JPH0244849B2 - JIKOKOKASEIJUSHINOSEIZOHOHO - Google Patents
JIKOKOKASEIJUSHINOSEIZOHOHOInfo
- Publication number
- JPH0244849B2 JPH0244849B2 JP18828685A JP18828685A JPH0244849B2 JP H0244849 B2 JPH0244849 B2 JP H0244849B2 JP 18828685 A JP18828685 A JP 18828685A JP 18828685 A JP18828685 A JP 18828685A JP H0244849 B2 JPH0244849 B2 JP H0244849B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- parts
- self
- resin
- michael
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 68
- 239000011347 resin Substances 0.000 claims description 68
- 229920000647 polyepoxide Polymers 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 22
- -1 amine imide Chemical class 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 5
- 125000003342 alkenyl group Chemical group 0.000 claims description 3
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 150000007522 mineralic acids Chemical class 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 238000000576 coating method Methods 0.000 description 36
- 239000011248 coating agent Substances 0.000 description 34
- 238000001723 curing Methods 0.000 description 32
- 238000006243 chemical reaction Methods 0.000 description 28
- 229920000768 polyamine Polymers 0.000 description 23
- 238000004070 electrodeposition Methods 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- 239000007787 solid Substances 0.000 description 19
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 18
- 125000002091 cationic group Chemical group 0.000 description 17
- 239000006185 dispersion Substances 0.000 description 17
- 239000000203 mixture Substances 0.000 description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 229910001873 dinitrogen Inorganic materials 0.000 description 14
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 10
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 10
- 150000001412 amines Chemical class 0.000 description 9
- 125000003277 amino group Chemical group 0.000 description 9
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 238000005406 washing Methods 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 125000001841 imino group Chemical group [H]N=* 0.000 description 6
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 150000004658 ketimines Chemical class 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 150000008442 polyphenolic compounds Chemical class 0.000 description 4
- 235000013824 polyphenols Nutrition 0.000 description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- QHJABUZHRJTCAR-UHFFFAOYSA-N n'-methylpropane-1,3-diamine Chemical compound CNCCCN QHJABUZHRJTCAR-UHFFFAOYSA-N 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 2
- HXVNBWAKAOHACI-UHFFFAOYSA-N 2,4-dimethyl-3-pentanone Chemical compound CC(C)C(=O)C(C)C HXVNBWAKAOHACI-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- BKMMTJMQCTUHRP-UHFFFAOYSA-N 2-aminopropan-1-ol Chemical compound CC(N)CO BKMMTJMQCTUHRP-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 2
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000006845 Michael addition reaction Methods 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 2
- 229910000165 zinc phosphate Inorganic materials 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- AFPIWWDEGJLLCL-UHFFFAOYSA-N 1,3,2,4$l^{2}-dioxasilaplumbetane 2-oxide Chemical compound [Pb+2].[O-][Si]([O-])=O AFPIWWDEGJLLCL-UHFFFAOYSA-N 0.000 description 1
- ITWBWJFEJCHKSN-UHFFFAOYSA-N 1,4,7-triazonane Chemical compound C1CNCCNCCN1 ITWBWJFEJCHKSN-UHFFFAOYSA-N 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-dioxonaphthalene Natural products C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- RQEUFEKYXDPUSK-UHFFFAOYSA-N 1-phenylethylamine Chemical compound CC(N)C1=CC=CC=C1 RQEUFEKYXDPUSK-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- ZDRSNHRWLQQICP-UHFFFAOYSA-N 2-tert-butyl-4-[2-(3-tert-butyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C1=C(O)C(C(C)(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)(C)C)=C1 ZDRSNHRWLQQICP-UHFFFAOYSA-N 0.000 description 1
- DVFGEIYOLIFSRX-UHFFFAOYSA-N 3-(2-ethylhexoxy)propan-1-amine Chemical compound CCCCC(CC)COCCCN DVFGEIYOLIFSRX-UHFFFAOYSA-N 0.000 description 1
- FNVOFDGAASRDQY-UHFFFAOYSA-N 3-amino-2,2-dimethylpropan-1-ol Chemical compound NCC(C)(C)CO FNVOFDGAASRDQY-UHFFFAOYSA-N 0.000 description 1
- LPUBRQWGZPPVBS-UHFFFAOYSA-N 3-butoxypropan-1-amine Chemical compound CCCCOCCCN LPUBRQWGZPPVBS-UHFFFAOYSA-N 0.000 description 1
- TWXCJZHSMRBNGO-UHFFFAOYSA-N 3-decoxypropan-1-amine Chemical compound CCCCCCCCCCOCCCN TWXCJZHSMRBNGO-UHFFFAOYSA-N 0.000 description 1
- ZRJOUVOXPWNFOF-UHFFFAOYSA-N 3-dodecoxypropan-1-amine Chemical compound CCCCCCCCCCCCOCCCN ZRJOUVOXPWNFOF-UHFFFAOYSA-N 0.000 description 1
- SOYBEXQHNURCGE-UHFFFAOYSA-N 3-ethoxypropan-1-amine Chemical compound CCOCCCN SOYBEXQHNURCGE-UHFFFAOYSA-N 0.000 description 1
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 description 1
- UTOXFQVLOTVLSD-UHFFFAOYSA-N 3-propoxypropan-1-amine Chemical compound CCCOCCCN UTOXFQVLOTVLSD-UHFFFAOYSA-N 0.000 description 1
- ZGZVGZCIFZBNCN-UHFFFAOYSA-N 4,4'-(2-Methylpropylidene)bisphenol Chemical compound C=1C=C(O)C=CC=1C(C(C)C)C1=CC=C(O)C=C1 ZGZVGZCIFZBNCN-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical class C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Chemical compound NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical class CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001413 amino acids Chemical group 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000012223 aqueous fraction Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- QFUSOYKIDBRREL-UHFFFAOYSA-N but-2-en-1-amine Chemical compound CC=CCN QFUSOYKIDBRREL-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 description 1
- 229940043276 diisopropanolamine Drugs 0.000 description 1
- 229940043279 diisopropylamine Drugs 0.000 description 1
- 239000000539 dimer Chemical class 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 150000001469 hydantoins Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- GKQPCPXONLDCMU-CCEZHUSRSA-N lacidipine Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1C1=CC=CC=C1\C=C\C(=O)OC(C)(C)C GKQPCPXONLDCMU-CCEZHUSRSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- KVKFRMCSXWQSNT-UHFFFAOYSA-N n,n'-dimethylethane-1,2-diamine Chemical compound CNCCNC KVKFRMCSXWQSNT-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- VPPWQRIBARKZNY-UHFFFAOYSA-N oxo(diphenyl)tin Chemical compound C=1C=CC=CC=1[Sn](=O)C1=CC=CC=C1 VPPWQRIBARKZNY-UHFFFAOYSA-N 0.000 description 1
- 125000005429 oxyalkyl group Chemical group 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- IAWXHEPLJXAMSG-UHFFFAOYSA-N pent-2-en-1-amine Chemical compound CCC=CCN IAWXHEPLJXAMSG-UHFFFAOYSA-N 0.000 description 1
- IGEIPFLJVCPEKU-UHFFFAOYSA-N pentan-2-amine Chemical compound CCCC(C)N IGEIPFLJVCPEKU-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Description
本発明は、カチオン電着塗装に適した、水分散
性で低温硬化性の自己硬化性樹脂の製造方法に関
するものである。
The present invention relates to a method for producing a water-dispersible, low-temperature-curing self-curing resin suitable for cationic electrodeposition coating.
