;室温
周波数領域: 4000Hz、 Ifllu : 1
00100It、5 tdパルス間隔:2sec、積算
:20回
合成例2
合成例1のアセトンへ・インプロピルエーテルによる一
連の操作及び沸騰水による一連の操作を2回くり返すこ
とにより樹脂(B ) 60gを得た。NMR conditions NMR: JEOL FTL J NM-GX270 solvent;
DMSO-dS temperature; room temperature Frequency range: 4000Hz, Ifllu: 1
00100 It, 5 td Pulse interval: 2 sec, integration: 20 times Synthesis Example 2 By repeating the series of operations in Synthesis Example 1 using acetone and impropyl ether and the series of operations using boiling water twice, 60 g of resin (B) was obtained. Obtained.
得られたフェノールノボラック樹脂(B)の水M基に対
す−る空位な0位及び0位の数は合成例1と同様の測定
により137であった。The number of vacant 0-positions and 0-positions relative to the water M group of the obtained phenol novolac resin (B) was determined to be 137 by the same measurement as in Synthesis Example 1.
実施例1
合成例1で得られたフェノールノボラック樹脂(A)
(水酸基当l 106g/eQ) 53g及びメタノー
ル100Siを温度計、攪拌機付4つロフラスコに仕込
み、窒素ガスを吸込みながら溶解する。Example 1 Phenol novolac resin (A) obtained in Synthesis Example 1
(106 g/eQ per hydroxyl group) 53 g and 100 Si of methanol are placed in a four-bottle flask equipped with a thermometer and a stirrer, and dissolved while sucking in nitrogen gas.
これに、臭素112g(0,70モル)を反応温度25
℃〜30℃で滴下する。臭素滴下終了後、そのままの温
度′c30分間攪拌を続けた。その後、30%苛性ソー
ダ水溶液を徐々に添加し、副生じた臭化水素を中和した
。中和侵、この反応液を激しく攪拌している水5p中に
滴下し、粒状の臭素化フェノールノボラック樹脂を得た
。こうして(qられた粒状臭素化フェノールノボラック
樹脂をエピクロルヒドリン278Sj(3モル)に溶解
し、還流装置のついた反応器に仕込み、減圧下(100
#ll!IH(])で共沸脱水により系内の水分を除去
した。共沸脱水後、48%苛性ソーダ水溶液42gを6
時間で滴下した。この間、苛性シータ水溶液に含まれる
水及び反応により生成する水を減圧下(1!+OmHg
〜250amH(])で共沸脱水しながら反応温度を7
5℃〜80℃に保った。苛性ソーダ水溶液滴下終了後、
そのままの温度でさらに 1時間攪拌した。To this, 112 g (0.70 mol) of bromine was added at a reaction temperature of 25
Add dropwise at ~30°C. After the bromine dropwise addition was completed, stirring was continued for 30 minutes at the same temperature. Thereafter, a 30% caustic soda aqueous solution was gradually added to neutralize the hydrogen bromide produced as a by-product. After neutralization, this reaction solution was dropped into 5 parts of vigorously stirred water to obtain a granular brominated phenol novolac resin. The granular brominated phenol novolak resin obtained in this way (q) was dissolved in epichlorohydrin 278Sj (3 mol), charged into a reactor equipped with a reflux device, and heated under reduced pressure (100
#ll! Water in the system was removed by azeotropic dehydration using IH (]). After azeotropic dehydration, 42 g of 48% caustic soda aqueous solution was
It dripped in time. During this time, the water contained in the caustic theta aqueous solution and the water produced by the reaction were removed under reduced pressure (1!+OmHg
While azeotropically dehydrating at ~250 amH (]), the reaction temperature was increased to 7.
The temperature was maintained at 5°C to 80°C. After dropping the caustic soda aqueous solution,
The mixture was stirred for an additional 1 hour at the same temperature.
反応終了後、副生した塩を濾過し、更に、P液を水10
0gで水洗した反応液を減圧下で濃縮し、過剰のエビク
〔]ルヒドリンを追い出し、臭素化フェノール゛ノボラ
ック■ボ1ニジ樹脂(A1) 130yを得た。■ボ
キシ当量300、軟化温度93℃、臭素含有率40%で
あった。After the reaction is completed, the by-produced salt is filtered, and the P solution is diluted with 10 ml of water.
