JPH0243779A - Micro-displacement magnifying mechanism temperature compensation device - Google Patents

Micro-displacement magnifying mechanism temperature compensation device

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Publication number
JPH0243779A
JPH0243779A JP63194256A JP19425688A JPH0243779A JP H0243779 A JPH0243779 A JP H0243779A JP 63194256 A JP63194256 A JP 63194256A JP 19425688 A JP19425688 A JP 19425688A JP H0243779 A JPH0243779 A JP H0243779A
Authority
JP
Japan
Prior art keywords
temperature
piezoelectric element
linear expansion
expansion
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63194256A
Other languages
Japanese (ja)
Inventor
Kazuhiro Yonekura
米倉 千浩
Satoshi Watanabe
敏 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brother Industries Ltd
Original Assignee
Brother Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Industries Ltd filed Critical Brother Industries Ltd
Priority to JP63194256A priority Critical patent/JPH0243779A/en
Publication of JPH0243779A publication Critical patent/JPH0243779A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、電圧の印加により伸縮する圧電素子を用いた
微小変位拡大機構において、圧電素子の温度上昇に伴う
負の線膨脹を補償するための温度補償装置に関する。
Detailed Description of the Invention (Field of Industrial Application) The present invention is for compensating for negative linear expansion due to temperature rise of the piezoelectric element in a minute displacement magnification mechanism using a piezoelectric element that expands and contracts when a voltage is applied. The present invention relates to a temperature compensation device.

(従来の技術) 従来、例えばプリンターヘッドに使用される第7図に示
すような微小変位拡大機構51において、圧電素子52
の変位を拡大するとき、圧電素子52の発熱により、使
用環境温度に違いが生じたり、圧電素子52自身が他の
構成部材と異なり、膨脹特性が負の線膨脹特性を持って
いるため、温度変化により最終的に拡大された変位、即
ち印字ワイヤ53の変位が安定しないという問題があっ
た。
(Prior Art) Conventionally, in a minute displacement magnification mechanism 51 as shown in FIG. 7 used in a printer head, for example, a piezoelectric element 52 is used.
When the displacement of There was a problem in that the displacement finally expanded due to the change, that is, the displacement of the printing wire 53, was not stable.

そこで、上記問題を解決するため、従来は微小変位拡大
機構51のフレーム54に低熱膨張率の材料、例えばイ
ンバー合金を用いるとともに、圧電素子52に接して熱
膨張率の大きな温1&補旧部材55を用いることにより
、圧電素子52の温度が上昇したとき、圧電素子52か
らの伝熱を受けて温度補償部材55の温度を上昇させ、
温度補償部材55に正の線膨脹をさせることにより、f
f−電木子52の渇爪上背に伴う圧電索子52自体の負
の線rfJ服によるフレーム側と圧電素子側との線膨1
&差を補償し、フレーム54側の熱膨張量と、j1電素
子側(圧電素子524温度補償部材55)の熱膨脹■を
等しくするという温度補償手段が採用されていた。
Therefore, in order to solve the above problem, conventionally, a material with a low coefficient of thermal expansion, such as an invar alloy, is used for the frame 54 of the micro displacement amplifying mechanism 51, and a thermal expansion member 55 with a high coefficient of thermal expansion is used in contact with the piezoelectric element 52. By using this, when the temperature of the piezoelectric element 52 increases, the temperature of the temperature compensating member 55 increases by receiving heat transferred from the piezoelectric element 52,
By causing the temperature compensation member 55 to undergo positive linear expansion, f
f-Line expansion 1 between the frame side and the piezoelectric element side due to the negative line rfJ clothes of the piezoelectric cord 52 itself due to the upper back of the electric cord 52
A temperature compensating means is employed to compensate for the difference & to equalize the amount of thermal expansion on the frame 54 side and the thermal expansion (2) on the j1 electric element side (piezoelectric element 524 temperature compensating member 55).