カチオン電着塗装は、これまでのアニオン電着
塗装に比べて、被塗体の防錆力が優れているた
め、自動車塗装分野を中心として、近年その使用
が増加してきている。
このようなカチオン電着塗装に用いられる樹脂
について、種々のものが提案されているが、その
一つに、特願昭60−72924号に示されたものがあ
る。
該発明は、アミノ基又はイミノ基を有するポリ
アミン樹脂に、アミンイミド基をペンダントに導
入することによつて、次式
のように、アミンイミド基が120℃以上170℃以
下、好ましくは140〜160℃の低温で熱分解後、転
位して第三アミンが脱離し、イソシアネート基が
生成し、その生成したイソシアネート基が、樹脂
中の水酸基、アミノ基又はイミノ基と反応して三
次元構造を形成して不融不溶の硬化塗膜が得られ
ること、及びアミンイミド基が酸で中和されてア
シルヒドラジニウム塩基となることによつて、陽
イオン性樹脂の安定な水性分散液が得られること
を利用してカチオン電着塗装に適した樹脂組成物
としたものである。
Cationic electrodeposition coating has superior anti-corrosion properties for coated objects compared to conventional anionic electrodeposition coating, and therefore its use has been increasing in recent years, mainly in the automotive coating field. Various resins have been proposed for use in such cationic electrodeposition coatings, one of which is disclosed in Japanese Patent Application No. 72924/1983. The invention provides the following formula by introducing an amine imide group pendant into a polyamine resin having an amino group or an imino group. After the amine imide group is thermally decomposed at a low temperature of 120°C to 170°C, preferably 140 to 160°C, the tertiary amine is eliminated by rearrangement and an isocyanate group is generated, and the generated isocyanate group is It reacts with the hydroxyl group, amino group, or imino group in the resin to form a three-dimensional structure to obtain an infusible and insoluble cured coating, and the amine imide group is neutralized with acid to become an acylhydrazinium base. In particular, by taking advantage of the fact that a stable aqueous dispersion of a cationic resin can be obtained, the resin composition is made suitable for cationic electrodeposition coating.
【発明が解決しようとする問題点】
特開昭60−72924号公報に記載のアミンイミド
基含有アミノ変性ポリエポキシド(以下、自己硬
化性樹脂と称する)を製造する方法は、第一工程
で、ポリエポキシドと第一モノアミン又はケチミ
ンブロツク化アミノ基含有ポリアミンと反応させ
てポリアミン樹脂を得、次に第二工程でポリアミ
ン樹脂とアミンイミド基を有するエチレン性不飽
和化合物(以下、アミンイミド化合物と称する)
とを反応させることによつて行われる。
しかし、この製造工程では、当該自己硬化性樹
脂中に占める第一工程のポリアミン樹脂の比率が
非常に大きいため、ポリアミン樹脂を事前に一定
容積の製造装置で数バツチ分まとめて製造するこ
とができず、1バツチ分毎にポリアミン樹脂を製
造する必要がある。又、ポリアミン樹脂を得るた
めには、その樹脂中に、マイケル形付加が可能な
活性水素を有する窒素含有基を導入する必要か
ら、ポリエポキシドのエポキシ基に付加するアミ
ン類として、第一モノアミン、ケチミンブロツク
化アミノ基含有ポリアミン又はその混合物を用い
なければならない。この場合に、第一モノアミン
を用いると、ポリエポキシドとのゲル化を防止す
るために大過剰に使用し、且つ、反応後は未反応
アミンの除去を必要とする。又、ケチミンブロツ
ク化アミノ基含有ポリアミンはエポキシ基と反応
する段階では、イミノ基を含有しているため、ゲ
ル化しないが、ポリアミンを使用するため、樹脂
中の窒素含有基の濃度が必要以上に増加して塗膜
性能等が低下する傾向がある。[Problems to be Solved by the Invention] The method for producing an amine imide group-containing amino-modified polyepoxide (hereinafter referred to as a self-curing resin) described in JP-A No. 60-72924 involves the step of manufacturing a polyepoxide and a polyepoxide in the first step. A polyamine resin is obtained by reacting with a first monoamine or a ketimine-blocked amino group-containing polyamine, and then in a second step, the polyamine resin and an ethylenically unsaturated compound having an amine imide group (hereinafter referred to as an amine imide compound) are produced.
This is done by reacting with. However, in this manufacturing process, the proportion of the polyamine resin in the first step in the self-curing resin is very large, so it is not possible to manufacture several batches of polyamine resin in advance using a manufacturing device with a fixed volume. First, it is necessary to produce polyamine resin for each batch. In addition, in order to obtain a polyamine resin, it is necessary to introduce into the resin a nitrogen-containing group having an active hydrogen that is capable of Michael-type addition. Polyamines containing blocked amino groups or mixtures thereof must be used. In this case, if the primary monoamine is used, it must be used in large excess to prevent gelation with the polyepoxide, and unreacted amine must be removed after the reaction. In addition, the ketimine-blocked amino group-containing polyamine does not gel at the stage of reaction with the epoxy group because it contains imino groups, but since the polyamine is used, the concentration of nitrogen-containing groups in the resin may be higher than necessary. There is a tendency for the coating film performance to deteriorate due to the increase in the amount of water.