The reaction solution washed with 0 g of water was concentrated under reduced pressure to drive off excess shrimp[]ruhydrin to obtain brominated phenol novolak resin (A1) 130y. (2) The boxy equivalent was 300, the softening temperature was 93°C, and the bromine content was 40%.
実施例2
合成例1で得られたフェノールノボラック樹脂(A)5
3りを用いて、臭素88g(0,55モル)を使用した
以外は、実施例1と同様の操作を実施し、臭素化フェー
ルノボラックエポキシ樹脂(A2)110gを得た。エ
ポキシ当量263、軟化温度85℃、臭素含有率35%
であった。Example 2 Phenol novolac resin (A) obtained in Synthesis Example 1 5
The same operation as in Example 1 was carried out, except that 88 g (0.55 mol) of bromine was used, and 110 g of brominated phenovolac epoxy resin (A2) was obtained. Epoxy equivalent: 263, softening temperature: 85°C, bromine content: 35%
Met.
実施例3
合成例2で1j1られたフェノールノボラック樹脂(B
) 53gを用いて、臭素120g(0,75モル)
を使用しlζ以外は、実施例1と同様の操作を実施し、
臭素化フェノールノボラックエポキシ樹脂(B1)13
0gを得た。エポキシ当量310、軟化温度93℃、臭
素含有$43%であった。Example 3 Phenol novolac resin (B
) using 53 g, bromine 120 g (0,75 mol)
Perform the same operation as in Example 1 except for lζ using
Brominated phenolic novolak epoxy resin (B1) 13
Obtained 0g. The epoxy equivalent was 310, the softening temperature was 93°C, and the bromine content was $43%.
実施例4
合成例2で得られたフェノールノボラック樹脂(B)5
3びを用いて、臭素aag(0,55七ル)を使用した
以外は、実施例1ど同様の操作を実施し、臭素化フェノ
ールノボラックエポキシ樹脂(B2)110gを得た。Example 4 Phenol novolac resin (B) obtained in Synthesis Example 2 5
The same operation as in Example 1 was carried out except that bromine aag (0,557) was used to obtain 110 g of brominated phenol novolak epoxy resin (B2).
エポキシ当量260、軟化温度85℃、臭素含有率35
%であった。Epoxy equivalent: 260, softening temperature: 85°C, bromine content: 35
%Met.
比較例1
合成例1と同様の測定法により求められた水酸基に対す
る空位な0位及びρ位の数が1.22なる市販の7エノ
ールノボラツク樹脂(日本化薬■、軟化点98℃、水酸
基当W1106)を使用した以外は、実施例2と同様の
操作を実施し、臭素化フェノールノボラックエポキシ樹
脂(C1) 1099を得た。Comparative Example 1 A commercially available 7-enol novolak resin (Nippon Kayaku ■, softening point 98°C, hydroxyl group) in which the number of vacant 0 and ρ positions relative to the hydroxyl group determined by the same measurement method as in Synthesis Example 1 was 1.22. Brominated phenol novolac epoxy resin (C1) 1099 was obtained by carrying out the same operation as in Example 2, except for using the same W1106).
エポキシ当量268、軟化温度85℃、臭素含有率35
%であった。Epoxy equivalent: 268, softening temperature: 85°C, bromine content: 35
%Met.
実施例5および比較例2
第1表に示す割合で7エノールノボラツク(日本化薬観
、水酸基当量106、軟化温度85℃)及びクレゾール
ノボラックエポキシ樹脂(EOCN1020、エポキシ
当量201、軟化温度71℃)に実施例1,2,3.4
で得られた臭素化フェノールノボラックエポキシ樹脂(
AI>、(A2)、(B1)、(82)を配合し、2−
メチルイミダゾールを触媒に用いて加熱硬化させた。Example 5 and Comparative Example 2 7 enol novolak (Nippon Kayakukan, hydroxyl equivalent: 106, softening temperature: 85°C) and cresol novolak epoxy resin (EOCN1020, epoxy equivalent: 201, softening temperature: 71°C) in the proportions shown in Table 1. Example 1, 2, 3.4
Brominated phenolic novolac epoxy resin obtained in (
AI>, (A2), (B1), (82) are blended, 2-
It was cured by heating using methylimidazole as a catalyst.