(発明が解決しようとする課題〉 J、記従来の微小変位拡大機構51において、例えば第
8図に示す情誼、即ち、圧電系7−52に温度検出器A
を、温度補償部材55に同様の温度検出器Bを、そして
フレーム54に同様の温度検出器Cを張り付け、室温2
0度のもとて圧電系子52を連続駆動させたときのそれ
ぞれの温度を測定したところ、第9図に示すような瀉麿
データが得られた。
(Problems to be Solved by the Invention) J. In the conventional minute displacement magnifying mechanism 51, for example, the situation shown in FIG.
, a similar temperature sensor B is attached to the temperature compensation member 55, and a similar temperature sensor C is attached to the frame 54, and the room temperature is 2.
When the respective temperatures were measured when the piezoelectric system element 52 was continuously driven at 0 degrees, data as shown in FIG. 9 were obtained.

上記第9図に示すように、圧電系子52の駆動開始30
秒模に、圧電索子52自体の温度11は60度に達した
が、温度補償部材55の温度T2G、L 28瓜、フレ
ーム54の温度T3は26.5度までしか上昇しない。
As shown in FIG. 9 above, the drive start 30 of the piezoelectric system 52
In a second, the temperature 11 of the piezoelectric cord 52 itself reached 60 degrees, but the temperature T2G of the temperature compensating member 55, the temperature T3 of the frame 54 rose only to 26.5 degrees.

同様に360秒後においても、上記温度T1は68度に
達したが、面一温度T2は35度、T3は33度までし
か上昇しない。
Similarly, after 360 seconds, the temperature T1 reached 68 degrees, but the surface temperature T2 rose only to 35 degrees, and the temperature T3 rose only to 33 degrees.

即ち、従来の温度補償手段の場合、ff電索子52の発
熱に伴う温度補償部材55とフレーム54とに対する熱
伝導は一様に行われず、4匪勾配が生じる。そのため、
フレーム側と圧電素子側の熱膨張量に差が生じて正しく
温度補償されないという問題があった。
That is, in the case of the conventional temperature compensating means, the heat conduction between the temperature compensating member 55 and the frame 54 due to the heat generated by the FF cable 52 is not uniformly conducted, and a 4-degree gradient occurs. Therefore,
There was a problem in that a difference occurred in the amount of thermal expansion between the frame side and the piezoelectric element side, resulting in incorrect temperature compensation.

そこで本発明では、温度補償部材に発熱体を取付け、圧
電素子の温度上昇に対応して温度補償部材を加熱し、温
度補償部材に、圧電素子の負の線膨脹に対応した正の線
#、脹をさせることにより、フレーム側と圧電素子側の
熱膨張量を等しくするように温度制御するごとを、解決
すぺぎ技術的課題とするしのである。
Therefore, in the present invention, a heating element is attached to the temperature compensation member, the temperature compensation member is heated in response to the temperature rise of the piezoelectric element, and the temperature compensation member is provided with a positive line # corresponding to the negative line expansion of the piezoelectric element, The technical problem to be solved is to control the temperature so that the amount of thermal expansion on the frame side and the piezoelectric element side are equalized by swelling.

