JPH0244080A - Production of inorganic building board - Google Patents
Production of inorganic building boardInfo
- Publication number
- JPH0244080A JPH0244080A JP19307788A JP19307788A JPH0244080A JP H0244080 A JPH0244080 A JP H0244080A JP 19307788 A JP19307788 A JP 19307788A JP 19307788 A JP19307788 A JP 19307788A JP H0244080 A JPH0244080 A JP H0244080A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- layer
- base layer
- blend
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Aftertreatments Of Artificial And Natural Stones (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野]
この発明は無機質建築用板の製造方法に関し、詳しくは
耐吸水性に(Iれた無機質建築用板の製造方法に関する
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing an inorganic building board, and more particularly, to a method for manufacturing an inorganic building board with improved water absorption resistance.
〔従来の技術]
一般に、セメント等を主成分として成形される無機質建
築用板材、特に平板状屋根[オ、外装壁板などにおいて
は、吸水性、吸湿性を聞えるため、表面に防水塗装を行
うことが必要である。[Prior art] Generally, inorganic building boards made of cement etc. as the main component, especially for flat roofs [e. It is necessary.
従って、従来このような無機質板材においては、表面装
飾を兼ねて各種色彩の防水塗装を施すのが通例である。Therefore, in the past, it has been customary for such inorganic board materials to be coated with waterproof coatings in various colors, which also serves as surface decoration.
ところで、F記従来においては、防水層が表面塗装膜と
され、史面には何の処pi!がへされ°Cいないため、
板材裏面よりの吸水、II!> ?Qにより上フ冒レノ
センスが発生し、それが製品表1m・\も析出して製品
外観をIiう問題が(Tった。By the way, in the past, the waterproof layer was a surface coating film, and there is no historical record of this. Because it is not cooled down to °C,
Water absorption from the back side of the board, II! >? There is a problem in that Q causes upper flaring, which precipitates on the surface of the product and deteriorates the appearance of the product (T).
もっとも、このような問題は、(反材の表裏面共に防水
性ケ料を塗布すれば良いが、ヘルト二1ンヘヤによる流
れ作業の工程で板材の表裏面に塗装を施すのは容易でな
く、反転装:L便布ローラー等多大な付帯設備が必要と
なり、実施が困工「ごある欠点が有った。However, this problem can be solved by applying a waterproof coating to both the front and back sides of the board, but it is not easy to apply paint to the front and back sides of the board during the assembly process using Helt 21 Nhair. Reversing equipment: Requires a large amount of incidental equipment such as L paper towel rollers, making it difficult to implement.
この発明は上記問題点に鑑み、実施が容易であると共に
、確実な防水性を発揮し15るPl(機質建築用板の製
造方法を提供することを目的としてなされたものである
。In view of the above-mentioned problems, the present invention has been made with the object of providing a method for manufacturing a 15% Pl (structured construction board) that is easy to implement and exhibits reliable waterproof properties.
即ち、この発明の無機質建築用板の製造方法はセメント
、シリカ、必要な補強繊維から成る無機質配合物より成
る基材層の片面に、該基材層用無機質配合物に1〜20
重量%の熱可塑性樹脂粉末を添加した配合物より成る層
を一体に積層して板状体を成形し、該成形物を自然養生
し、しかる後、(1:j記熱可・塑性(ろ1脂わ〕末の
溶融温度で高温養生を行うことを111徴とするもので
ある。That is, in the method for manufacturing an inorganic building board of the present invention, one side of a base material layer made of an inorganic compound consisting of cement, silica, and necessary reinforcing fibers is coated with 1 to 20% of the inorganic compound for the base layer.
A plate-like body is formed by integrally laminating layers made of a blend containing thermoplastic resin powder of % by weight, and the formed body is naturally cured. The 111th characteristic is to carry out high temperature curing at the melting temperature of the powder.
〔11用〕
この発明において用いられる基材層の無機質配合物は、
従来−最的に使用されるセメント配合物が適用可能であ
り、特に限定は無い。[For 11] The inorganic compound of the base material layer used in this invention is:
Conventional and most commonly used cement formulations are applicable and are not particularly limited.
この基材層に積層される層は、上記基材層無機質配合物
に1〜20重猷%の熱可塑性樹脂粉末を添加したものが
用いられる。The layer laminated on this base layer is made by adding 1 to 20% by weight of thermoplastic resin powder to the base layer inorganic compound.