比較例2として実施例1〜4で得られた樹脂(AI>、
(△2>、(81)、(B2)の代わりに第1表に示す
割合で比較例1で得られた樹脂(C1)を用いて加熱硬
化した。As Comparative Example 2, the resins obtained in Examples 1 to 4 (AI>,
In place of (Δ2>, (81), and (B2)), the resin (C1) obtained in Comparative Example 1 was used in the proportions shown in Table 1 and heat-cured.
以上の硬化物についてのガラス転移温度(1’+1)及
びプレッシν一・クツカー・テスト(PCT)の測定結
束を第1表に示した。Table 1 shows the glass transition temperature (1'+1) and pressure v-kutzker test (PCT) measurements of the above cured products.
なJ3、ガラス転移温度及びPCTの評価条件は次の通
りである。The evaluation conditions for J3, glass transition temperature, and PCT are as follows.
ガラス転移温度
熱機械測定装置(TMA) 二真空理1■T M −7
000
昇温速度= 2℃/ l1lin
PCTの条件
硬化物5g(粒径:60メツシユ〜80メツシユ)イオ
ン交換水50 g
180℃×20時間
分析条f[
イオンクロマト:横河北辰電気
(カラム:5AX1)
溶離液:4mH−Na Co /4mHNatlC
03除去液:0.05M・ドデシルベンゼンスルホン酸
検出:電気伝導度計
実施例6
フェノールノボラック樹脂(水酸基当5110JJ/e
Q) 53g及びメタノール100ItIlを温度計、
攪拌器付4つロフラスコに([込み、窒素ガスを吹込み
ながら溶解する。Glass transition temperature thermomechanical measuring device (TMA) Nikumu 1■TM-7
000 Temperature increase rate = 2℃/1lin PCT conditions 5g of cured product (particle size: 60 mesh to 80 mesh) ion exchange water 50g 180℃ x 20 hours Analysis column f [Ion chromatography: Yokogawa Hokushin Electric (Column: 5AX1 ) Eluent: 4mH-NaCo/4mHNatlC
03 removal liquid: 0.05M dodecylbenzenesulfonic acid detection: Electrical conductivity meter Example 6 Phenol novolac resin (5110JJ/e per hydroxyl group)
Q) 53g and 100ItIl of methanol with a thermometer,
Place the mixture in a 4-hole flask with a stirrer and dissolve while blowing nitrogen gas.
これに臭素72g(0,45モル)を反応温度25℃〜
30℃で滴下する。臭素滴下終了後、そのままの温度で
30分間攪拌を続けた。その後、30%苛性ソーダ水溶
液を徐々に添加し、中和した。To this, 72g (0.45 mol) of bromine was added at a reaction temperature of 25℃~
Add dropwise at 30°C. After the bromine dropwise addition was completed, stirring was continued for 30 minutes at the same temperature. Thereafter, a 30% aqueous sodium hydroxide solution was gradually added to neutralize the mixture.
この反応液を激しく攪拌している水5g中に滴下し、粒
状の臭素化フェノールノボラック樹脂を得た。こうして
得られた粒状臭素化フェノールノボラックa4脂をエビ
ク[1ルヒドリン27g9(3モル)に溶解し、還流装
置のついた反応器に仕込み、減圧下(100aw+H(
+)で共沸脱水により系内の水分を除去した。共沸脱水
侵、48%苛性ソーダ水溶液42りを6FR間で滴下し
た。この問、苛性ソーダ水溶液に含まれる水及び反応に
より生成する水を減圧下(150amHg〜250 l
1aHIJ)で共沸脱水しながら反応温度を75℃〜8
0℃に保った。苛性ソーダ水溶液滴下終了後、そのまま
の温度でさらに1時間攪拌した。This reaction solution was dropped into 5 g of vigorously stirred water to obtain a granular brominated phenol novolac resin. The thus obtained granular brominated phenol novolak A4 fat was dissolved in 27 g9 (3 moles) of shrimp [1 lhydrin] and charged into a reactor equipped with a reflux device, under reduced pressure (100 aw + H (
+) to remove water in the system by azeotropic dehydration. After azeotropic dehydration, 42 g of a 48% aqueous sodium hydroxide solution was added dropwise over 6 FR. In this question, the water contained in the caustic soda aqueous solution and the water produced by the reaction were removed under reduced pressure (150 amHg to 250 liters).