(課題を解決するための手段) 上記課題解決のための技術的手段は、電■:の印加によ
り伸縮する圧電素子と、その圧電系子を伸縮方向の一端
において固着するフレームと、上記圧電素子の伸縮方向
の他端に連結された可動部材と、上記圧電素子の一端と
前記フレームとの間、もしくは上記圧電素子の他端と前
記司動部材との間に設けられて、上記圧電索f自体の温
度変化及び周囲温度の変化に伴う圧電素子の線膨脹を補
償り“るための温度補償部材とを備えた微小変位拡大機
構における温度補償装置を、前記圧電素子と、前記温度
補償部材とのそれぞれのmlを検出してそれぞれの検出
温度に対応した電気信号を出力する温度検出器と、而記
温度補償部材に伝熱可能に取り何けられて、所要の主力
が供給されたときに発熱し、上記温度補償部材に正の線
膨脹をさせるための発熱体と、前記温度検出器から出力
された前記それぞれの検出温度対応の電気信号を入力し
、前記圧電素子の負の線膨脹量を演算するとともに、こ
の負の線膨脹量を補償するだめの前記温度補償部材の正
の線膨脹量を演陣し、温度補償部材の温度を、この正の
線膨@量に対応した温度にするための所要の電力を前記
発熱体に供給する温度制御手段とを備えた構成にするこ
とである。
(Means for Solving the Problem) The technical means for solving the above problem consists of a piezoelectric element that expands and contracts by the application of an electric current, a frame that fixes the piezoelectric element at one end in the expansion and contraction direction, and a frame that fixes the piezoelectric element at one end in the expansion and contraction direction. a movable member connected to the other end in the expansion/contraction direction of the piezoelectric cable f, and a movable member connected to the other end of the piezoelectric cable f in the direction of expansion and contraction; A temperature compensating device in a minute displacement amplifying mechanism, which includes a temperature compensating member for compensating for linear expansion of the piezoelectric element due to changes in its own temperature and changes in ambient temperature, comprises: the piezoelectric element, the temperature compensating member; A temperature sensor that detects each mL of the temperature and outputs an electric signal corresponding to each detected temperature, and a temperature compensation member that is arranged to allow heat transfer, and when the required main force is supplied. A heating element that generates heat and causes the temperature compensating member to undergo positive linear expansion, and an electrical signal corresponding to each of the detected temperatures output from the temperature sensor are input, and the amount of negative linear expansion of the piezoelectric element is inputted. At the same time, calculate the amount of positive linear expansion of the temperature compensation member to compensate for this amount of negative linear expansion, and set the temperature of the temperature compensation member to a temperature corresponding to this amount of positive linear expansion. and temperature control means for supplying the necessary power to the heat generating element.

(作 用) 上記構成の微小変位拡大機構用温度補償装置によると、
電圧が印加され、圧電素子が駆動された状態で温度検出
器は圧電素子の温度を検出し、検出温度に対応した電気
信号を温度制御手段に出力する。温度制御手段は上記電
気信号を入力すると、圧電素子の負の線膨脹量を演算す
るとともに、この負の線膨脹量を補償するための温度補
償部材の正の線膨脹量を演算し、温度補償部材の温度を
、この正の線膨W&量に対応した温度に加熱するための
所要の電力を前記発熱体に出カッる。その結果、温度補
償部材は、上記正の線膨脹量に対応した温度まで加熱さ
れ、圧電素子の負の線膨脹を補償するまで線膨脹される
ため、フレーム側と圧電素子側の熱膨張量の差がゼロに
収束され、微小変位拡大機構の変位は圧電素子の温度変
化にかかわらず、常に一定に制御される。
(Function) According to the temperature compensator for a minute displacement magnifying mechanism configured as described above,
The temperature detector detects the temperature of the piezoelectric element while a voltage is applied and the piezoelectric element is driven, and outputs an electric signal corresponding to the detected temperature to the temperature control means. When the temperature control means receives the electric signal, it calculates the amount of negative linear expansion of the piezoelectric element, and also calculates the amount of positive linear expansion of the temperature compensation member to compensate for this amount of negative linear expansion, thereby performing temperature compensation. The necessary power to heat the member to a temperature corresponding to this positive linear expansion W& amount is outputted to the heating element. As a result, the temperature compensating member is heated to a temperature corresponding to the above-mentioned positive linear expansion amount, and is linearly expanded until it compensates for the negative linear expansion of the piezoelectric element, so that the thermal expansion amount on the frame side and the piezoelectric element side is The difference is converged to zero, and the displacement of the minute displacement magnifying mechanism is always controlled to be constant regardless of temperature changes of the piezoelectric element.

(実施例) 以下、本発明の実施例を図面を参照しながら説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.