本発明者らは、上記のような問題点を解決する
ため、鋭意研究を重ねた結果、アミンイミド化合
物と第一モノアミンとのマイケル形付加物を製造
し、次にこのマイケル型付加物をポリエポキシド
に付加させることによつて、容易に自己硬化性樹
脂を得ることができ、その結果当該自己硬化性樹
脂の製造工程の簡略化及び短縮化が可能となると
同時に、樹脂中の窒素含有基濃度が必要以上に増
加しないため、塗膜性態に悪影響を及ぼさないこ
とを見い出し、本発明を完成するに至つたもので
ある。
即ち、本発明は、アミンイミド基を有するエチ
レン性不飽和化合物に第一モノアミンを付加させ
て、下記一般式
(式中、R1は炭素数2〜30のアルキル基、ア
ルコキシアルキル基、アルケニル基、ヒドロキシ
アルキル基又はアリール基を表し、R2,R3,R4
はそれぞれ炭素数1〜8のアルキル基又はヒドロ
キシアルキル基を表す。)
のマイケル形付加物を得、更にポリエポキシドに
該マイケル形付加を付加させて、アミンイミド基
含有アミノ変性ポリエポキシドを得ることを特徴
とする自己硬化性樹脂の製造法に関するものであ
る。
本発明に用いられるアミンイミド基を有するエ
チレン性不飽和化合物としては、例えば1,1,
1−トリメチルアミンメタクリルイミド、1,1
−ジメチル−1−エチルアミンメタクリルイミ
ド、1,1−ジメチル−1−(2−ヒドロキシプ
ロピル)アミンメタクリルイミド等があげられ
る。
次に本発明に用いられる第一モノアミンは、炭
素数が2〜30のアルキル基、アルコキシルアルキ
ル基、アルケニル基、ヒドロキシアルキル基又は
アリール基を有するものであればよく、例えば、
エチルアミン、プロピルアミン、ブチルアミン、
1−メチルブチルアミン、ヘキシルアミン、2−
エチルヘキシルアミン、3−メトキシプロピルア
ミン、3−エトキシプロピルアミン、プロポキシ
プロピルアミン、ブトキシプロピルアミン、2−
エチルヘキシロキシプロピルアミン、デシロキシ
プロピルアミン、ドデシロキシプロピルアミン、
1−アミノ−2−プロペン、1−アミノ−2−ブ
テン、1−アミノ−2−ペンテン、オレイルアミ
ン、2−アミノエタノール、2−アミノ−1−プ
ロパノール、2,2−ジメチル−3−アミノ−プ
ロパノール、フエニルアミン、ベンジルアミン、
α−フエネチルアミン、β−フエネチルアミン等
がある。第一モノアミンは、アミンイミド化合物
にマイケル形付加して、その後のポリエポキシド
との反応に有用なイミノ基が形成される。
ポリエポキシドに付加させるアミンとしては、
上記のアミンイミド化合物に第一モノアミンを付
加させてなるマイケル形付加物と共に、所望に応
じて従来公知の第二アミンを併用してもよい。
このような第二アミンとしては、1分子中にイ
ミノ基を1個以上有するものであればよく、例え
ばジエチルアミン、ジイソプロピルアミン、ジエ
タノールアミン、メチルエタノールアミン、ジイ
ソプロパノールアミン、N,N′−ジメチルエチ
レンジアミン等や、全てのアミノ基がケチミンで
ブロツク化されて生じた第二モノアミンやポリア
ミン等があげられる。
ケチミンブロツク化アミノ基含有ポリアミンと
しては、例えばモノメチルアミノプロピルアミ
ン、ジエチレントリアミン、ジプロピレントリア
ミン、ジブチレントリアミン、トリエチレントリ
アミン等のポリアミン中のアミノ基が、例えばア
セトン、メチルエチルケトン、メチルイソブチル
ケトン等のケトンとの反応によつてケチミンに変
換されたものがあげられる。
次に、本発明において用いられるポリエポキシ
ドとしては、1,2エポキシ基を2以上有する化
合物であつて、例えば先ずポリフエノールのポリ
グリシジルエーテルがあげられる。
ここで、ポリフエノールとしては、例えばビス
フエノールA
In order to solve the above-mentioned problems, the present inventors have conducted intensive research and have produced a Michael-type adduct of an amine imide compound and a primary monoamine, and then converted this Michael-type adduct to polyepoxide. By adding this, a self-curing resin can be easily obtained, and as a result, the manufacturing process of the self-curing resin can be simplified and shortened, and at the same time, the concentration of nitrogen-containing groups in the resin can be increased. The present inventors have discovered that since the amount does not increase beyond that level, the properties of the coating film are not adversely affected, leading to the completion of the present invention. That is, the present invention adds a primary monoamine to an ethylenically unsaturated compound having an amine imide group to form the following general formula: (In the formula, R1 represents an alkyl group, alkoxyalkyl group, alkenyl group, hydroxyalkyl group, or aryl group having 2 to 30 carbon atoms, R2, R3, R4
each represents an alkyl group or a hydroxyalkyl group having 1 to 8 carbon atoms. The present invention relates to a method for producing a self-curing resin, which is characterized by obtaining a Michael type adduct of ) and further adding the Michael type adduct to a polyepoxide to obtain an amino-modified polyepoxide containing an amine imide group. Examples of the ethylenically unsaturated compound having an amine imide group used in the present invention include 1, 1,
1-trimethylamine methacrylimide, 1,1
-dimethyl-1-ethylamine methacrylimide, 1,1-dimethyl-1-(2-hydroxypropyl)amine methacrylimide, and the like. Next, the first monoamine used in the present invention may have an alkyl group, an alkoxylalkyl group, an alkenyl group, a hydroxyalkyl group, or an aryl group having 2 to 30 carbon atoms, for example,
ethylamine, propylamine, butylamine,
1-methylbutylamine, hexylamine, 2-
Ethylhexylamine, 3-methoxypropylamine, 3-ethoxypropylamine, propoxypropylamine, butoxypropylamine, 2-
Ethylhexyloxypropylamine, decyloxypropylamine, dodecyloxypropylamine,
1-amino-2-propene, 1-amino-2-butene, 1-amino-2-pentene, oleylamine, 2-aminoethanol, 2-amino-1-propanol, 2,2-dimethyl-3-amino-propanol , phenylamine, benzylamine,
Examples include α-phenethylamine and β-phenethylamine. The primary monoamine undergoes Michael addition to the amine imide compound to form an imino group useful for subsequent reaction with the polyepoxide. The amine added to polyepoxide is
If desired, a conventionally known secondary amine may be used in combination with the Michael type adduct obtained by adding a primary monoamine to the above-mentioned amine imide compound. Such secondary amines may have one or more imino groups in one molecule, such as diethylamine, diisopropylamine, diethanolamine, methylethanolamine, diisopropanolamine, N,N'-dimethylethylenediamine, etc. Examples include secondary monoamines and polyamines produced by blocking all amino groups with ketimine. Examples of ketimine-blocked amino group-containing polyamines include monomethylaminopropylamine, diethylenetriamine, dipropylenetriamine, dibutylenetriamine, triethylenetriamine, and other polyamines in which amino groups are combined with ketones such as acetone, methylethylketone, and methylisobutylketone. Examples include those converted to ketimine by the following reaction. Next, the polyepoxide used in the present invention is a compound having two or more 1,2 epoxy groups, such as polyglycidyl ether of polyphenol. Here, as the polyphenol, for example, bisphenol A
【2,2−ビス(4−ヒドロキシフ
エニル)プロパン】、1,1−ビス(4−ヒドロ
キシフエニル)エタン、2−メチル−1,1−ビ
ス(4−ヒドロキシフエニル)プロパン、2,2
−ビス(4−ヒドロキシ−3−t−ブチルフエニ
ル)プロパン、ビス(2−ヒドロキシナフチル)
メタン、1,5−ジヒドロキシナフタレン等があ
げられる。
又、例えばポリフエノールのエチレンオキシド