なお、この樹脂+5)未添加無機質層の厚さは、前記基
材層に対し、同“γかそれ以下の17さて充分である。The thickness of this resin + 5) non-additive inorganic layer is 17 or less, which is sufficient for the base layer.
これらの層は、例えば乾式法であれば、コンヘヤ上に順
次各配合物をItに供給していくことや、抄造法であれ
ば、夫々の原料ハツトを用意し、順次これらの原料を抄
造し、積層していく手段が採られる。These layers can be formed by, for example, using a dry method to sequentially supply each compound onto a conveyor, or using a paper-making method to prepare raw material hats and sequentially paper-making these raw materials. , a method of stacking layers is adopted.
そして、これら積層(Q a質板材を自然養生により一
次養生し、しかる後、熱可塑性樹脂主5)末の)容量温
度で高温養生を行なえば添加した熱可塑性樹脂粉末が溶
融し、セメントマトリックス内に浸」Lし、防水層的な
構造に変化させると共に板)1表面に浸出して薄いフィ
ルム層を形成し、完全な防水層を形成する。Then, if these laminated materials (Qa board materials are firstly cured by natural curing, and then cured at high temperature at the volume temperature of the thermoplastic resin powder), the added thermoplastic resin powder will melt and form within the cement matrix. It is immersed in water to transform it into a waterproof layer-like structure, and leaches onto the surface of the board to form a thin film layer, forming a complete waterproof layer.
しかる後、常温にまで冷却すれば、片117がほぼ完全
な防水層となる。After that, when it is cooled to room temperature, the piece 117 becomes a nearly complete waterproof layer.
」二足において、熱可塑性樹脂主5)末の添加量を基材
層無機質配合物に対し1〜201]!量%とずろのは、
1重里%より少ないと防水効果が得られず、20重項%
より多くしても防水効果の向−ヒは無(逆に強度的に悪
影響が生じるからである。``In two cases, the amount of the thermoplastic resin main 5) powder added to the base layer inorganic compound is 1 to 201]! Amount% and Zurono are
If it is less than 1%, the waterproof effect cannot be obtained, and 20%.
Even if the amount is increased, there will be no improvement in the waterproof effect (on the contrary, it will have an adverse effect on the strength).
なお、上記成形板(オの他面には、二次養生前又は後に
防水■f4による塗装が施される。The other surface of the molded plate (E) is coated with waterproof f4 before or after the secondary curing.
従って、表面は塗料により、裏面は前述のプラス千ツク
による防水層が形成されることとなる。Therefore, a waterproof layer is formed on the front surface with the paint and on the back surface with the above-mentioned plastic coating.
次に、この発明の詳細な説明する。 Next, the present invention will be explained in detail.
〈実施例1〉
乾式1九により、セメント、シリカ、補強繊維より成る
常法に従ったセメンI配合物に対し、この配合物100
に′ll シ、アクリル分50%、スチレン分509’
Gより成るアクリル・スチレン系樹脂粉末を20重1%
添加した配合物を成形ヘル]・コンヘヤ上に約51の均
一厚さとなるよう散布し、次いで該層上に、l1iJ出
の常法によるセメント配合物のみを約7mmの均−p7
さに散布し、必要な水をHk重布供給後ロールにて全体
が5m…の厚さになるようロール圧縮して板材を成形し
た。<Example 1> By dry method 19, 100% of this mixture
50% acrylic, 509% styrene
20wt 1% acrylic/styrene resin powder consisting of G
The added mixture was spread on a molding layer to a uniform thickness of about 51 mm, and then a cement mixture of about 7 mm was spread on the layer by a conventional method from L1iJ.
After supplying the necessary water with Hk heavy cloth, the material was rolled and compressed to a thickness of 5 m to form a plate material.
ついで、成形板材を常温で24時間自然養生を行なった
。Next, the formed plate material was naturally cured at room temperature for 24 hours.
しかる後、セメント配合物より成る層上にアクリルエマ
ルジョン塗料により表面■装を施し、オートクレーブに
て、上記樹脂粉末が)8融し得る温度、即ら180’c
XIo時間の条件で高温高圧突気養生を行なった。Thereafter, the layer consisting of the cement mixture is coated with an acrylic emulsion paint, and heated in an autoclave to a temperature at which the resin powder can be melted, i.e. 180'C.
High temperature and high pressure sudden air curing was performed under the conditions of XIo hours.
