JPH0244972Y2 - - Google Patents
Info
- Publication number
- JPH0244972Y2 JPH0244972Y2 JP1984009705U JP970584U JPH0244972Y2 JP H0244972 Y2 JPH0244972 Y2 JP H0244972Y2 JP 1984009705 U JP1984009705 U JP 1984009705U JP 970584 U JP970584 U JP 970584U JP H0244972 Y2 JPH0244972 Y2 JP H0244972Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- sensor
- detecting
- detection signal
- movable platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【考案の詳細な説明】
本考案は、金型の固定盤と、これに対して横方
向の離間距離が予め調節可能になつた相手方の可
動盤とから成る横型締式金型取付盤のそれぞれの
金型受け上へ、自動的に作動する搬送装置で金型
を搬入するように成つた金型自動搬送装置付き成
形機に関するものである。[Detailed description of the invention] The present invention is a horizontal mold clamping type mold mounting board consisting of a fixed mold plate and a mating movable plate whose lateral distance can be adjusted in advance. This invention relates to a molding machine equipped with an automatic mold conveyance device, which is configured to carry a mold onto a mold receiver using an automatically operated conveyance device.
この種の装置によれば、大型の金型を射出成形
機等へ容易に搬入して装着可能となるが、左右に
開いている固定盤及び可動盤間の離間距離が型厚
調節機構の設定ミス等により大き過ぎると、金型
を落下させたり、また小さすぎると可動型の側面
へ衝突する問題がある。そこで、従来は金型搬送
装置を金型取付盤の手前で一旦停止させ、型厚調
節量を確認する必要があり、またこの確認作業の
ミスに起因する事故も生じ易かつた。 According to this type of device, a large mold can be easily transported and installed into an injection molding machine, etc., but the distance between the fixed platen and the movable platen, which are open on the left and right, is set by the mold thickness adjustment mechanism. If it is too large due to a mistake, the mold may fall, and if it is too small, it may collide with the side of the movable mold. Therefore, in the past, it was necessary to temporarily stop the mold conveying device before the mold mounting board and check the amount of mold thickness adjustment, and accidents were likely to occur due to mistakes in this checking work.
本考案は、この点に鑑みて搬送されてきた金型
とその取付盤との位置関係が適合しない場合に自
動停止し得る金型自動搬送装置付き成形機を提供
することを目的とする。 In view of this point, it is an object of the present invention to provide a molding machine with an automatic mold transport device that can automatically stop when the positional relationship between the transported mold and its mounting plate is not compatible.
次に、本考案を図示の実施例を基に説明する。 Next, the present invention will be explained based on the illustrated embodiments.
1は例えば横型締式射出成形機における固定
盤、2はその可動盤であり、それぞれの下方には
金型3の受けとして機能するローラ4,5が配設
されている。可動盤2は、周知の如くガイドロツ
ドに沿つた型厚調節機構(図示せず)により固定
盤1に対して金型3の横幅aに対応した待期位置
に調節可能であり、また周知の型締めラムピスト
ン(図示せず)により金型3がローラ4,5に載
置された状態でさらに型締めのために前進駆動さ
れるように成つている。10は金型搬送装置であ
り、金型3の載置されたローラ群11を例えばチ
エーン16を介して駆動装置15(第2図)で回
転駆動することにより、金型3を側壁12に沿つ
て搬送する。 Reference numeral 1 indicates a fixed plate in, for example, a horizontal clamping type injection molding machine, and 2 indicates a movable plate. Rollers 4 and 5, which function as receivers for a mold 3, are disposed below each plate. As is well known, the movable platen 2 can be adjusted to a standby position corresponding to the width a of the mold 3 relative to the fixed platen 1 by a mold thickness adjustment mechanism (not shown) along a guide rod. A clamping ram piston (not shown) drives the mold 3, placed on rollers 4 and 5, forward for further mold clamping. Reference numeral 10 denotes a mold conveying device, which moves the mold 3 along the side wall 12 by rotationally driving a group of rollers 11 on which the mold 3 is placed, for example, by a drive device 15 (FIG. 2) via a chain 16. transport.