The reaction temperature was increased from 75°C to 8°C while azeotropically dehydrating with
It was kept at 0°C. After completing the dropwise addition of the caustic soda aqueous solution, the mixture was stirred at the same temperature for an additional 1 hour.
反応終了後、副生した塩を線通し、過剰のエピクロルヒ
ドリンを追い出し、粗臭素化フェノールノボラックエボ
キシ樹脂(El)1099を得た。After the reaction was completed, the by-produced salt was passed through the reactor to drive out excess epichlorohydrin to obtain crude brominated phenol novolak epoxy resin (El) 1099.
この樹脂のエポキシ1靖は260.臭素含有率301%
であった。The epoxy weight of this resin is 260. Bromine content 301%
Met.
得られた粗臭素化フェノールノボラックエボキシ樹脂5
0gをアセトン100dに溶解し、激しく撹拌しながら
イソプロピルエーテル100dを滴下し、高分子体を沈
澱させる。沈澱分をe過助剤などを使用してP別づる。Obtained crude brominated phenol novolac epoxy resin 5
0 g was dissolved in 100 d of acetone, and 100 d of isopropyl ether was added dropwise with vigorous stirring to precipitate the polymer. Separate the precipitate by P using an e-superior agent.
得られたe液を減圧下、濃縮して樹脂を得る。更に、得
られた樹脂を沸騰した水11中に仕込み、1時間激しく
攪拌し、低分子体を抽出する。抽出後、デカンテーショ
ンにより水を分離し、得られた樹脂を再び減圧下で濃縮
することにより、樹脂(Dl)を得た。エポキシ当ff
l 245.臭素含有率30.2%ぐあった。The obtained liquid e is concentrated under reduced pressure to obtain a resin. Further, the obtained resin is poured into boiling water 11 and stirred vigorously for 1 hour to extract low molecular weight substances. After extraction, water was separated by decantation, and the resulting resin was concentrated again under reduced pressure to obtain a resin (Dl). Epoxy ff
l 245. The bromine content was 30.2%.
実施例7
臭素88シ(0,55七ル)を使用した以外は実施例6
と同様の操作を実施しでエポキシ当fli1280.
某素含イj率34.8%の粗臭素化エポキシ樹脂(E2
)105 SJを19、さらに実施例1と同様の処理に
より高分子体、低分子体を除去して樹脂(D2)を得た
。エボ1−シ当功263.臭素含有率35.3%であっ
た。Example 7 Example 6 except that 88 bromine (0,557 yl) was used.
Perform the same operation as epoxy fli1280.
Crude brominated epoxy resin (E2) with a certain element content of 34.8%
) 105 SJ was further treated in the same manner as in Example 1 to remove polymers and low molecules to obtain resin (D2). Evo 1-Shi Tokou 263. The bromine content was 35.3%.
実施例8
臭素110g(0,69−Eル)を使用した以外は実施
例6と同様の操作を実施しでエポキシ当1302゜臭素
含有率40.1%の粗臭素化Jボキシ樹脂(E3)11
7 LJを得、さらに実施例1と同様の処理により高分
子体、低分子体を除去して樹脂(D3)を得た。エポキ
シ当1280.臭素含有率40.5%であった。Example 8 A crude brominated J-boxy resin (E3) with a bromine content of 40.1% and 1302° per epoxy was prepared in the same manner as in Example 6, except that 110 g (0,69-El) of bromine was used. 11
7 LJ was obtained, and the polymer and low molecular weight were removed by the same treatment as in Example 1 to obtain a resin (D3). Epoxy 1280. The bromine content was 40.5%.
実施例9
イソプロピルエーテルを50d使用した以外は実施例7
と同様の操作を実施して樹脂(1)4)を得た。エポキ
シ当m 270.臭素含有率351%であった。Example 9 Example 7 except that 50 d of isopropyl ether was used.
Resin (1) 4) was obtained by carrying out the same operation as above. Epoxy equivalent m 270. The bromine content was 351%.
実施例10
イソプロピルエーテルを13011!i!使用した以外
は実施例7と同様の操作を実施して樹脂(D5)を得た
。エポキシ当量258.臭素含有率35.4%であった
。Example 10 Isopropyl ether 13011! i! Resin (D5) was obtained by carrying out the same operation as in Example 7 except for using the following. Epoxy equivalent: 258. The bromine content was 35.4%.