付加物やプロピレンオキシド付加物等のオキシア
ルキル付加物や、ノボラツク形フエノール樹脂及
びこれらと類似のポリフエノール樹脂等のポリグ
リシジルエーテルも用いられる。
次いで、そのほかのポリエポキシドとしては、
例えばエポキシ化ポリアルカジエン系樹脂、グリ
シジルアクリレート共重合体系樹脂、グリシジル
メタアクリレート共重合体系樹脂、水酸基含有樹
脂のポリグリシジルエーテル、カルボキシル基含
有樹脂のポリグリシジルエステル等があげられ
る。
ポリエポキシドは、更に反応させて連鎖延長を
させ、その分子量を増加させたものでもよい。そ
の場合の連鎖延長剤としては、エポキシ基と反応
性を有する活性水素含有化合物、例えばグリコー
ル、ジアミン、ポリエーテルポリオール、ダイマ
ー酸、ヒダントイン、ビスフエノールA、ポリア
ミノアミド、アミノ酸等の水酸基、アミノ基、イ
ミノ基、チオール基、カルボキシル基等を含有す
る化合物等があげられる。
次に、本発明の特徴をなす、自己硬化性樹脂の
製造法について説明する。
先ず、第一モノアミンとアミンイミド化合物と
のマイケル形付加反応方法は、反応容器に第一モ
ノアミン及び有機溶媒を仕込み、適当な温度、好
ましくは70℃以上120℃以下で不活性ガス気流下
に撹拌しながら、アミンイミド化合物を添加す
る。温度を120℃以下に保つ理由は、反応中にお
けるアミンイミド化合物の熱分解を防止するため
である。
アミンイミド化合物の添加は、全量を一度に添
加する方法、数回に分割添加する方法、滴下する
方法等によつて行うことができる。
又、アミンイミド化合物と第一モノアミンとの
反応は、そのアミンイミド基を酸で中和したアシ
ルヒドラジニウム塩基の方が、第一モノアミンと
の反応性を高める効果が大きいため、酸の存在下
で行うのが好ましい。この目的のために用いる酸
は、本発明で得られる自己硬化性樹脂を水分散さ
せるのに有用な従来公知の有機酸2は無機酸であ
れば良く、その量は、アミンイミド化合物1モル
に対して、0.5〜1モルである。
又、この段階では、加熱、冷却、揮発成分の還
流、有機溶媒等の添加等を行うことができる。
アミンイミド化合物の添加終了後、必要に応じ
適当な温度と時間で反応を継続した後、有機溶媒
による希釈、過等の工程を行い、マイケル形付
加物である樹脂状溶液を得る。
ここで、有機溶媒とは、第一モノアミンとアミ
ンイミド化合物とのマイケル形付加反応及びその
後のマイケル形付加物とポリエポキシドとの付加
反応に用いる有機溶剤の事であり、前者の反応に
用いる有機溶媒としては例えばメチルアルコー
ル、エチルアルコール、イソプロピルアルコール
等のアルコール類やエチレングリコールモノエチ
ルエーテル、エチレングリコールモノブチルエー
テル等のエーテルアルコール類が好ましく、後者
の反応に用いる有機溶媒としては、例えばトルエ
ン、キシレン、メチルイソブチルケトン、ジイソ
プロピルケトン、ミネラルスピリツト、エチレン
グリコールモノエチルエーテルアセテート、ジエ
チレングリコールジメチルエーテル、酢酸ブチル
等が好ましい。
次に、得られたマイケル形付加物とポリエポキ
シドとの付加反応方法は、反応容器にポリエポキ
シドの一部又は全部を仕込み、不活性ガス気流下
に混合して均一な液状物とする。この工程で必要
あれば、加熱、適当な有機溶媒の添加、ポリエポ
キシドと例えばビスフエノールA等のそのほかの
成分との予備的反応等を行うことができる。次い
で、上記の均一な液状物を適当な温度で不活性ガ
ス気流下に撹拌しながら、マイケル形付加物を添
加する。マイケル形付加物の添加は、全量を一度
に添加する方法、数回に分割添加する方法、滴下
する方法等によつて行われ、工程上の時期に応じ
て、マイケル形付加物の種類や量を変えることが
できる。この段階では、加熱、冷却、揮発成分の
還流、ポリエポキシドの一部や有機溶媒等の添加
等を行うことができる。マイケル形付加物の添加
終了後、必要に応じ、適当な温度と時間で反応を
継続した後、有機溶媒による希釈、蒸溜、過等
の操作を行い、自己硬化性樹脂を得る。
自己硬化性樹脂の中に占めるマイケル形付加物
の割合は、固形分として5〜35重量%であること
が好ましく、5重量%未満の場合は、低温硬化性
ではなくなり、得られる塗膜の物性も不充分であ
り、35重量%を超える場合は、得られる水性分散
液の電着性や、得られる塗膜の物性に問題が生じ
る。
本発明により製造される自己硬化性樹脂は、す
でにその当該樹脂中にアシルヒドラジニウム塩基
を含有するが、さらに必要により残存するアミン
イミド基も酸で中和することでアシルヒドラジニ
ウム塩基への変換が可能であり、さらに水で希釈
することにより水性分散液の形成が可能となる。
ここで酸としては、有機酸又は無機酸であり、例
えば蟻酸、酢酸、乳酸、リン酸等が挙げられる。
又、アミンイミド基を中和して得られた自己硬
化性樹脂中のアシルヒドラジニウム塩基の割合、
種々の成分の構造や分子量は、当該自己硬化性樹
脂を水と混合した場合の分散安定性、電着性、架
橋硬化性、塗膜性能等を勘案して、相互に調整し
なければならない。
自己硬化性樹脂の水性分散液即ち、カチオン電
着塗料浴中に陽極と電導性被塗体とからなる陰極
とを浸漬し、両極の間に電圧を印加すれば、可電
着性樹脂が塗膜として、陰極表面に析出する。
そのようなカチオン電着塗装技術は、当該技術
分野で周知であるが、析出塗膜は、カチオン電着
塗料浴中から引き上げた後の水洗で、被塗体表面
から洗い落されない程度に、付着力を有していな
ければならない。
本発明で製造される自己硬化性樹脂は、基本的
にはアミンイミド基含有アミノ変性ポリエポキシ
ドと中和剤である酸とからなり、そのほかの成分
として、通常のカチオン電着塗装に用いられてい
る成分である可塑剤;界面活性剤;例えば二酸化
チタン、カーボンブラツク、タルク、カオリン、
シリカ、ケイ酸鉛、塩基性クロム酸鉛、リン酸亜
鉛等の着色顔料、体質顔料、防錆顔料等の顔料;
例えばイソプロピルアルコール、ブチルアルコー
ル、エチレングリコールモノエチルエーテル、エ
チレングリコールモノブチルエーテル、ジアセト
ンアルコール等の親水性・半親水性の有機溶剤;
例えばジブチルスズジラウレート、ジブチルスズ
ジオキサイド、ジフエニルスズオキサイド等の硬
化触媒;水等を適宜に加えたものであり、塗料の
製造に通常用いられているデゾルバー、ホモミキ
サー、サンドグラインドミル、アトライター、ロ
ールミル等の混合機や分散機等によつて、均一に
混合、分散し、樹脂分の固形分がおよび10〜25重
量%の水性分散液であるカチオン電着塗料浴とす
る。[2,2-bis(4-hydroxyphenyl)propane], 1,1-bis(4-hydroxyphenyl)ethane, 2-methyl-1,1-bis(4-hydroxyphenyl)propane, 2, 2
-Bis(4-hydroxy-3-t-butylphenyl)propane, bis(2-hydroxynaphthyl)
Examples include methane and 1,5-dihydroxynaphthalene. Also used are, for example, oxyalkyl adducts of polyphenols such as ethylene oxide adducts and propylene oxide adducts, and polyglycidyl ethers such as novolac type phenol resins and polyphenol resins similar to these. Next, as other polyepoxides,
Examples include epoxidized polyalkadiene resins, glycidyl acrylate copolymer resins, glycidyl methacrylate copolymer resins, polyglycidyl ethers of hydroxyl group-containing resins, and polyglycidyl esters of carboxyl group-containing resins. The polyepoxide may be further reacted to undergo chain extension to increase its molecular weight. In this case, chain extenders include active hydrogen-containing compounds that are reactive with epoxy groups, such as glycols, diamines, polyether polyols, dimer acids, hydantoins, bisphenol A, polyaminoamides, hydroxyl groups and amino groups such as amino acids, Examples include compounds containing imino groups, thiol groups, carboxyl groups, and the like. Next, a method for producing a self-curing resin, which is a feature of the present invention, will be explained. First, in the Michael type addition reaction method between a primary monoamine and an amine imide compound, the primary monoamine and an organic solvent are charged into a reaction vessel, and the mixture is stirred at an appropriate temperature, preferably 70°C or higher and 120°C or lower, under an inert gas flow. while adding the amine imide compound. The reason for keeping the temperature below 120°C is to prevent thermal decomposition of the amine imide compound during the reaction. The amine imide compound can be added by a method of adding the entire amount at once, a method of adding in several portions, a method of adding dropwise, or the like. In addition, the reaction between an amine imide compound and a primary monoamine is not possible in the presence of an acid because the acylhydrazinium base whose amine imide group is neutralized with an acid is more effective in increasing the reactivity with the primary monoamine. It is preferable to do so. The acid used for this purpose may be any conventionally known organic acid 2 useful for dispersing the self-curing resin obtained in the present invention in water, as long as it is an inorganic acid, and the amount thereof is determined per mole of the amine imide compound. It is 0.5 to 1 