JPH0243482A - Crime preventing window and manufacture thereof - Google Patents

Abstract

PURPOSE:To improve economical efficiency by providing a protecting layer on a conducting layer after providing a conductive glass plate having the conducting layer on which a slit having an insulating property is formed and electrodes provided on both ends of the flow passage of electricity of the conducting layer. CONSTITUTION:After forming an organic compound in a slit form on a glass plate 1, a conducting layer 2 is formed by means of a physical vapor deposition method. Next, the organic compound part is removed forming a slit 3 having an insulating property on the conducting layer 2. Then, an electrode 4 composed of conductive coating and a conductive tape is provided on each of both ends of the flow passages of electricity of the conducting layer 2. Further, a protecting layer 5 composed of an inorganic coating layer having no organic polymer layer nor conductivity is provided on top of the conducting layer 2.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a security window and a method for manufacturing the same, and particularly to a security window using conductive glass.

In recent years, the proportion of glass windows has increased due to improvements in the living environment and the purpose of daylighting, and the number of large-area glass windows has increased due to improvements in aluminum sash technology and glass plate manufacturing technology.

Although this tendency is suitable for the above-mentioned purpose, it poses a very big problem from the perspective of crime prevention.

Various attempts have been made to improve the security performance of such large-area glass windows, but so far nothing has been achieved that is economical and durable.

As a result of intensive research by the present inventors in order to obtain a window structure that achieves this purpose using transparent conductive glass, which has been conventionally used in touch panels and to reduce negative VJ in cooling and heating, We have arrived at the present invention.

That is, the present invention has the following features: 1. A conductive glass plate 1 provided with a conductive layer in which slits having insulation properties are formed; A security window having a conductive layer and a protective layer 3 covering an electrode; 2. A conductive glass plate provided with a conductive layer having insulating slits; both ends of the electrical flow path of the conductive layer; 3. Forming an organic compound in the shape of a slit on a glass plate, and then forming the conductive layer into a physical vapor.・The security window according to the above item 2, which uses a conductive glass plate obtained by forming a conductive glass plate by a deposition method and further removing the organic compound portion to form a conductive layer having insulating properties. Manufacturing method, and 4. Forming a water-repellent compound in a slit shape on a glass plate,
A conductive glass plate obtained by coating a suspension of tin halide and/or indium halide in an aqueous medium thereon and baking it at high temperature to form a conductive layer containing tin and/or indium. 5. The method for manufacturing a security window according to item 2 above, wherein the slit is formed by scraping off the conductive layer.

The conductive glass plate unit in the present invention is a glass plate with a transparent thin film (conductive layer) made of a conductive material on at least one side, which reduces the number of insulating slits for determining the flow and resistance of electricity. Both are included in the conductive layer. Many materials and methods for forming such conductive layers have been proposed in the past. Move to page 494; "Nikkei Electronics".

10-30, 1978, Nikkei McGraw-Hill Publishing, Showa 5
Other known techniques are exemplified.

Among these, indium and/or @ oxide or silver or gold ltl! physical paper deposition (
PVD) method is preferred from the viewpoint of color tone and durability.

Various methods can be used to form slits in the conductive layer, but the simplest method is to scrape the conductive layer formed on the negative side with a sharp metal piece or the like according to the desired slit shape. Alternatively, it can be achieved by applying a solution that dissolves the surface of the conductive layer in the form of a slit and removing it, or it can also be achieved by a conventionally known etching method using a T1α solution or the like. Alternatively, a mask may be applied during formation of the conductive layer to prevent the conductive layer from being formed in the slit-shaped portion.

Furthermore, an organic compound is applied in the form of slits on a glass plate, a conductive layer is formed thereon by a PVD method, and the organic compound is then removed using a solvent or the like to form Surin 1 on the conductive layer. You can.

In addition, when forming a conductive layer by high-temperature baking, etc., a water-repellent compound is formed on a glass plate in the form of Surin 1, and a suspension of tin halide and/or indium halide in an aqueous medium is coated thereon. However, when baked, a conductive layer with slits automatically formed can be formed.

In the present invention, electrodes are provided at both ends of the electrical flow path in the conductive layer.