21は金型3の固定盤1の内面1′への近接侵
入を検知する金型センサである。このセンサとし
ては例えばリミツトスイツチを固定盤1の上方に
金型3の上面へ当接し得るように取付け、金型3
が内面1′に接触もしくはローラ4から外れない
程度に接近してローラ4上に搬入されるのを検知
させる。22は金型3の可動盤2の内面2′への
近接搬入を検知する金型センサであり、同様にリ
ミツトスイツチを利用できる。金型センサ21
は、金型3の側面が内面1′に接触しているか又
は所定距離α、即ち金型を落下させることなくロ
ーラ4により確実に担持できる程度の離間距離内
に位置しているときのみ検知信号を出力する。金
型センサ22も同様に距離α以内で金型取付け盤
1,2間に近接して搬入される場合のみ検知信号
を出力する。23は可動盤2の前側面2″へ接近
した領域へ金型3が侵入するのを検知する金型セ
ンサである。これは、例えば発光素子と、その照
射光の金型3による反射を受光する受光素子とか
ら構成できる。これらの金型センサ21〜23の検
知信号は、第2図に示す排他論理和回路25及び
論理和回路26とからなる金型搬送装置を自動停
止させる制御回路の入力となる。 A mold sensor 21 detects the proximity of the mold 3 to the inner surface 1' of the fixed platen 1. As this sensor, for example, a limit switch is installed above the fixed platen 1 so that it can come into contact with the upper surface of the mold 3.
It is detected that the sheet contacts the inner surface 1' or approaches the roller 4 to the extent that it does not come off the roller 4. A mold sensor 22 detects the proximity of the mold 3 to the inner surface 2' of the movable platen 2, and a limit switch can be used similarly. Mold sensor 21
is a detection signal only when the side surface of the mold 3 is in contact with the inner surface 1' or is located within a predetermined distance α, that is, a distance that allows the mold to be reliably supported by the rollers 4 without falling. Output. Similarly, the mold sensor 22 outputs a detection signal only when the mold sensor 22 is carried in close to the mold mounting boards 1 and 2 within the distance α. 23 is a mold sensor that detects when the mold 3 enters an area close to the front side 2'' of the movable platen 2. This sensor is configured to detect, for example, a light emitting element and the reflection of the irradiated light by the mold 3. The detection signals from these mold sensors 21 to 23 are transmitted to a control circuit that automatically stops the mold conveying device, which is composed of an exclusive OR circuit 25 and an OR circuit 26 shown in FIG. It becomes input.
動作は次の通りである。 The operation is as follows.
金型搬送装置10に載置された金型3は、駆動
装置15によりローラ11が回転駆動されること
により、固定盤1の内面1′と同一面に立設され
ている側壁12に沿つて搬送されてきて金型取付
盤1,2へ搬入される。可動盤2の離間距離bは
予め調節されており、通常は搬入時に停止するこ
となくローラ4,5へ載置され、型取付け及び型
締めが行われる。この際金型センサ21,22は
共に検知信号を発生するために排他論理和回路2
5は出力信号を発しない。可動盤2の設定間隔b
が金型3の幅aと不適合の場合、例えば金型3が
固定盤1の内面1′に接して侵入するが、可動盤
2の内面2′から所定距離αよりも離れて搬入さ
れようとする場合、金型センサ21のみ検知信号
を出力する。これにより、排他論理和回路25は
出力信号を論理和回路26を通して搬入停止信号
として駆動装置15へ供給する。金型3が側壁1
2に沿つて搬入されず可動盤2へ片寄つて内面
1′から距離α以上離れて搬入されようとすると、
金型センサ22のみ検知信号を出力し、同様に自
動停止する。可動盤2の間隔bが横幅aより小さ
く設定され、位置的に不適合となつた場合、金型
センサ23が検知信号を出力し、論理和回路26
を介して搬入停止信号を発生する。駆動装置15
は、所定時間幅を越える搬入停止信号が入力する
と、駆動入力をしや断して自動的に搬入を停止さ
せる。 The mold 3 placed on the mold conveying device 10 is moved along the side wall 12 erected on the same plane as the inner surface 1' of the stationary platen 1 by rotationally driving the roller 11 by the driving device 15. It is transported and carried into the mold mounting boards 1 and 2. The separation distance b of the movable platen 2 is adjusted in advance, and the movable platen 2 is normally placed on the rollers 4 and 5 without stopping when being carried in, and mold attachment and mold clamping are performed. At this time, the mold sensors 21 and 22 are both connected to an exclusive OR circuit 2 to generate detection signals.