mole. Further, at this stage, heating, cooling, refluxing of volatile components, addition of an organic solvent, etc. can be performed. After the addition of the amine imide compound is completed, the reaction is continued at an appropriate temperature and time as necessary, and then dilution with an organic solvent, filtration, and other steps are performed to obtain a resinous solution of the Michael adduct. Here, the organic solvent is an organic solvent used in the Michael addition reaction between the primary monoamine and the amine imide compound and the subsequent addition reaction between the Michael adduct and polyepoxide; For example, alcohols such as methyl alcohol, ethyl alcohol, and isopropyl alcohol, and ether alcohols such as ethylene glycol monoethyl ether and ethylene glycol monobutyl ether are preferable, and the organic solvent used in the latter reaction is, for example, toluene, xylene, methyl isobutyl. Ketone, diisopropyl ketone, mineral spirits, ethylene glycol monoethyl ether acetate, diethylene glycol dimethyl ether, butyl acetate and the like are preferred. Next, in the method of addition reaction between the obtained Michael adduct and polyepoxide, part or all of the polyepoxide is charged into a reaction vessel and mixed under an inert gas flow to form a uniform liquid. If necessary in this step, heating, addition of a suitable organic solvent, preliminary reaction of the polyepoxide with other components such as bisphenol A, etc. can be carried out. Next, the Michael adduct is added to the homogeneous liquid while stirring the mixture at an appropriate temperature and under a stream of inert gas. Addition of the Michael type adduct can be carried out by adding the entire amount at once, adding it in several portions, dropping it, etc. Depending on the timing of the process, the type and amount of the Michael type adduct can be added. can be changed. At this stage, heating, cooling, refluxing of volatile components, addition of a portion of polyepoxide, an organic solvent, etc. can be performed. After the addition of the Michael type adduct is completed, the reaction is continued at an appropriate temperature and time as required, and then dilution with an organic solvent, distillation, filtration, etc. are performed to obtain a self-curing resin. The proportion of the Michael type adduct in the self-curing resin is preferably 5 to 35% by weight as a solid content, and if it is less than 5% by weight, it will not be curable at low temperature and the physical properties of the resulting coating will deteriorate. If the amount exceeds 35% by weight, problems will arise in the electrodeposition properties of the resulting aqueous dispersion and in the physical properties of the resulting coating film. The self-curing resin produced according to the present invention already contains an acylhydrazinium base, but if necessary, the remaining amine imide groups can also be neutralized with an acid to convert them into acylhydrazinium bases. conversion is possible and further dilution with water allows the formation of an aqueous dispersion.
Here, the acid is an organic acid or an inorganic acid, such as formic acid, acetic acid, lactic acid, phosphoric acid, and the like. In addition, the proportion of acylhydrazinium base in the self-curing resin obtained by neutralizing the amine imide group,
The structures and molecular weights of the various components must be mutually adjusted by taking into account dispersion stability, electrodepositivity, crosslinking curability, coating film performance, etc. when the self-curing resin is mixed with water. By immersing an anode and a cathode consisting of a conductive coating material in an aqueous dispersion of a self-curing resin, that is, a cationic electrodeposition paint bath, and applying a voltage between the two electrodes, the electrocoatable resin is coated. It is deposited as a film on the cathode surface. Such cationic electrodeposition coating techniques are well known in the art; however, the deposited coating can be applied to the surface of the coated material to such an extent that it is not washed off by water washing after removal from the cationic electrodeposition paint bath. It must have staying power. The self-curing resin produced in the present invention basically consists of an amino-modified polyepoxide containing an amine imide group and an acid as a neutralizing agent, and other components include those used in ordinary cationic electrodeposition coatings. plasticizer; surfactant; such as titanium dioxide, carbon black, talc, kaolin,
Pigments such as color pigments such as silica, lead silicate, basic lead chromate, and zinc phosphate, extender pigments, and antirust pigments;
For example, hydrophilic/semi-hydrophilic organic solvents such as isopropyl alcohol, butyl alcohol, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diacetone alcohol;
For example, curing catalysts such as dibutyltin dilaurate, dibutyltin dioxide, diphenyltin oxide; water, etc. are added as appropriate, and are commonly used in the manufacture of paints, such as resolvers, homomixers, sand grind mills, attritors, and roll mills. The mixture is uniformly mixed and dispersed using a mixer or a dispersing machine such as the above, to form a cationic electrodeposition paint bath which is an aqueous dispersion having a resin solid content of 10 to 25% by weight.
