JPH0244793A - Electronic circuit device - Google Patents
Electronic circuit deviceInfo
- Publication number
- JPH0244793A JPH0244793A JP63196545A JP19654588A JPH0244793A JP H0244793 A JPH0244793 A JP H0244793A JP 63196545 A JP63196545 A JP 63196545A JP 19654588 A JP19654588 A JP 19654588A JP H0244793 A JPH0244793 A JP H0244793A
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing plate
- circuit device
- flexible
- electronic circuit
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は補強板を一部に接着されたフレキシフルプリン
ト配線板を用いる電子回路装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic circuit device using a flexible printed wiring board to which a reinforcing plate is partially bonded.
従来の技術
近年、機器の小型化のために可とう性フレキシブルプリ
ント配線板（以後フレキ基板と呼ぶ）が使用されてきて
いる。このフレキ基板は可とり性を持つため、容易に屈
曲でき、機器の電子部品を実装した基板として機器の小
型化に有効な配線や取り付けが実現できる。特に電子部
品を固定したりフレキ基板自体の補強のためにフェノー
ル板や金属板をフレキ基板の一部に接着することがあり
、その構造は第４図に示すようにフレキ基板２の一端に
補強板１が接着剤で固定され、補強板１に接着されたフ
レキ基板２上に電子部品４が実装されている。フレキ基
板２の他端は屈曲が可能な屈曲部３で、他の場所に取付
けられる電子部品実装基板や外部接続用のコネクタ等へ
配線することが可能である。第５図は第１図を側面から
見たものでフレキ基板２は補強板１と接着剤５で固定さ
れている。2. Description of the Related Art In recent years, flexible printed wiring boards (hereinafter referred to as flexible boards) have been used to downsize devices. Because this flexible board is flexible, it can be easily bent, and as a board on which electronic components of devices are mounted, it can be used for wiring and mounting that is effective for downsizing devices. In particular, a phenol plate or metal plate is sometimes glued to a part of the flexible board to fix electronic components or to reinforce the flexible board itself, and its structure is reinforced at one end of the flexible board 2 as shown in Figure 4. A plate 1 is fixed with an adhesive, and an electronic component 4 is mounted on a flexible substrate 2 bonded to the reinforcing plate 1. The other end of the flexible board 2 is a bendable part 3 that can be wired to an electronic component mounting board mounted elsewhere, a connector for external connection, or the like. FIG. 5 is a side view of FIG. 1, in which the flexible substrate 2 is fixed to the reinforcing plate 1 with an adhesive 5.
発明が解決しようとする課頭
しかしながらただ単に接着剤で補強板に固定されている
フレキ基板は補強板で固定されていない屈曲部が外的機
械ストレスにより折り曲げられたり、引っばられた際に
接着剤で固定された補強板よりフレキ基板が容量に引き
剥され、フレキ基板に実装された電子部品やフレキ基板
の銅箔バターに悪影響を及ぼす危険があった。Problems to be Solved by the Invention However, a flexible board that is simply fixed to a reinforcing plate with an adhesive will not adhere when the bent part that is not fixed with the reinforcing plate is bent or pulled due to external mechanical stress. There was a risk that the flexible board would be peeled off from the reinforcing plate fixed with the adhesive, which would have an adverse effect on the electronic components mounted on the flexible board and the copper foil butter on the flexible board.
本発明はこのような問題点を解決するもので、外部から
の機械的ストレスによりフレキ基板が補強板から容易に
剥れないようにすることを目的とする。The present invention is intended to solve these problems, and aims to prevent the flexible substrate from easily peeling off from the reinforcing plate due to external mechanical stress.
課題を解決するだめの手段
本発明は上記の問題点に鑑みてなされたものであって、
補強板に接着されたフレキ基板の屈曲されるフレキ基板
部近くに半田付はランドを設け、半田を付着させたもの
である。Means for Solving the Problems The present invention has been made in view of the above problems, and includes:
For soldering, a land is provided near the bent portion of the flexible substrate bonded to the reinforcing plate, and solder is applied to the land.
作用
以上の構成とすれば、屈曲部の近くに設けた半田付はラ
ンドに半田を付着させることによって屈曲部から加われ
る機械的ストレスに対して補強板に接着されたフレキ基
板はフレキ基板に剛性を持つこととなジ容易に補強板か
ら引き剥れない様になる。If the configuration is more than just the function, the soldering provided near the bending part will make the flexible board adhered to the reinforcing plate rigid against the mechanical stress applied from the bending part by attaching the solder to the land. By holding the reinforcing plate, it will not be easily torn off from the reinforcing plate.
実施例
次に第１図〜第３図の図面を用いて本発明の一実施例を
説明する。Embodiment Next, an embodiment of the present invention will be described with reference to FIGS. 1 to 3.
第１図において補強板１１に接着されたフレキ基板１２
の屈曲部１３の近くに、半田付けされた半田付はランド
１４を設けたものである。第２図は屈曲部１３から外的
要因により引っはシの機械的ストレス人が働いた図であ
り、可とう性を持っフレキ基板１２の半田付はランド１
４上に半田付けされた半田１５のために剛性を持つ様に
なり補強板１１に接着剤２０で固定されたフレキ基板１
２は容易に引き剥せない様になる。尚、この半田付はラ
ンド１４の半田１５はフレキ基板１２に剛性を与えるも
のであり、電子部品１６で構成される回路・４ターン１
７とは別パターンとした方がよく、特に機械的ストレス
が加わるため、回路パターン１７は半田付はランド１４
より少し離して配置した方が望ましい。又、本実施例で
は、半田付ランド１４をフレキ基板１２を固定している
補強板１１の頂点１８付近に配置しており、フレキ基板
１２の屈曲部１３がねじれて機械的ストレスが加わる場
合、補強板１１の頂点１８付近に機械的ストレスが集中
するので引き剥し強度を損なうことかない。In FIG. 1, the flexible substrate 12 is bonded to the reinforcing plate 11.