〈実施例2〉
実施例1におGノるアクリル・スチレン系樹脂1介末の
添加量を7%とした他は実施例1と同様もこして(板材
を成形した。<Example 2> A plate material was molded in the same manner as in Example 1, except that the amount of the acrylic/styrene resin 1 powder added in Example 1 was changed to 7%.
〈実施例3〉
実施例1におけるアクリル・スチレン系樹脂粉末の添加
量を5%とした他は実施例Iと同様にして板材を成形し
た。<Example 3> A plate material was molded in the same manner as in Example I except that the amount of acrylic/styrene resin powder added in Example 1 was changed to 5%.
〈比較例〉
常法により成形した無機質板材を自然養生後、表面に防
水塗装を施し、高温高圧養生を行なった。<Comparative Example> After natural curing of an inorganic board material formed by a conventional method, waterproof coating was applied to the surface, and high temperature and high pressure curing was performed.
上記実施例1〜3、及び比較例で得た仮+Aを縦横10
cmにカットL、裏面を除く表面塗装面及び切断端面を
防水シールし、水【1号こ24時間浸漬放置し、吸水量
を試験したところ、下表の結果となった。The tentative +A obtained in Examples 1 to 3 and the comparative example above is 10
Cut L into cm, the coated surface except the back surface and the cut end surface were waterproof-sealed, and soaked in water [No. 1] for 24 hours to test the amount of water absorbed.The results are shown in the table below.
なお実施例1〜3と比較例との外観を11咬したところ
、実施例1〜2は第1U!Jに示すように板材lの裏面
IAに溶融樹脂による薄膜状の層2が形成されているの
が確認され、実施例3はかかる層は見られなかったが、
比較例と比較して樹脂分の含浸状態が確認された。なお
、図中、2は板材lの表面塗装層、11は常法によるセ
メント配合物の層、12は樹脂粉末を添加したヒメント
配合物の層を示す。In addition, when looking at the appearance of Examples 1 to 3 and the comparative example, Examples 1 to 2 are the 1st U! As shown in J, it was confirmed that a thin film-like layer 2 of molten resin was formed on the back surface IA of the plate l, and in Example 3, such a layer was not observed.
The state of resin impregnation was confirmed in comparison with the comparative example. In addition, in the figure, 2 shows the surface coating layer of the board l, 11 shows the layer of the cement mixture made by a conventional method, and 12 shows the layer of the cement mix added with resin powder.
防1できると共に、唯原料配分を異ならせるだけで従来
と同−装置を使用しても実施出来るので既存設備の利用
が図れ、経済的に実施出来るなど種々の効果を有する。This method has various effects, such as being able to prevent the above problems and also using the same equipment as before by simply changing the distribution of raw materials, making it possible to use existing equipment and being economical.
第1図はこの発明の実施例の要部拡大断面図である。 〔効果] FIG. 1 is an enlarged sectional view of a main part of an embodiment of the present invention. 〔effect]
Claims (1)
質配合物より成る基材層の片面に、該基材層用無機質配
合物に1〜20重量%の熱可塑性樹脂粉末を添加した配
合物より成る層を一体に積層して板状体を成形し、該成
形物を自然養生し、しかる後、前記熱可塑性樹脂粉末の
溶融温度で高温養生を行うことを特徴とする無機質建築
用板の製造方法。(1) From a mixture in which 1 to 20% by weight of thermoplastic resin powder is added to the inorganic mixture for the base layer on one side of the base layer consisting of an inorganic mixture consisting of cement, silica, and necessary reinforcing fibers. The manufacturing of an inorganic building board, characterized in that the layers thereof are laminated together to form a plate-like body, the formed body is naturally cured, and then high-temperature curing is performed at the melting temperature of the thermoplastic resin powder. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19307788A JP2632951B2 (en) | 1988-08-01 | 1988-08-01 | Manufacturing method of inorganic building board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19307788A JP2632951B2 (en) | 1988-08-01 | 1988-08-01 | Manufacturing method of inorganic building board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0244080A true JPH0244080A (en) | 1990-02-14 |
| JP2632951B2 JP2632951B2 (en) | 1997-07-23 |
Family
ID=16301830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19307788A Expired - Lifetime JP2632951B2 (en) | 1988-08-01 | 1988-08-01 | Manufacturing method of inorganic building board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2632951B2 (en) |
-
1988
- 1988-08-01 JP JP19307788A patent/JP2632951B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2632951B2 (en) | 1997-07-23 |
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