次に、実施例、比較例をあげて本発明を更に詳
細に説明する。例中、部は重量部、%は重量%で
ある。
◇実施例 1
温度計、撹拌機、還流冷却器、滴下ロート及び
窒素ガス吹込口を取り付けた反応容器に、窒素ガ
ス気流下2−エチルヘキシルアミン300部を仕込
み90℃まで徐々に昇温した。次いで、90℃を保ち
つつ、下記の混合物を約1時間を要して滴下し
た。
1,1,1−トリメタルアミンメタクリルイミ
ド 329部
酢 酸 111部
エチレングリコールモノブチルエーテル 329部
滴下後、90℃で2時間反応を継続して淡黄色透
明な固形分58.8%のマイケル形付加物を得た。
又、別の上記と同様な反応容器に窒素ガス気流
下、ポリエポキシド(商品名エピコート1004油化
シエルエポキシ株式会社製、)950部とメチルイソ
ブチルケトン282部を仕込み、110℃まで徐々に昇
温して溶解した。次いで前記マイケル形付加物
369部及びケチミン(モノメチルアミノプロピル
アミン1モルとメチルイソブチルケトン1モルと
から得られたもので、固形分90.0%のメチルイソ
ブチルケトン溶液)38部を加え、窒素ガス気流下
90℃で2時間反応させて、数平均分子量2370、固
形分73.3%の自己硬化性樹脂を得た。
得られた自己硬化性樹脂136部を脱イオン水で
希釈して樹脂固形分10%の水性分散液を得た。
得られた水性分数液を内容積約1リツトルのポ
リ塩化ビニル製の電着槽に移し、温度を25℃に調
整して、被塗体としてリン酸亜鉛処理鋼板を陰極
に接続した。
次いで、炭素板を陽極として水性分散液中に挿
入し、水性分散液を撹拌しながら80ボルトの直流
電流を2分間印加して、カチオン電着塗装を行つ
た。
水洗後、150℃で30分間焼付けて、乾燥膜厚
19μの硬化塗膜を得た。得られた硬化塗膜の試験
結果を下記第1表に示した。
◇実施例 2
実施例1と同様な反応容器に窒素ガス気流下、
2−アミノ−1−プロパノール150部を仕込み、
70℃まで徐々に昇温した。
次いで、70℃を保ちつつ、下記の混合物を約1
時間を要して滴下した。
1,1−ジメチル−1−(2−ヒドロキシプロ
ピル)アミンメタクリルイミド 372部
酢 酸 120部
エチレングリコールモノブチルエーテル 372部
滴下後、70℃で1時間反応を継続して淡黄色透
明な固形分51.5%のマイケル形付加物を得た。
又、別の実施例1と同様な反応容器に窒素ガス
気流下ポリエポキシド(商品名エピユート1004油
化シエルエポキシ株式会社製)950部とメチルイ
ソブチルケトン244部を仕込み、110℃まで徐々に
昇温して溶解した。次いで前記マイケル形付加物
506部を加え、窒素ガス気流は下90℃で2時間反
応させて、数平均分子量2380、固形分71.2%の自
己硬化性樹脂を得た。
得られた自己硬化性樹脂140部を、脱イオン水
で希釈して樹脂固形分10%の水性分散液を得た。
得られた水性分散液を実施例1と同様にして、
カチオン電着塗装を行つた。
水洗後、150℃30分間焼付けて、乾燥膜厚19μ
の硬化塗膜を得た。
得られた硬化塗膜の試験結果を下記第1表に示
した。
◇実施例 3
実施例1と同様な反応容器に、窒素ガス気流
下、オレイルアミン(商品名アミンOB 日本油
脂株式会社製)534部を仕込み、80℃まで徐々に
昇温した。次いで、80℃を保ちつつ、下記の混合
物を約1時間要して滴下した。
1,1−ジメチル−1−(2−ヒドロキシプロ
ピル)アミンメタクリルイミド 372部
酢 酸 96部
エチレングリコールモノブチルエーテル 372部
滴下後、80℃で2時間反応を継続して黄褐色透
明な固形分65.9%のマイケル形付加物を得た。
又、別の実施例1と同様な反応容器に窒素ガス
気流下、ポリエポキシド(商品名エピコート1004
油化シエルエポキシ株式会社製)950部とメチル
イソブチルケトン244部を仕込み、110℃まで徐々
に昇温して溶解した。次いで、マイケル形付加物
687部を加え、窒素ガス気流下90℃で2時間反応
させて、数平均分子量2800、固形分74.6%の自己
硬化性樹脂を得た。
得られた自己硬化性樹脂134部に対して、脱イ
オン水で希釈して樹脂固形分10%の水性分散液を
得た。
得られた水性分散液を実施例1と同様にして、
カチオン電着塗装を行つた。
水洗後、150℃で30分間焼付けて、乾燥膜厚
20μの硬化塗膜を得た。
得られた硬化塗膜の試験結果を下記第1表に示
した。
◇比較例 1
実施例1と同様な反応容器に、窒素ガス気流
下、ポリエポキシド(商品名エピコート1004油化
シエルエポキシ株式会社製)950部とメチルイソ
ブチルケトン336部を仕込み、110℃まで徐々に昇
温し、溶解した。次いで、プロピルアミン118部
を仕込み、窒素ガス気流下50℃で5時間反応させ
た。次いで、120℃まで昇温し、激しく窒素ガス
を吹き込んで、未反応アミンを除き、淡黄色透明
な固形分76.6%のポリアミン樹脂を得た。得られ
たポリアミン樹脂を70℃に保ちつつ、下記の混合
物を約1時間を要して滴下した。
1,1−ジメチル−1−(2−ヒドロキシプロ
ピル)アミンアクリルアミド 138部
エチレングリコールモノブチルエーテル 138部
滴下後、70℃で2時間反応を継続して、数平均
分子量2200、固形分72.0%の自己硬化性樹脂を得
た。
得られた自己硬化性樹脂138部に対して酢酸2
部を加えて充分混合した後、脱イオン水で希釈し
て樹脂固形分10%の水性分散液を得た。
得られた水性分散液を実施例1と同様にして、
カチオン電着塗装を行つた。水洗後、150℃で30
分間焼付けて、乾燥膜厚18μの硬化塗膜を得た。
得られた硬化塗膜の試験結果を下記第1表に示
した。
◇比較例 2
実施例1と同様な反応容器に、窒素ガス気流
下、ポリエポキシド(商品名エピコート1004油化
シエルエポキシ株式会社製)950部とメチルイソ
ブチルケトン355部を仕込み、110℃まで徐々に昇
温して溶解した。次いでケチミン(モノメチルア
ミノプロピルアミン1モルとメチルイソブチルケ
トン1モルとから得られたもので、固形分90.0%
のメチルイソブチルケトン溶液)188部を加え、
窒素ガス気流下90℃で2時間反応させて、淡黄色
透明な固形分76.2%のポリアミン樹脂を得た。得
られたポリアミン樹脂を90℃に保ちつつ、脱イオ
ン水27部、エチレングリコールモノブチルエーテ
ル20部を徐々に加えた後、下記の混合物を約1時
間を要して滴下した。
1,1,1−トリメチルアミンアクリルイミド
128部
エチレングリコールモノブチルエーテル 128部
滴下後、90℃で2時間反応を継続して、数平均
分子量2330、固形分65.0%の自己硬化性樹脂を得
た。
得られた自己硬化性樹脂154部に対して酢酸2
部を加えて充分混合した後、脱イオン水で希釈し
て樹脂固形分10%の水性分散液を得た。
得られた水性分散液を実施例1と同様にして、
カチオン電着塗装を行つた。水洗後、150℃で30
分間焼付けて、乾燥膜厚19μの硬化塗膜を得た。
得られた硬化塗膜の試験結果を下記第1表に示
した。また下記第1表には、実施例1〜3、比較
例1〜2により得られた電着析出塗膜のアミン
値、自己硬化性樹脂中の比率、製造時間について
も示した。
Next, the present invention will be explained in more detail by giving Examples and Comparative Examples. In the examples, parts are parts by weight, and % is % by weight. ◇Example 1 In a reaction vessel equipped with a thermometer, a stirrer, a reflux condenser, a dropping funnel, and a nitrogen gas inlet, 300 parts of 2-ethylhexylamine was charged under a nitrogen gas stream, and the temperature was gradually raised to 90°C. Next, the following mixture was added dropwise over about 1 hour while maintaining the temperature at 90°C. 1,1,1-Trimetalamine methacrylimide 329 parts Acetic acid 111 parts Ethylene glycol monobutyl ether 329 parts After the dropwise addition, the reaction was continued at 90°C for 2 hours to form a pale yellow transparent Michael adduct with a solid content of 58.8%. Obtained. In addition, 950 parts of polyepoxide (trade name: Epicote 1004, manufactured by Yuka Ciel Epoxy Co., Ltd.) and 282 parts of methyl isobutyl ketone were charged into another reaction vessel similar to the above under a nitrogen gas stream, and the temperature was gradually raised to 110°C. and dissolved. Then the Michael adduct
369 parts and 38 parts of ketimine (obtained from 1 mol of monomethylaminopropylamine and 1 mol of methyl isobutyl ketone, a methyl isobutyl ketone solution with a solid content of 90.0%) were added, and the mixture was heated under a nitrogen gas stream.