A soldering land 14 is provided near the bent portion 13 of the solder. Figure 2 shows a mechanical stress applied by a person who pulled the bent part 13 due to an external factor.
The flexible substrate 1 has rigidity due to the solder 15 soldered on the substrate 4 and is fixed to the reinforcing plate 11 with an adhesive 20.
2 cannot be easily peeled off. In addition, in this soldering, the solder 15 on the land 14 gives rigidity to the flexible board 12, and the circuit consisting of electronic components 16, 4 turns 1
It is better to use a different pattern from land 14 when soldering circuit pattern 17, especially since mechanical stress is applied.
It is preferable to place them a little further apart. Furthermore, in this embodiment, the soldering land 14 is arranged near the vertex 18 of the reinforcing plate 11 that fixes the flexible board 12, so that when the bent part 13 of the flexible board 12 is twisted and mechanical stress is applied, Since mechanical stress is concentrated near the apex 18 of the reinforcing plate 11, the peel strength is not impaired.
第３図は本発明の他の実施例で、両面に銅箔パターンが
ある両面フレキ基板の例であり、裏面パターン１９の間
に半田付はランド１４が配置される様なくし形のランド
を設け、半田付けされたものであり、屈曲部１３からの
引っばり等の機械的ストレスに対して引き剥し強度が向
上する。FIG. 3 shows another embodiment of the present invention, which is an example of a double-sided flexible board with copper foil patterns on both sides, and a comb-shaped land is provided between the back patterns 19 so that soldering lands 14 are arranged. , which is soldered to improve peel strength against mechanical stress such as pulling from the bent portion 13.
これら引き剥し強度を向上させる半田付はランドはフレ
キ基板のパターン形成時に他の電子回路構成用のパター
ンと同時に形成することができ、半田付けも他の電子部
品を半田付けする時に半田付けできるので従来の製造工
程で容易に引き剥し強度を向上させる半田付はランドを
形成させることができる。These soldering properties that improve peel strength can be used to form lands at the same time as patterns for other electronic circuits when forming patterns on flexible circuit boards, and can be soldered when other electronic components are soldered. Soldering that easily improves peel strength through conventional manufacturing processes can form lands.
発明の効果
以上述べてきた様に本発明は、補強板に接着されたフレ
キ基板の屈曲部付近に半田付はランドを設けることによ
り、フレキ基板と補強板との引き剥し強度を向上させる
ことができ、かつ容易に製造することができるものであ
る。Effects of the Invention As described above, the present invention improves the peel strength between the flexible substrate and the reinforcing plate by providing a soldering land near the bent portion of the flexible substrate bonded to the reinforcing plate. and can be easily manufactured.
第１図は本発明の第１の実施例による電子回路装置の要
部を示す平面図、第２図は第１図の要部の側面図、第３
図は本発明の第２の実施例による電子回路装置の要部を
示す平面図、第４図は従来例による電子回路装置の要部
を示す平面図、第５図は第４図の側面図である。
１１・・・・・・補強板、１２・・・・・・フレキ基板
、１３・・・屈曲部、１４・・・・・半田付はランド、
１６・・・・・半田、２０・・・・接着剤。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名第
図
１−一 桶 彊 叛
１２−−− フ し キ
１３− 足曲部
暮
板
第
図
第
図1 is a plan view showing the main parts of an electronic circuit device according to a first embodiment of the present invention, FIG. 2 is a side view of the main parts of FIG. 1, and FIG.
4 is a plan view showing the main parts of an electronic circuit device according to a second embodiment of the present invention, FIG. 4 is a plan view showing main parts of an electronic circuit device according to a conventional example, and FIG. 5 is a side view of FIG. 4. It is. 11... Reinforcement plate, 12... Flexible board, 13... Bent part, 14... Soldering land,
16...Solder, 20...Adhesive. Name of agent: Patent attorney Shigetaka Awano and one other person
Claims (1)
フレキシブルプリント配線板の一部に屈曲部を残して接
着された補強板と、屈曲部に隣接する前記補強板で接着
された前記フレキシブルプリント配線板上の前記屈曲部
付近に半田付けランドを設けてなる電子回路装置。A flexible printed wiring board having flexibility, a reinforcing plate bonded to the flexible printed wiring board with a bent portion left in a part thereof, and the flexible printed wiring board bonded to the reinforcing plate adjacent to the bent portion. An electronic circuit device comprising a soldering land provided near the bent portion of the electronic circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63196545A JPH0244793A (en) | 1988-08-05 | 1988-08-05 | Electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63196545A JPH0244793A (en) | 1988-08-05 | 1988-08-05 | Electronic circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0244793A true JPH0244793A (en) | 1990-02-14 |
| JPH0519314B2 JPH0519314B2 (en) | 1993-03-16 |
Family
ID=16359523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63196545A Granted JPH0244793A (en) | 1988-08-05 | 1988-08-05 | Electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244793A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263122A (en) * | 2007-04-13 | 2008-10-30 | Oki Electric Ind Co Ltd | Optical module apparatus |
-
1988
- 1988-08-05 JP JP63196545A patent/JPH0244793A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008263122A (en) * | 2007-04-13 | 2008-10-30 | Oki Electric Ind Co Ltd | Optical module apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0519314B2 (en) | 1993-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
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| FPAY | Renewal fee payment (event date is renewal date of database) |
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| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
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