実施例11および比較例3〜5
第2表に示す割合で7エノールノボラツク(日本化薬■
、水酸基当量106、軟化温度85℃)及びクレゾール
ノボラックエポキシ樹脂([0CN1020、エポキシ
当量201.軟化温度11℃)に実施例6〜10で得ら
れた臭素化フェノールノボラック■ボキシ樹脂(Dl)
、(D2)、(D3)、(D4)、(D5)を配合し、
2−メヂルイミダゾールを触媒に用いて加熱硬化さVた
。Example 11 and Comparative Examples 3 to 5 7-enol novolak (Nippon Kayaku ■
, hydroxyl equivalent: 106, softening temperature: 85°C) and cresol novolac epoxy resin ([0CN1020, epoxy equivalent: 201, softening temperature: 11°C), brominated phenol novolak ■boxy resin (Dl) obtained in Examples 6 to 10
, (D2), (D3), (D4), (D5),
It was heat cured using 2-medylimidazole as a catalyst.
比較例3〜5として、実施例6〜8で得られた粗臭素化
7丁ノールノボラックエボキシ樹脂(・El )、(E
2)、(E3)それぞれを用いて、第2表に示す割合
で配合して加熱硬化した。As Comparative Examples 3 to 5, crude brominated 7-Nol novolak epoxy resins (・El) and (E
2) and (E3) were blended in the proportions shown in Table 2 and cured by heating.
以上の硬化物についてのガラス転移温度(T(1)及び
ブレッシ1r−・クツカー・テスh(PCT)の測定結
束を第2表に示した。Table 2 shows the measurements of the glass transition temperature (T(1)) and Bresch 1r- Kutzker-Tess (PCT) of the above cured products.
なお、ガラス転移温度及びPCTの評価条件は実施例5
と同じである。The glass transition temperature and PCT evaluation conditions are as in Example 5.
is the same as
[発明の効果]
本発明によれば、第1表および第2表から明らかなよう
に、耐熱性に優れ、Brイオンの脱離間を軽減した高信
頼性の硬化物を得ることができる。[Effects of the Invention] According to the present invention, as is clear from Tables 1 and 2, it is possible to obtain a highly reliable cured product that has excellent heat resistance and reduces the time between desorption of Br ions.
Claims (2)
ハロヒドリンをアルカリ存在下に反応させて得られる難
燃性エポキシ樹脂において、当該ノボラック型樹脂の空
位なo位およびp位の数が水酸基に対して1.25〜1
.45であり、実質的にnが1〜8であるノボラック型
樹脂より得られる高信頼性難燃性エポキシ樹脂。(1) In a flame-retardant epoxy resin obtained by brominating a novolac-type resin represented by the general formula ▲There are mathematical formulas, chemical formulas, tables, etc.▼ and further reacting epihalohydrin in the presence of an alkali, the vacancies in the novolac-type resin are The number of o-position and p-position is 1.25 to 1 with respect to the hydroxyl group.
.. 45, and a highly reliable flame-retardant epoxy resin obtained from a novolak type resin in which n is substantially 1 to 8.
ハロヒドリンをアルカリ存在下に反応させて得られる難
燃性エポキシ樹脂において、平均値としてのnが1以上
であり、臭素含有率をx重量%とした場合のエポキシ当
量(y)の値がy≦17600/(100−X)である
ことを特徴とする高信頼性難燃性エポキシ樹脂。(2) In a flame-retardant epoxy resin obtained by brominating a novolac type resin represented by the general formula ▲There are mathematical formulas, chemical formulas, tables, etc.▼ and further reacting epihalohydrin in the presence of an alkali, the average value of n is 1 or more, and the value of the epoxy equivalent (y) when the bromine content is x weight % is y≦17600/(100−X).
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4388888 | 1988-02-26 | ||
| JP63-43888 | 1988-04-20 | ||
| JP63-97470 | 1988-04-20 | ||
| JP9747088 | 1988-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0243214A true JPH0243214A (en) | 1990-02-13 |
| JP2761230B2 JP2761230B2 (en) | 1998-06-04 |
Family
ID=26383721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3049389A Expired - Fee Related JP2761230B2 (en) | 1988-02-26 | 1989-02-09 | Highly reliable flame-retardant epoxy resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2761230B2 (en) |
-
1989
- 1989-02-09 JP JP3049389A patent/JP2761230B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2761230B2 (en) | 1998-06-04 |
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