The reaction was carried out at 90° C. for 2 hours to obtain a self-curing resin having a number average molecular weight of 2370 and a solid content of 73.3%. 136 parts of the obtained self-curing resin was diluted with deionized water to obtain an aqueous dispersion having a resin solid content of 10%. The obtained aqueous fraction was transferred to a polyvinyl chloride electrodeposition tank having an internal volume of about 1 liter, the temperature was adjusted to 25°C, and a zinc phosphate-treated steel plate was connected to the cathode as the object to be coated. Next, a carbon plate was inserted into the aqueous dispersion as an anode, and a cationic electrodeposition coating was performed by applying a direct current of 80 volts for 2 minutes while stirring the aqueous dispersion. After washing with water, bake at 150℃ for 30 minutes to obtain a dry film thickness.
A cured coating film of 19μ was obtained. The test results of the obtained cured coating films are shown in Table 1 below. ◇Example 2 In a reaction vessel similar to Example 1, under a nitrogen gas stream,
Prepare 150 parts of 2-amino-1-propanol,
The temperature was gradually raised to 70°C. Next, while maintaining the temperature at 70℃, add about 1 cup of the following mixture.
It took some time to drip. 1,1-Dimethyl-1-(2-hydroxypropyl)amine methacrylimide 372 parts Acetic acid 120 parts Ethylene glycol monobutyl ether 372 parts After dropping, the reaction was continued at 70°C for 1 hour to give a light yellow transparent solid content of 51.5%. Michael-shaped adducts were obtained. In addition, 950 parts of polyepoxide (trade name: Epiyute 1004 manufactured by Yuka Ciel Epoxy Co., Ltd.) and 244 parts of methyl isobutyl ketone were charged into a reaction vessel similar to that in Example 1 under a nitrogen gas stream, and the temperature was gradually raised to 110°C. and dissolved. Then the Michael adduct
506 parts were added, and the reaction was carried out at 90° C. for 2 hours under a nitrogen gas stream to obtain a self-curing resin with a number average molecular weight of 2380 and a solid content of 71.2%. 140 parts of the obtained self-curing resin was diluted with deionized water to obtain an aqueous dispersion having a resin solid content of 10%. The obtained aqueous dispersion was treated in the same manner as in Example 1,
Cationic electrodeposition painting was performed. After washing with water, bake at 150℃ for 30 minutes, dry film thickness: 19μ
A cured coating film was obtained. The test results of the obtained cured coating films are shown in Table 1 below. ◇Example 3 In a reaction vessel similar to Example 1, 534 parts of oleylamine (trade name: Amine OB, manufactured by NOF Corporation) was charged under a nitrogen gas flow, and the temperature was gradually raised to 80°C. Next, the following mixture was added dropwise over a period of about 1 hour while maintaining the temperature at 80°C. 1,1-dimethyl-1-(2-hydroxypropyl)amine methacrylimide 372 parts Acetic acid 96 parts Ethylene glycol monobutyl ether 372 parts After dropping, the reaction was continued at 80°C for 2 hours to give a yellowish brown transparent solid content of 65.9%. Michael-shaped adducts were obtained. In addition, polyepoxide (trade name: Epicoat 1004
950 parts (manufactured by Yuka Ciel Epoxy Co., Ltd.) and 244 parts of methyl isobutyl ketone were charged, and the temperature was gradually raised to 110°C to dissolve them. Then, the Michael type adduct
687 parts were added and reacted for 2 hours at 90°C under a nitrogen gas stream to obtain a self-curing resin with a number average molecular weight of 2800 and a solid content of 74.6%. 134 parts of the obtained self-curing resin was diluted with deionized water to obtain an aqueous dispersion having a resin solid content of 10%. The obtained aqueous dispersion was treated in the same manner as in Example 1,
Cationic electrodeposition coating was performed. After washing with water, bake at 150℃ for 30 minutes to obtain a dry film thickness.
A cured coating film of 20μ was obtained. The test results of the obtained cured coating films are shown in Table 1 below. ◇Comparative Example 1 In a reaction vessel similar to Example 1, 950 parts of polyepoxide (trade name Epicoat 1004 manufactured by Yuka Ciel Epoxy Co., Ltd.) and 336 parts of methyl isobutyl ketone were charged under a nitrogen gas flow, and the mixture was gradually raised to 110°C. Warm and dissolve. Next, 118 parts of propylamine was charged, and the mixture was reacted at 50° C. for 5 hours under a nitrogen gas stream. Next, the temperature was raised to 120°C and nitrogen gas was blown vigorously to remove unreacted amine, yielding a pale yellow transparent polyamine resin with a solid content of 76.6%. The following mixture was added dropwise to the resulting polyamine resin over a period of about 1 hour while maintaining the temperature at 70°C. 1,1-dimethyl-1-(2-hydroxypropyl)amine acrylamide 138 parts Ethylene glycol monobutyl ether 138 parts After dropping, the reaction was continued at 70°C for 2 hours to achieve a self-curing product with a number average molecular weight of 2200 and a solid content of 72.0%. A synthetic resin was obtained. 2 parts of acetic acid per 138 parts of the self-curing resin obtained.
After adding 1.0 parts and thoroughly mixing, the mixture was diluted with deionized water to obtain an aqueous dispersion having a resin solids content of 10%. The obtained aqueous dispersion was treated in the same manner as in Example 1,
Cationic electrodeposition coating was performed. 30 at 150℃ after washing with water
After baking for a minute, a cured coating film with a dry film thickness of 18 μm was obtained. The test results of the obtained cured coating films are shown in Table 1 below. ◇Comparative Example 2 In a reaction vessel similar to Example 1, 950 parts of polyepoxide (trade name Epicoat 1004 manufactured by Yuka Ciel Epoxy Co., Ltd.) and 355 parts of methyl isobutyl ketone were charged under a nitrogen gas flow, and the mixture was gradually heated to 110°C. It was heated and dissolved. Next, ketimine (obtained from 1 mol of monomethylaminopropylamine and 1 mol of methyl isobutyl ketone, solid content 90.0%)
Add 188 parts of methyl isobutyl ketone solution),
The reaction was carried out at 90°C for 2 hours under a nitrogen gas stream to obtain a pale yellow transparent polyamine resin with a solid content of 76.2%. While maintaining the obtained polyamine resin at 90°C, 27 parts of deionized water and 20 parts of ethylene glycol monobutyl ether were gradually added, and then the following mixture was added dropwise over about 1 hour. 1,1,1-trimethylamine acrylimide
128 parts ethylene glycol monobutyl ether 128 parts After the dropwise addition, the reaction was continued at 90°C for 2 hours to obtain a self-curing resin with a number average molecular weight of 2330 and a solid content of 65.0%. 2 parts of acetic acid per 154 parts of the self-curing resin obtained.