プリンターヘッド等に使用される微小変位拡大機構1を
斜視図で表した第1図において、直流電圧が印加された
ときに長子方向に伸び、この電圧の印加が解除されたと
きに元の状態に戻る積層型圧電セラミックのような圧電
素子2が、その伸縮方向の一端面においで温度補償部材
5を介して基台部6に取り付けられている。一方、所定
板厚の例えばスーパーインバー合金から成るフレーム4
は、前記基台部6と、この基台部6の両側に形成された
第1、第2の両支持部7.8とを主体として略U字状に
形成されている。
In Fig. 1, which is a perspective view of a minute displacement magnifying mechanism 1 used in a printer head, etc., it extends in the longitudinal direction when a DC voltage is applied, and returns to its original state when the voltage is removed. A piezoelectric element 2 such as a laminated piezoelectric ceramic is attached to a base part 6 via a temperature compensating member 5 at one end surface in the direction of expansion and contraction. On the other hand, a frame 4 made of, for example, a super invar alloy with a predetermined thickness
is formed into a substantially U-shape mainly consisting of the base portion 6 and first and second support portions 7.8 formed on both sides of the base portion 6.

圧電素子2の伸縮方向の他端には、連動゛F9が固着さ
れている。
An interlock F9 is fixed to the other end of the piezoelectric element 2 in the direction of expansion and contraction.

連動子9の片側上面とフレーム4の第1支持部7の上端
面との間には、弾性変形可能な第1、第2のヒンジ部1
0.11を介して、第1傾動体12が傾動可能に形成さ
れている6、史に、連動子9の弛側上面とフレーム4の
第2支持部8の上端面との間には、弾性変形可能な第3
、第4のヒンジ部13.14を介して第2傾動体15が
傾動可能に形成されている。
Between the upper surface of one side of the interlocking element 9 and the upper end surface of the first support section 7 of the frame 4, there are elastically deformable first and second hinge sections 1.
0.11, the first tilting body 12 is formed to be tiltable.6, between the loose side upper surface of the interlocking element 9 and the upper end surface of the second support part 8 of the frame 4, Elastically deformable third
, the second tilting body 15 is formed to be tiltable via a fourth hinge portion 13.14.

第1、第2の内傾動体12.15の先端部にはそれぞれ
板バネ16.17がその基部において固着され、これら
の各機バネ16.17の先端部には印字ワイヤ3を取り
付けたワイヤ支持アーム18が固着されている。
A leaf spring 16.17 is fixed at its base to the tip of the first and second inner tilting bodies 12.15, and a wire to which the printing wire 3 is attached is attached to the tip of each of these machine springs 16.17. A support arm 18 is fixed.

そして、直流電圧の印加によって圧電索子2が長子方向
に伸びると、第1、第2の内傾動体12゜15が第2、
第4のヒンジ部11.14を支点どして外側にそれぞれ
傾動される。これによって、第1傾動体12側の板バネ
16は引張され、第2傾動体15側の板バネ17は押出
されることで、ワイヤ支持7−ム18が、案内部材19
に案内された印字ワイヤ3を印字位置まで曲進させるよ
うな方向に傾動される。
When the piezoelectric cord 2 extends in the longitudinal direction by applying a DC voltage, the first and second inner tilting bodies 12°15 move to the second,
They are each tilted outward using the fourth hinge portions 11 and 14 as a fulcrum. As a result, the leaf spring 16 on the first tilting body 12 side is pulled, and the leaf spring 17 on the second tilting body 15 side is pushed out, so that the wire support 7-m 18 is
The printing wire 3 guided by the printing wire 3 is tilted in a direction in which it curves to the printing position.

前記圧電索子2とフレーム4の基台部6との間に介挿さ
れる温度補償部材5は、例えばAl5O12材が使用さ
れ、そのA7ング率Eは、E=  7.lX10  K
9/am2FIlll率αは、 α−23,8x 10’/ ’C1 比熱Cは、c = 0.215cal/9 / ’C密
度qは、q= 2.71 ’j/Cm3そして外形寸法
は、3.4x 4.4x 4.9 (高さ)(14j位
mm)となっている。
The temperature compensating member 5 inserted between the piezoelectric cord 2 and the base portion 6 of the frame 4 is made of, for example, Al5O12 material, and its A7 rate E is E=7. lX10K
9/am2FIll rate α is α-23,8x 10'/'C1 Specific heat C is c = 0.215 cal/9/'C density q is q = 2.71 'j/Cm3 and external dimensions are 3 .4x 4.4x 4.9 (height) (about 14j mm).