For these electrodes, conductive paint or conductive adhesive (for example, Dotite, manufactured by B-Yu Kasei, for example, D-35) is used.
0 etc. 2 Manufactured by Tokuriki Kagaku Kenkyusho Co., Ltd., Sylvest ■P-2
55, P-107, etc.:) and hot stamping (Fujiji Rubber Industries f11!! Fujifoil ■FE-3C-1~3)
Examples include those in which a large amount of metal powder or the like is mixed into a resin capable of exhibiting adhesive properties. Next, conductive tape (for example, Scotch Conductive Tape 0245.1267 manufactured by 3M Company)
: Manufactured by Fuji Polymer Industry ■, Fuji Poly ■ Connector), has an exposed metal surface on the first surface, and the other surface (second surface)
The first type (manufactured by 3M) has an adhesive (including adhesive) layer surface in which the metal surface electrically connected to the metal surface is partially exposed. However, an adhesive is placed in the recess, and the latter type (manufactured by Fuji Kobunshi Kogyoku) is made of an anisotropically conductive material coated with adhesive.

Besides these, it is also possible to attach solder directly to the conductive layer as an electrode.

A protective layer or a protective film may be provided on the conductive layer to protect the abrasion resistance and environmental resistance of the conductive layer.

Examples of the protective layer include organic polymer layers such as acrylic resin, urethane resin, epoxy resin, and acrylic resin, 5iOz, TiOz, TiN, and TiC.
Examples include coating layers of non-conductive inorganic substances such as.

As the protective film, a thermoplastic resin film is generally employed, and examples thereof include films of polyester resin such as polyethylene terephthalate, polyolefin resin such as polypropylene, polyamide resin, polyacrylonitrile resin, and the like. These films may have their surfaces coated with the protective layer listed above.

Further, these films may have a conventionally known heat ray anti-Q'J1a ability. These may also be subjected to anti-glare treatment.

These protective layers protect the conductive layer from abrasion and at the same time
It also has the purpose of preventing the insulating slits 1~ from electrically shorting and losing their insulation properties due to adhesion of moisture, so the protective layer should have good water resistance and low water permeability. It is preferable that there be.

A weak current is passed between the electrodes of the security window thus formed in order to detect when at least a portion of the transparent plate is damaged and the conductive layer bonded to it is broken. There is. Since this current is used for the purpose of detecting breakage, there is no need to actively raise the temperature of the transparent body itself, and therefore an extremely weak value may be sufficient. For example, to ioom8.

A detector is connected to this electric circuit for detecting a change in resistance or a change in current caused by the rupture.

It is preferable that the security window of the present invention is further protected by providing a sealing material on the end face in order to prevent disturbance of the electrical circuit due to infiltration of water removed during cleaning or the like.

The security window of the present invention is in principle a transparent window.

Here, transparent includes not only a state in which transparency is extremely good, but also a state in which transparency is reduced, and a state in which there is no transparency but in which light can be let in. These may be colorless or even colored.

[Brief explanation of the drawing]

FIG. 1 shows a plan view of a transparent conductive glass with slits and electrodes attached. FIG. 2 shows an example in which a large number of electrodes are attached to the electrodes in FIG. 1. FIG. 3 is a cross-sectional view when a protective film is adhered to the structure shown in FIG. 1, and FIG. 4 shows an example of a cross-section when a protective layer is applied. 1...Glass, 2...Transparent conductive layer, 3...Slit.

Claims (1)

[Claims] 1. A conductive glass plate provided with a conductive layer having insulating slits for ¥1, electrodes provided at both ends of the electrical flow path of the conductive layer, ¥2, A security window comprising the conductive layer and, if necessary, a protective layer covering the electrode. 2. A conductive glass plate provided with a conductive layer in which slits having insulating properties are formed, electrodes are provided at both ends of the electrical flow path of the conductive layer, and then a protective layer is formed on the conductive layer. A method for manufacturing a security window characterized by: 3. Form an organic compound in the shape of a slit on a glass plate, then form a conductive layer using a physical vapor deposition method, and then remove the organic compound portion to form an insulating slit in the conductive layer. 3. The method for manufacturing a security window according to claim 2, wherein the conductive glass plate obtained by the above method is used. 4. Contain tin and/or indium by forming a water-repellent compound in the shape of a slit on a glass plate, coating the slit with a suspension of tin halide and/or indium halide in an aqueous medium, and baking at high temperature. 3. The method for manufacturing a security window according to claim 2, wherein a conductive glass plate obtained by forming a conductive layer is used. 5. The method for manufacturing a security window according to claim 2, wherein the slits are formed by scraping off the conductive layer.