After adding 1.0 parts and thoroughly mixing, the mixture was diluted with deionized water to obtain an aqueous dispersion having a resin solids content of 10%. The obtained aqueous dispersion was treated in the same manner as in Example 1,
Cationic electrodeposition coating was performed. 30 at 150℃ after washing with water
After baking for a minute, a cured coating film with a dry film thickness of 19 μm was obtained. The test results of the obtained cured coating films are shown in Table 1 below. Table 1 below also shows the amine values, proportions in the self-curing resin, and manufacturing times of the electrodeposition coating films obtained in Examples 1 to 3 and Comparative Examples 1 to 2.
【表】【table】
【表】【table】
実施例1〜3の製造工程において、自己硬化性
樹脂中に占めるマイケル形付加物の比率が平均
29.2%と小さいため、マイケル形付加物を事前
に、一定容積の製造装置で数バツチ分まとめて製
造して保管し、自己硬化性樹脂を製造するたび毎
にその一部を用いることが可能である。それに対
して、比較例1〜2の製造工程において、第一工
程の自己硬化性樹脂中に占めるポリアミン樹脂の
比率が平均81.8%と大きいため、ポリアミン樹脂
を事前に一定容積の製造装置で数バツチ分まとめ
て製造することができず、1バツチ分毎にポリア
ミン樹脂を製造する必要がある。
従つて実施例1〜3は自己硬化性樹脂を製造す
る際、製造時間は3時間で済み製造工程の簡略化
と短縮化が可能であるのに対し、比較例1〜2
は、自己硬化性樹脂を製造する際、製造時間は6
〜9時間と長時間を要する。
又、本発明によつて製造される樹脂は、樹脂中
の窒素含有基の濃度を常に必要最小限にすること
ができるので、窒素含有基の濃度が増加して塗膜
性能の低下をもたらす欠点がない。
又、本発明によつて得られたカチオン電着塗料
浴で、電導性被塗体を陰極として、通常のカチオ
ン電着塗装と同様にして電着塗装を行い、水洗
後、130〜160℃で20〜40分間焼付けることによつ
て硬化塗膜が得られる。
このようにして得られた硬化塗膜は、鉛筆硬
度、付着性、対衝撃性、可撓性、耐アセトンラビ
ング性、耐水性、耐蝕性、耐酸性等に優れてい
る。しかし、ポリアミン樹脂にアミンイミド化合
物を付加させて当該樹脂を得る公知方法では、電
着析出塗膜のアミン値が高いため硬化塗膜は耐水
性、耐蝕性及び耐酸性が劣る傾向が認められる。
In the manufacturing process of Examples 1 to 3, the average proportion of Michael adducts in the self-curing resin was
Because it is as small as 29.2%, it is possible to manufacture and store several batches of Michael-shaped adducts in advance in a fixed-volume manufacturing device, and use a portion each time self-curing resin is manufactured. be. On the other hand, in the manufacturing process of Comparative Examples 1 and 2, the ratio of polyamine resin in the self-curing resin in the first step is as high as 81.8% on average, so the polyamine resin is prepared in advance in several batches using a manufacturing device with a fixed volume. It is not possible to produce the polyamine resin in batches, and it is necessary to produce the polyamine resin in batches. Therefore, when manufacturing the self-curing resin in Examples 1 to 3, the manufacturing time was only 3 hours, making it possible to simplify and shorten the manufacturing process, whereas in Comparative Examples 1 to 2
When manufacturing self-curing resin, the manufacturing time is 6
It takes a long time, ~9 hours. In addition, the resin produced according to the present invention can always keep the concentration of nitrogen-containing groups in the resin to the minimum necessary, so there is no drawback that the concentration of nitrogen-containing groups increases and deteriorates coating performance. There is no. In addition, electrodeposition was carried out using the cationic electrodeposition paint bath obtained according to the present invention, using the conductive object as a cathode, in the same manner as ordinary cationic electrodeposition, and after washing with water, it was heated at 130 to 160°C. A cured coating is obtained by baking for 20-40 minutes. The cured coating film thus obtained is excellent in pencil hardness, adhesion, impact resistance, flexibility, acetone rubbing resistance, water resistance, corrosion resistance, acid resistance, etc. However, in the known method of obtaining the resin by adding an amine imide compound to the polyamine resin, the cured coating film tends to be inferior in water resistance, corrosion resistance, and acid resistance due to the high amine value of the electrodeposited coating film.
Claims (1)
合物に第一モノアミンを付加させて、下記一般式 (式中、R1は炭素数2〜30のアルキル基、ア
ルコキシアルキル基、アルケニル基、ヒドロキシ
アルキル基又はアリール基を表し、R2,R3,R4
はそれぞれ炭素数1〜8のアルキル基又はヒドロ
キシアルキル基を表す。) のマイケル形付加物を得、更にポリエポキシドに
該マイケル形付加物を付加させて、アミンイミド
基含有アミノ変性ポリエポキシドを得ることを特
徴とする自己硬化性樹脂の製造方法。 2 アミンイミド基を有するエチレン性不飽和化
合物は、アミンイミド一部又は全部を有機酸又は
無機酸で中和したものである。特許請求の範囲第
1項記載の自己硬化性樹脂の製造方法。[Claims] 1. A first monoamine is added to an ethylenically unsaturated compound having an amine imide group to obtain the following general formula: (In the formula, R 1 represents an alkyl group, alkoxyalkyl group, alkenyl group, hydroxyalkyl group, or aryl group having 2 to 30 carbon atoms, and R 2 , R 3 , R 4
each represents an alkyl group or a hydroxyalkyl group having 1 to 8 carbon atoms. 1. A process for producing a self-curing resin, which comprises obtaining a Michael-type adduct of ) and further adding the Michael-type adduct to a polyepoxide to obtain an amino-modified polyepoxide containing an amine imide group. 2. The ethylenically unsaturated compound having an amine imide group is one in which part or all of the amine imide is neutralized with an organic acid or an inorganic acid. A method for producing a self-curing resin according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18828685A JPH0244849B2 (en) | 1985-08-27 | 1985-08-27 | JIKOKOKASEIJUSHINOSEIZOHOHO |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18828685A JPH0244849B2 (en) | 1985-08-27 | 1985-08-27 | JIKOKOKASEIJUSHINOSEIZOHOHO |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6248720A JPS6248720A (en) | 1987-03-03 |
| JPH0244849B2 true JPH0244849B2 (en) | 1990-10-05 |
Family
ID=16220973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18828685A Expired - Lifetime JPH0244849B2 (en) | 1985-08-27 | 1985-08-27 | JIKOKOKASEIJUSHINOSEIZOHOHO |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244849B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2000649A1 (en) * | 1988-10-17 | 1990-04-17 | Tsuyoshi Inoue | Electrocoating composition |
| US10377928B2 (en) | 2015-12-10 | 2019-08-13 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US10351661B2 (en) | 2015-12-10 | 2019-07-16 | Ppg Industries Ohio, Inc. | Method for producing an aminimide |
-
1985
- 1985-08-27 JP JP18828685A patent/JPH0244849B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6248720A (en) | 1987-03-03 |
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