一方、圧電素子2の線膨脹量αは、 α= −6,OX 10’/’C1 そして外形寸法は、3x 3x 18 (高さ)(単位
層)となっている。
On the other hand, the linear expansion amount α of the piezoelectric element 2 is α=−6,OX 10′/′C1, and the external dimensions are 3×3×18 (height) (unit layer).

また、フレーム4はスーパーインバー合金が使用され、
(のヤング率Eは、 E=13.4xlOK9/1ars2 a脹率act、a = 0.4x 10−6/ ’C、
トナッテいル。
In addition, the frame 4 uses super invar alloy,
(The Young's modulus E of
Tonatteru.

以上のように構成された微小変位拡大機構1の温度補償
部材5に対して、第2図に示すように、コの字状に抵抗
発熱体21を張着するとともに、第3図に承りように、
非常に薄形の温度検出器22を圧電索子2に、また同様
の温度検出器23を温度補償部材5に、更に同様の温度
検出器24をフレーム4に取付ける。そして−V記抵抗
発熱体21、温度検出器22,23.24のそれぞれ(
よ、第4図の電気制御回路ブロック図に示すように、温
度制御回路(温度制御手段)25に接続されている。
As shown in FIG. 2, a resistance heating element 21 is attached in a U-shape to the temperature compensating member 5 of the minute displacement magnification mechanism 1 configured as described above, and as shown in FIG. To,
A very thin temperature sensor 22 is attached to the piezoelectric cord 2, a similar temperature sensor 23 to the temperature compensation member 5, and a similar temperature sensor 24 to the frame 4. -V resistance heating element 21, temperature detectors 22, 23, 24, respectively (
As shown in the electrical control circuit block diagram of FIG. 4, it is connected to a temperature control circuit (temperature control means) 25.

温度制御回路25は、上記温度検出器22がら出力され
た圧電素子2の温度対応の電気信号と、温度検出器23
から出力された温度補償部材5の温度対応の電気信号と
、温度検出器24がら出力されたフレーム4の温度対応
の電気信号とを入力し、圧電索子2の温度を認識したあ
と、上記認識温度に対応した負の線膨IM量を演算ツる
。史に温度制御回路25は、圧電素子2の上記負の線膨
脹と、フレーム4の温度上昇によるフレーム4の正の線
膨脹とによる膨脹差を補償するために、温度補償部材5
を正に線膨脹させるための温度補償部材5の所要温度を
演算し、温度補償部材5を上記所要温度に加熱づるため
に必要な電力を演算したあと、温度補償部材5に張着さ
れた前記抵抗発熱体21に対して上記加熱用電力を供給
することにより、同発熱体21を発熱させ、温度補償部
材5の温度を上記所g:温度まで上昇させることによっ
て、上記膨脹差をゼロに収束させるものである。
The temperature control circuit 25 receives an electric signal corresponding to the temperature of the piezoelectric element 2 outputted from the temperature detector 22 and the temperature detector 23.
After inputting the electric signal corresponding to the temperature of the temperature compensation member 5 outputted from the temperature detector 24 and the electric signal corresponding to the temperature of the frame 4 outputted from the temperature detector 24 and recognizing the temperature of the piezoelectric cable 2, the above recognition is performed. Calculate the amount of negative linear expansion IM corresponding to the temperature. Historically, the temperature control circuit 25 uses a temperature compensating member 5 to compensate for the difference in expansion caused by the negative linear expansion of the piezoelectric element 2 and the positive linear expansion of the frame 4 due to the temperature rise of the frame 4.
After calculating the required temperature of the temperature compensating member 5 to cause positive linear expansion of the temperature compensating member 5 and calculating the electric power required to heat the temperature compensating member 5 to the above required temperature, By supplying the heating power to the resistance heating element 21, the heating element 21 generates heat, and the temperature of the temperature compensation member 5 is raised to the temperature g: above, thereby converging the expansion difference to zero. It is something that makes you

