JPH024389B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a soldering method for soldering workpieces with a soldering iron in an automated line.

Configuration of conventional example and its problems In the conventional soldering method using a soldering iron in an automated line, as shown in a specific example in FIG.
The heated soldering iron 5 is pressed against the work piece 5, the solder 6 is supplied to form a molten solder layer 7, and soldering is performed, and when one cycle is completed, the next work 8 is soldered.The process is repeated, and the process is repeated periodically. A cleaning jig 9 was then inserted to remove the deteriorated solder remaining on the soldering iron 5.

However, in the above method, a soldering failure occurs in the first soldering after the solder of the soldering iron 5 is removed by the cleaning jig 9. Figure 2a
If there is little solder remaining on the soldering iron 10 as shown in FIG.
A considerable amount of the water was absorbed into the iron 12, and as shown in Figure 2c
As shown in FIG. Moreover, the temperature of the soldering iron 13 temporarily decreases due to cleaning, which impairs solder wetting, resulting in an insufficient amount of solder 14. When the solder supply is increased to compensate for the solder shortage, as shown in Figure 3a,
During the second and subsequent soldering after cleaning, there was too much solder 16 remaining on the soldering iron 15, so as shown in Fig. 3b.
As shown in FIG. 2, an excessive amount of solder 17 occurs. For the above reasons, it is difficult to set the solder supply amount and heating time to correctly solder both the work before and after cleaning, and the solder amount at the soldering point is not stable. This had become a major barrier to improvement.

Purpose of the Invention In view of the above-mentioned drawbacks, the present invention provides a soldering method that prevents the amount of solder at the soldering point from becoming unstable due to cleaning of the soldering iron and greatly improves the soldering yield in the automation of the soldering process. It provides:

Structure of the Invention In the soldering method of the present invention, one cycle of soldering operation is completed by positioning an incoming workpiece, pressing a heated iron against the workpiece, supplying solder, and separating the iron from the workpiece. This soldering method involves repeating the soldering operation on an arbitrary number of workpieces by holding the workpieces in the same position even after one cycle of soldering is completed after cleaning the soldering iron. Since the solder is also sent each time the soldering operation is repeated, it is possible to supplement the solder absorbed by the iron after cleaning, and the soldering iron is heated and soldered in the first cycle of soldering operation. ,2
The soldering operation after the 1st cycle can be performed with the soldering area pre-heated and pre-soldered, resulting in good wetting of the solder and stable soldering, which greatly increases the soldering yield when automating the soldering process. It has the unique effect of improving

DESCRIPTION OF THE EMBODIMENT FIG. 4 shows the process order of a soldering method in an embodiment of the present invention.

(a) The deteriorated solder 20 remaining on the soldering iron 19 is removed using an air blowing jig (not shown) and a cleaning jig 18 having a vacuum suction function.

(b) Iron 2 with solder removed by cleaning
1 is pressed onto the electrode 22 and the electric wire 23, and the solder 24 is supplied.

(c) A considerable amount of the supplied solder 25 is transferred to the iron 26.
Since the temperature of the iron 26 temporarily decreases due to cleaning, the amount of solder 29 used to solder the electrode 27 and the electric wire 28 decreases.

(d) The soldering operation is repeated one more cycle, pressing the iron 30 against the electrode 31 and the electric wire 32, forming a molten solder layer 33 between the electrode 31, the electric wire 32, and the iron 30, and supplying the solder 34.

(e) The iron 35 is raised and the electrode 36 and the electric wire 37 are soldered.

Effects of the Invention As described above, in the present invention, in the automation of soldering, the soldering operation of heating with the iron and supplying solder is repeated without moving the workpiece to be soldered only for the first soldering after cleaning the iron. As a result, stable soldering can be performed and the soldering yield can be greatly improved, which has great practical effects.

[Brief explanation of drawings]

Figure 1 is a cross-sectional view of the conventional soldering process, Figure 2 a
-c and FIGS. 3a and 3b are cross-sectional views of the causes of soldering defects that occur in conventional soldering methods, and FIGS. 4 a-e are cross-sectional views of each step of the soldering method in an embodiment of the present invention. It is a diagram. 5, 10, 12, 13, 15, 19, 21, 2
6, 30, 35...Soldering iron, 3, 22, 27,
31, 36... Electrode, 4, 23, 28, 32, 3
7... Electric wire, 9, 18... Cleaning jig.

Claims (1)

[Claims] 1. A step of pressing a soldering iron against a workpiece and heating it;
A soldering method that automatically performs a process of supplying solder to a workpiece, a process of separating a soldering iron from a workpiece, and a process of cleaning the soldering iron, the number of soldering cycles for an arbitrary number of workpieces after cleaning, A soldering method that involves a different number of soldering cycles for subsequent workpieces. 2 For the first workpiece after cleaning, 2
2. The soldering method according to claim 1, wherein the soldering cycle is performed twice, and the soldering cycle is performed once for subsequent workpieces.