JPH0341486Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to printed wiring boards used in automobile radios and other equipment.

Conventional structure and its problems In general, rigid substrates are attached at regular intervals to flexible substrates having a conductor layer formed on their surfaces, and the flexible substrate has a center portion where the rigid substrate is not attached. A printed wiring board in which the above-mentioned flexible substrate can be bent is well known. However, as shown in FIG. 1, all of the conventionally used printed wiring boards of this type have conductor layers 3 formed on a flexible substrate 2 for forming a circuit pattern, and are bendable. In many cases, the amount of the conductor layer 3 formed in a portion is relatively small. Therefore, in this type of device, the flexible substrate 2 is curved at the center as shown in FIG. When an external force as shown by arrows A, B, C, and D is applied between the layers 3, the curved portion is easily deformed as shown by the dotted line in Figure 2, and the conductor layer 3 itself is deformed. This was not very desirable as it could be damaged.

Furthermore, the lower end of the conventional printed wiring board shown in FIG. 2 is inserted into the elongated hole of the main printed wiring board, and the conductive pattern formed on the back side of the main printed wiring board and the printed wiring board shown in FIG. The printed wiring board shown in FIG. 2 is connected to the conductor layer 3 by solder, but since the elasticity of the flexible board 2 is small, the force that separates the rigid boards 1 and 1 from each other is weak, and the printed wiring board shown in FIG. The temporary fixation was not stable, and the soldering between the conductor layers (conductor patterns) of both printed wiring boards became unstable.

In FIGS. 1 and 2, 4 is a circuit component mounted between the conductor layers 3, and 5 is an adhesive layer.

Purpose of the invention The present invention solves the above-mentioned problems of the conventional example. It can easily prevent deformation, damage, etc. of the flexible circuit board, and can securely temporarily fix the main printed wiring board to the square hole. It is an object of the present invention to provide a printed wiring board with a simple structure that can be stably soldered to the printed wiring board.

Structure of the Invention The present invention is constructed so that a reinforcing conductor layer is formed on a bendable portion of a flexible substrate in addition to the conductor layer constituting the circuit pattern.

DESCRIPTION OF THE EMBODIMENTS FIG. 3 shows an embodiment of the printed wiring board of the present invention, and the same reference numerals as in FIGS. 1 and 2 in the figure are shown in FIGS. 1 and 2. It shows the same thing. Reference numeral 6 denotes a reinforcing conductor layer formed on the portion of the flexible substrate 2 to which the rigid substrate 1 is not attached, and both ends of this conductor layer 6 are attached to the portion where the rigid substrate 1 is attached. It has been extended until reaching

In the above embodiment, in addition to the conductor layer 3 constituting the circuit pattern, a reinforcing conductor layer 6 is formed on the portion of the flexible substrate 2 to which the rigid substrate 1 is not attached, as shown in FIG. Even if an external force is applied to the flexible substrate 2 in the direction of the arrow while the flexible substrate 2 is curved around the part to which the rigid substrate 1 is not attached, it will easily deform due to the presence of the conductor layers 3 and 6. It is not damaged and is extremely advantageous in practice.

Further, according to the above embodiment, since the reinforcing conductor layer 6 is formed in the portion of the flexible substrate 2 that is to be curved, the elasticity of the curved portion of the flexible substrate 2 is increased, and as shown in FIG. ，
The force that causes 1 to move away from each other increases. For this reason,
When the printed wiring board shown in FIG. 3 is inserted into the square hole of the main printed wiring board, the elasticity of the flexible substrate 2 exerts a force in the direction of separating the rigid substrates 1, 1 from each other, causing the lower ends of the flexible substrate 2 to is pressed against the hole wall of the square hole of the main printed wiring board, and the printed wiring board is securely temporarily fixed to the main printed wiring board as shown in Fig. 3, and the conductive layer (circuit pattern ), the soldering is stable and reliability is improved.

Effects of the Invention As is clear from the above embodiments, the present invention has a reinforcing conductor layer formed in addition to the conductor layer constituting the circuit pattern on the portion of the flexible substrate that is to be curved. Even when an external force is applied, the reinforcing conductor layer can effectively protect the conductor layer constituting the circuit pattern, and damage to the flexible board and the conductor layer constituting the circuit pattern can be significantly reduced. It has the advantage of being able to and,
According to the present invention, the reinforcing conductor layer can be formed at the same time as the conductor layer constituting the circuit pattern,
It is easy to manufacture and is extremely advantageous in practice.

In addition, according to the present invention, since a reinforcing conductor layer is formed on the curved portion of the flexible board, the elasticity of the flexible board that is bent 180° to return to a flat surface is increased, and the corners of the main printed wiring board are increased. This has the advantage that the temporary fixation in the hole is reliable, the soldering of both printed wiring boards is stable, and reliability is improved.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional printed wiring board, FIG. 2 is a perspective view of the printed wiring board in use, and FIG. 3 is a perspective view of an embodiment of the printed wiring board of the present invention. DESCRIPTION OF SYMBOLS 1... Rigid board, 2... Flexible board, 3... Conductor layer, 4... Circuit component, 5... Adhesive layer, 6... Reinforcement conductor layer.

Claims (1)

[Scope of utility model registration request] First and second rigid substrates are mounted at a constant interval on one side of a flexible substrate provided with a conductor layer constituting a circuit pattern, and the flexible substrate is mounted approximately between the first and second rigid substrates. A reinforcing conductor layer is formed on the curved portion when the flexible substrate is bent by 180 degrees to increase the elasticity of the curved portion of the flexible substrate, and the lower end of the bent flexible substrate is inserted into the square hole of another printed wiring board. Printed wiring board that can be inserted.