前記抵抗発熱体21は、第5図の断面図に小すように、
例えばニッケルークロム(Ni−Cr)で形成された膜
状の抵抗発熱材31が芯部に用いられ、この抵抗発熱材
31を保護、絶縁するように、例えば酸化升タン(Ti
Q2)で形成された絶縁被膜32が形成されている。こ
の絶縁被膜32は前記温度補償部材5の表面に着接され
る第1層絶縁被膜32△と、外側の第2層絶縁被膜32
Bとから成っている。尚、第6図は抵抗発熱体21の展
開図である。
As shown in the cross-sectional view of FIG. 5, the resistance heating element 21 is
A film-like resistance heating material 31 made of, for example, nickel-chromium (Ni-Cr) is used for the core, and a film made of, for example, tantanium oxide (Ti) is used to protect and insulate this resistance heating material 31.
The insulating coating 32 formed in Q2) is formed. This insulating coating 32 includes a first layer insulating coating 32Δ adhered to the surface of the temperature compensating member 5, and a second layer insulating coating 32 on the outside.
It consists of B. Incidentally, FIG. 6 is a developed view of the resistance heating element 21.

以上のように構成された微小変位拡大機構用温度補償装
置において、面一抵抗発熱体21の抵抗発熱材31の厚
さを2マイクロメートル、幅2ミリメートル、長さ12
.2ミリメートルとして、これを3ポル1〜の直流電源
で加熱した場合、温度補償部材5の温度上昇は、熱伝導
による熱の損失をゼロとすると、次のようにSl算でき
る。
In the temperature compensator for a minute displacement magnifying mechanism configured as described above, the resistance heating material 31 of the flush resistance heating element 21 has a thickness of 2 micrometers, a width of 2 mm, and a length of 12 mm.
.. 2 mm, and when this is heated with a DC power supply of 3 pols 1 to 1, the temperature rise of the temperature compensating member 5 can be calculated as Sl as follows, assuming that the heat loss due to thermal conduction is zero.

最初、抵抗発熱材31の抵抗値1又[Ω1を次の式から
求める。
First, the resistance value 1 or [Ω1 of the resistance heating material 31 is determined from the following equation.

R=ρ、 L/S 但しρは抵抗発熱材31の体積抵抗率[μΩ−cm ]
Lは抵抗発熱材31の長さ[ml Sは抵抗発熱材31の断面積[馴21である。
R=ρ, L/S where ρ is the volume resistivity of the resistance heating material 31 [μΩ-cm]
L is the length of the resistance heating material 31 [ml] S is the cross-sectional area of the resistance heating material 31 [ml].

−上記式にρ−112x 10””  l = 12.
2x 10−”、S−2x 2 x 10  = 4 
x 10−3のそれぞれを代入してJ1暮すると、R=
 3.42  [Ω]となる。
- In the above equation, ρ-112x 10"" l = 12.
2x 10-”, S-2x 2 x 10 = 4
Substituting each of x 10-3 and calculating J1, R=
3.42 [Ω].

次に、上記抵抗発熱材31に3ボルトの直流電圧を印加
して発熱させた場合の1秒間当たりの光熱ΦH[cal
Fを次の式より計算する。
Next, when a DC voltage of 3 volts is applied to the resistance heating material 31 to generate heat, the light heat ΦH [cal
Calculate F using the following formula.

H=0.24X E2/R 但しEは抵抗発熱材31に印加される電圧で、この場合
はE=3ボルト、Rは前記抵抗発熱材31の抵抗値で、
この場合はR=3.42オームである。
H = 0.24X E2/R where E is the voltage applied to the resistance heating material 31, in this case E = 3 volts, R is the resistance value of the resistance heating material 31,
In this case R=3.42 ohms.

上記式にそれぞれの値を代入して計算すると、H= 0
.632 [cal lどなる。
When calculating by substituting each value into the above formula, H = 0
.. 632 [cal roar.

