JPH0244731B2 - METSUKIBUTSUISAIYONOCHATSUKUSOCHI - Google Patents

Description

[Detailed Description of the Invention] The present invention provides a chuck device for transferring a plated item, which picks up a plated item from one side, transfers it to the other side, and lowers it.
In particular, the present invention relates to a chuck device suitable for transferring a strip-shaped plated object such as an IC lead frame from a transfer line onto a plating device.

When plating IC lead frames and other strip-shaped plated objects, it is necessary to simultaneously plate multiple sheets of the plated objects in order to increase plating efficiency. The speed of plating processing is set according to the processing speed of the entire line such as loading, pre-processing, main plating processing, post-processing, and unloading. However, although several types of devices of this type have been proposed and put into practice, the processing speed of the entire line has been relatively slow. Therefore, the applicant arranges and places a plurality of strip-shaped plated items on a cart in advance, treats the cart as a simple device, and transports the plated items together with the cart, automatically handling a large number of plated items efficiently. He was the first to propose a device that could perform plating well
See No. 99127]. Although the proposed plating device has considerably improved processing speed compared to conventional plating devices, it has been difficult to further increase the processing speed because the plating material is transferred via a trolley. For this reason, it was considered to use a group of feed rollers instead of a cart, but unless a device was developed that could pick up the plating material from the group of feed rollers on the line and transfer it to the plating device efficiently and reliably,
It has been found that even if the speed of the feed roller group or the plating device is increased, the intended processing speed cannot be improved. In addition, when transferring from the roller group to the plating device in this way, the plating processing conditions for the plating object, specifically the IC lead frame, ensure that the plating object is placed on the plating device in a constant position. The condition that must be met will be required.

This invention was made in view of the above-mentioned situation, and a pair of left and right chucks that hold the plating object from below are provided so as to be able to come into contact with and separate from each other. ), the object is to provide a chuck device for transferring a plating object that can be picked up from a plating device, transferred to the other side (for example, onto a mask plate of a plating device), and lowered and placed there. Specifically, the chuck device for transferring plated items according to the present invention is supported by a horizontal base frame that is movable up and down, and has a plurality of slide bars arranged side by side so as to be slidable in the left and right directions. A pair of left and right chucks with lower bending parts held from below are fixed to the lower surface of the slide bars corresponding to the even rows, and the other to the lower surface of the slide bars corresponding to the even rows, so that the chucks are connected to each other. The chuck is removable and has dampers arranged at both front and rear ends of the chuck so that they can be opened and closed.

The details of the present invention will be explained below with reference to the drawings showing one embodiment thereof.

First, this chuck device 1 for transferring plated items is
It is mainly composed of a base frame 2, a slide bar 3, a chuck 4, and a damper 5. The base frame 2 has mounting portions 7 at both ends 6 for connecting a vertical holder of another transfer device (described later in FIGS. 8 to 10), and has a horizontal rectangular frame body as a whole. The entire structure is movable up and down. In FIGS. 1 and 2, since the chuck device 1 for transferring plated objects has a substantially bilaterally symmetrical structure, only the left and right parts are shown and the right part is omitted for clarity.

A plurality of slide bars 3 are supported by the base frame 2 and are arranged horizontally [Fig.
(Figure). In the illustrated example, the slide bars 3A correspond to even-numbered columns and the slide bars 3B correspond to odd-numbered columns, and are arranged in parallel in the front-back direction. These slide bars 3A,
3B are each slid in left and right opposite directions (contact/separation directions) by "sliding means".
In the illustrated example, a bridge arm 8 and a pressure cylinder 9 are shown for sliding the slide bar 3A. That is, the two slide bars 3A are integrated by a bridge arm 8, and are slid in the left and right direction by operating the bridge arm 8 with a pressure cylinder 9.

Check 4 is the plated item to be transferred, such as an IC.
The number of rows corresponds to the number of strip-shaped plated objects 10 such as lead frames arranged, and there are one pair on the left and right, and in the illustrated example, there are two pairs on the front and back. The chucks 4A and 4B, which form a pair on the left and right, have a symmetrical shape and structure, and have a screw hole 11 for screwing on the lower surface side of the slide bar 3.
Each of them has an upper bent part 12 with an attachment, a lower bent part 13 that holds the plating object 10 from below, and a vertical part 16 having a stepped part 14 on the upper side and a cutout part 15 on the lower side. ing. The stepped portion 14 is connected to the other chuck 4A.
Or, the chucks 4A are lowered by the thickness of the upper bent portion 12 of 4B, and the chucks 4A,
I make sure that there is no problem with the slide of 4B. Further, the cutout portion 15 is formed on the vertical portion 16 at a necessary and sufficient height so as not to interfere with a feed roller 17, which will be described later.

The damper 5 is disposed at both the front and rear ends of the chuck 4 so as to be openable and closable. As mentioned above, a plurality of rows of chucks 4 are provided on the lower surface side of the slide bar 3, and the damper 5 is attached to the drive shaft 18 so as to be arranged one for each of the plurality of chucks 4 (specifically, a pair at the front and rear). They are each attached at a position corresponding to chuck 4. Rotating levers 19 are integrally provided at both ends of the drive shaft 18, and when the base frame 2 is lowered, they come into contact with baffle bars 20 that have been placed below, rotating the drive shaft 18, and each damper 5 I'm trying to open it. Incidentally, when the base frame 2 rises, the rotary lever 19 automatically separates from the baffle bar 20 and each damper 5 closes.

Next, the operation will be explained, but first, the state in which this chuck device is attached to the plated material transfer device shown in FIGS. 8 to 10 will be explained.