次に、上記抵抗発熱材31の発熱量1」に基ずいて温度
補償部材5の1秒間当たりの温度上4. t[℃]を9
次の式により計算する。
Next, based on the amount of heat generated by the resistance heating material 31 (1), the temperature of the temperature compensating member 5 per second is increased by 4. t [℃] is 9
Calculate using the following formula.

t −ト(/CQV 但しCは温度補償部材5の比熱[cat/sF / ”
C]qは温度補償部材5の密度[g/cm3]。
t-to(/CQV where C is the specific heat of the temperature compensation member 5 [cat/sF/''
C]q is the density [g/cm3] of the temperature compensation member 5.

V l;を温度補償部材5の体積[cIR3]である。V l; is the volume [cIR3] of the temperature compensating member 5.

上記式にc= 0.215. q= 2.71、V =
 73.3X 10−3のそれぞれを代入して計算する
と、tは14.8 [’CIとなり、温度補償部材5は
毎秒的15℃の温度上界が見られる。
In the above formula, c=0.215. q=2.71, V=
When calculated by substituting each of 73.3 x 10-3, t becomes 14.8 ['CI, and the temperature compensation member 5 has an upper temperature limit of 15°C per second.

(発明の効果) 以上のように本発明によれば、微小変位拡大機構の圧電
素子が伸縮動作を繰り返し、温度が上昇する過程で生じ
る圧電素子の負の線膨脹を、発熱体の発熱作用による温
度補償部材の正の線膨脹制御により補償することができ
るため、フレーム側と圧電素子側の熱膨張が等しくなり
、圧電素子の温度上昇に係わらず、常に微小変位拡大機
構の変位を安定させることができるという効果がある。
(Effects of the Invention) As described above, according to the present invention, the piezoelectric element of the minute displacement magnification mechanism repeats expansion and contraction operations, and the negative linear expansion of the piezoelectric element that occurs in the process of rising temperature is suppressed by the heating action of the heating element. Since compensation can be performed by controlling the positive linear expansion of the temperature compensating member, the thermal expansion on the frame side and the piezoelectric element side are equal, and the displacement of the minute displacement magnification mechanism is always stabilized regardless of the temperature rise of the piezoelectric element. It has the effect of being able to.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の微小変位拡大機構の斜視外
観図、第2図は温度補償部材に張4された抵抗発熱体の
斜視外観図、第3図は温度検出器と抵抗発熱体の取付は
図、第4図は゛上気制御回路ブロック図、第5図は抵抗
発熱体の断面図、第6図は抵抗発熱体の展開図、第7図
は従来の微小変位拡大機構の正面図、第8図は微小変位
拡大機構の各部の温度を測定するための温度検出器の配
四図、第9図は上記温度検出器による温度測定データ図
である。 1・・・微小変位拡大機構 2・・・圧電素子 4・・・フレーム 5・・・温度補償部材 ・・・抵抗発熱体 24・・・温度検出器 25・・・温度制御回路
Fig. 1 is a perspective external view of a minute displacement magnifying mechanism according to an embodiment of the present invention, Fig. 2 is a perspective external view of a resistance heating element stretched to a temperature compensating member, and Fig. 3 is a temperature detector and a resistance heating element. The installation of the body is shown in the figure, Figure 4 is a block diagram of the upper air control circuit, Figure 5 is a sectional view of the resistance heating element, Figure 6 is an exploded view of the resistance heating element, and Figure 7 is a diagram of the conventional minute displacement magnification mechanism. A front view, FIG. 8 is a four-dimensional diagram of a temperature detector for measuring the temperature of each part of the minute displacement magnification mechanism, and FIG. 9 is a diagram of temperature measurement data by the temperature detector. 1... Minute displacement magnifying mechanism 2... Piezoelectric element 4... Frame 5... Temperature compensation member... Resistance heating element 24... Temperature detector 25... Temperature control circuit

Claims (1)

【特許請求の範囲】 電圧の印加により伸縮する圧電素子と、その圧電素子を
伸縮方向の一端において固着するフレームと、上記圧電
素子の伸縮方向の他端に連結された可動部材と、上記圧
電素子の一端と前記フレームとの間、もしくは上記圧電
素子の他端と前記可動部材との間に設けられて、上記圧
電素子自体の温度変化及び周囲温度の変化に伴う圧電素
子の線膨脹を補償するための湿度補償部材とを備えた微
小変位拡大機構において、 前記圧電素子と、前記温度補償部材とのそれぞれの温度
を検出してそれぞれの検出温度に対応した電気信号を出
力する温度検出器と、 前記温度補償部材に伝熱可能に取付けられ、所要の電力
が供給されたときに発熱し、上記温度補償部材に正の線
膨脹をさせるための発熱体と、前記温度検出器から出力
された前記それぞれの検出温度対応の電気信号を入力し
、前記圧電素子の負の線膨脹量を演算するとともに、こ
の負の線膨脹量を補償するための前記一度補償部材の正
の線膨脹量を演算し、温度補償部材の温度を、この正の
線膨脹量に対応した温度にするための所要の電力を前記
発熱体に供給する温度制御手段とを設けたことを特徴と
する微小変位拡大機構用温度補償装置。
[Scope of Claims] A piezoelectric element that expands and contracts when a voltage is applied, a frame that fixes the piezoelectric element at one end in the expansion and contraction direction, a movable member connected to the other end of the piezoelectric element in the expansion and contraction direction, and the piezoelectric element Provided between one end and the frame, or between the other end of the piezoelectric element and the movable member, to compensate for linear expansion of the piezoelectric element due to changes in temperature of the piezoelectric element itself and changes in ambient temperature. a temperature detector that detects the respective temperatures of the piezoelectric element and the temperature compensation member and outputs an electric signal corresponding to each detected temperature; a heating element that is attached to the temperature compensating member in a heat-transferable manner and generates heat when the required electric power is supplied to cause the temperature compensating member to undergo positive linear expansion; Electric signals corresponding to each detected temperature are input, and the amount of negative linear expansion of the piezoelectric element is calculated, and the amount of positive linear expansion of the compensation member is calculated to compensate for this amount of negative linear expansion. , a temperature control means for supplying the heating element with the necessary power to bring the temperature of the temperature compensating member to a temperature corresponding to the amount of positive linear expansion. Compensation device.
JP63194256A 1988-08-03 1988-08-03 Micro-displacement magnifying mechanism temperature compensation device Pending JPH0243779A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63194256A JPH0243779A (en) 1988-08-03 1988-08-03 Micro-displacement magnifying mechanism temperature compensation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63194256A JPH0243779A (en) 1988-08-03 1988-08-03 Micro-displacement magnifying mechanism temperature compensation device

Publications (1)

Publication Number Publication Date
JPH0243779A true JPH0243779A (en) 1990-02-14

Family

ID=16321595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63194256A Pending JPH0243779A (en) 1988-08-03 1988-08-03 Micro-displacement magnifying mechanism temperature compensation device

Country Status (1)

Country Link
JP (1) JPH0243779A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5921617A (en) * 1996-06-20 1999-07-13 Loewen; Gordon Longitudinally and vertically adjustable trailer underbody fairing
JP2007512713A (en) * 2003-11-20 2007-05-17 バイキング テクノロジィーズ エル.シー. Integrated thermal compensation for electromechanical actuators
GB2450620A (en) * 2007-06-27 2008-12-31 Fluke Corp System and method of providing a thermally stabilised fixed frequency piezoelectric optical modulator

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5921617A (en) * 1996-06-20 1999-07-13 Loewen; Gordon Longitudinally and vertically adjustable trailer underbody fairing
JP2007512713A (en) * 2003-11-20 2007-05-17 バイキング テクノロジィーズ エル.シー. Integrated thermal compensation for electromechanical actuators
GB2450620A (en) * 2007-06-27 2008-12-31 Fluke Corp System and method of providing a thermally stabilised fixed frequency piezoelectric optical modulator
GB2450620B (en) * 2007-06-27 2010-07-07 Fluke Corp System for providing a thermally stabilized fixed frequency piezoelectric optical modulator
US8008839B2 (en) 2007-06-27 2011-08-30 Fluke Corporation System and method of providing a thermally stabilized fixed frequency piezoelectric optical modulator

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