In FIGS. 8 to 10, reference numeral 30 denotes a rail, on one side of which a rotating arm 31 is provided so as to be freely rotatable within an angular range of 180 degrees, and on the other side a slider 32 that is provided so as to be freely movable back and forth. 33 is a rod, and the first one installed in front of it
A connecting arm 34 connects the rotating arm 31 and the slider 32. 35 is a vertical holder, the upper part of which is connected to the middle part of the rod 33, and the lower part of which is connected to the second
It is connected to the slider 32 via a connecting arm 36. A guide 37 is movable forward and backward on the rail 30 like the slider 32, and has bearings 38 and 39 at its horizontal bent portion. The bearing part 38 guides the vertical holder 35, and the bearing part 39 guides the auxiliary vertical holder 40, and both holders 35, 4
0 can surely move up and down in the vertical direction. A base frame 2 constituting the chuck device 1 has vertical holders 3 at mounting portions 7 at both ends 6 thereof.
By connecting the lower part of 5 and the auxiliary vertical holder 40, it can be suspended by both holders 35 and 40.
It is supported.

Next, the action will be explained.

In the plating material transfer device shown in FIGS. 8 to 10, by rotating its rotating arm 31, the vertical holder 35 moves up and down while drawing a horizontal elliptical locus X (FIG. 9). 1 moves in the same way, drawing a horizontal elliptical locus X. Now, as shown in FIG.
If 0 is being transferred, the pressure cylinder 9
If the slide bars 3A and 3B of the even numbered rows and the odd numbered rows are moved in opposite left and right directions via the bridge arm 8, the pair of chucks 4A and 4B are moved to the lower bent portion 1, respectively.
3 are separated and opened, and the entire chuck device descends in this state, and the lower bent portion 13 reaches the lower surface side of the plated object 10. As shown in FIG.
It can penetrate slightly below the pass line 41 formed by the plated object 10, and is positioned at a position slightly below the lower surface side of the plated object 10. At this time, the damper 5 is open as the chuck device 1 is lowered. In this state, if you operate the pressure cylinder 9 in the opposite direction, the left and right chucks 4A, 4
B approaches, and its lower bent portion 13 holds the lower surface side of the plated object 10. If the rotating arm 31 is rotated in the opposite direction, the chuck device 1
While holding the plating object 10, it moves to the right in FIG. 9, drawing a horizontal elliptical locus X, and reaches, for example, the mask plate 42 of the plating device (see FIG. 9). At this time, the damper 5 is "closed" as the chuck device 1 rises, and automatically becomes "open" as the chuck device 1 descends again. Then, due to this "closed" state, the chucks 4A, 4
The misalignment of the plating object 10 occurring in the longitudinal direction of B is corrected to ensure accurate holding and positioning, and in this state, as described at the beginning, by opening the pair of chucks 4A and 4B, the lower bent portion for the plating object 10 is fixed. The held state of the plated object 13 is released, and the plated object 10 is transferred to the intended location with accurate positioning. And this “transfer” is a 10-year-old thing.
By simultaneously using a plurality of chucks 4 corresponding to the number of rows of chucks 4, it is possible to simultaneously pick up a large number of plates 10 from one chuck, transfer them to the other chuck, unload them, and place them there.

As explained above, according to the present invention, a pair of left and right chucks are provided on each of the even-numbered slide bars and the even-numbered slide bars so that they can be brought into contact with and separated from each other, making it easier to hold and hold plating objects. Since the front and back of the chuck are closed with dampers when the chuck is being moved, the plated object will not come off the chuck, and if there is any misalignment of the plated object in the front and back direction of the chuck, it will be corrected, so it can be moved to a fixed position. It is possible to achieve extremely reliable transfer processing for plated items such as IC lead frames, which are strongly required to be mounted, and moreover, by attaching chucks with the number of rows corresponding to the number of lined up items in advance, it is possible to transfer multiple pieces. This has the advantage that it is possible to simultaneously hold, transport, and place a number of plated items at a desired location.

[Brief explanation of the drawing]

FIG. 1 is a plan view of the left part of a chuck device showing an embodiment of the present invention, FIG. 2 is a sectional view taken along the line of FIG. 1, FIGS. The figures are -, -, -, - in Fig. 1, respectively.
7 is a schematic perspective view showing a pair of left and right chucks, and two pairs of front and rear chucks; FIGS. 8 to 1
Figure 0 shows the plating material transfer device equipped with the above-mentioned chuck device, Figure 8 is its plan view, Figure 9 is its side view, and Figure 10 is an enlarged view from the direction of arrow X in Figure 9. FIG. 1...chuck device, 2...base frame,
3... Slide bar, 4... Chack, 5... Damper, 8... Bridge arm, 9... Pressure cylinder, 10... Plating object, 17... Feed roller, 18... Drive shaft, 19... Rotation lever.

Claims (1)

[Scope of Claims] 1. A horizontal base frame that can freely move up and down supports a plurality of slide bars that are arranged side by side so that they can slide freely in the left and right directions, and left and right sides with lower bent parts that hold the plating object from above. One of the chucks is fixed to the lower surface of the slide bar corresponding to the even numbered rows, and the other chuck is fixed to the lower surface of the slide bar corresponding to the odd numbered rows, so that the chucks can be brought into contact with and separated from each other, and at both the front and rear ends of the chuck. A plated object moving device in which a damper is arranged so that it can be opened and closed according to the connection and separation of the chucks, and when the damper is in the closed state, the positional deviation of both ends of the held plated object is corrected. chuck device for mounting.