5 does not emit an output signal. Setting interval b of movable platen 2
If the width a of the mold 3 does not match the width a of the mold 3, for example, the mold 3 enters in contact with the inner surface 1' of the fixed platen 1, but if it is carried in at a distance of more than a predetermined distance α from the inner surface 2' of the movable platen 2. In this case, only the mold sensor 21 outputs a detection signal. As a result, the exclusive OR circuit 25 supplies the output signal to the drive device 15 through the OR circuit 26 as a carry-in stop signal. Mold 3 is side wall 1
If the material is not carried in along the line 2 and is tried to be carried toward the movable platen 2 at a distance of more than a distance α from the inner surface 1',
Only the mold sensor 22 outputs a detection signal and similarly stops automatically. If the interval b of the movable platen 2 is set smaller than the horizontal width a, resulting in a positional mismatch, the mold sensor 23 outputs a detection signal, and the logical sum circuit 26
A carry-in stop signal is generated via. Drive device 15
When a carry-in stop signal exceeding a predetermined time width is input, the drive input is cut off and the carry-in is automatically stopped.
尚、より信頼性を高めるため或いは特に同一面
の側壁12が無い場合、内面1′,2′の双方に対
して距離α以上離れて侵入するのを検知するに
は、別の金型センサを金型取付盤1,2間の前方
領域に配置して金型搬入を検知させる。そしてこ
の金型センサが検知信号を出力しているにも拘ら
ず、金型センサ21,22の双方共に作動しない
場合に搬入停止信号を発生させる回路を追加す
る。例えば第3図に示す別の金型センサ(図示せ
ず)の検知信号により金型3の搬入を確認させ、
この確認信号の発生時に金型センサ21,22の
双方もしくはいずれか一方が検知信号を発生しな
ければ、論理積回路35によりスイツチ回路36
が開成されず搬入停止信号が発生する。これらの
制御回路は前述の各センサを入力とするマイクロ
コンピユータを応用しても実現可能である。 In addition, in order to further improve reliability or to detect intrusion from a distance α or more to both inner surfaces 1' and 2', if there is no side wall 12 on the same surface, another mold sensor may be installed. It is placed in the front area between the mold mounting boards 1 and 2 to detect the introduction of molds. A circuit is added that generates a carry-in stop signal when both mold sensors 21 and 22 do not operate even though this mold sensor is outputting a detection signal. For example, the loading of the mold 3 is confirmed by a detection signal from another mold sensor (not shown) shown in FIG.
If both or one of the mold sensors 21 and 22 does not generate a detection signal when this confirmation signal is generated, the switch circuit 36 is activated by the AND circuit 35.
is not opened and a loading stop signal is generated. These control circuits can also be realized by applying a microcomputer that receives each of the above-mentioned sensors as input.
以上、本考案による金型取付盤に近接搬入用セ
ンサ及び衝突検知用センサを入力とする金型搬送
装置のインタロツク制御装置により、固定盤及び
可動盤間の金型幅に対する不適切な間隔設定が自
動的に検知され、金型搬送装置のその都度の一旦
停止が不要になる。これにより、金型段取りが能
率的に行われ、金型の落下、衝突等の重大事故も
未然に確実に防止できるようになる。 As described above, by using the interlock control device of the mold conveying device which inputs the proximity loading sensor and the collision detection sensor to the mold mounting plate according to the present invention, inappropriate spacing between the fixed platen and the movable platen for the mold width can be prevented. Automatic detection eliminates the need to stop the mold transport device each time. As a result, mold setup can be carried out efficiently, and serious accidents such as falling molds and collisions can be reliably prevented.
第1図は本考案による金型自動搬送装置の平面
図、第2図はその制御回路、第3図は制御回路の
別の実施例を示す。
1……固定盤、2……可動盤、3……金型、
4,5,11……ローラ、21〜23……金型セ
ンサ。
FIG. 1 is a plan view of an automatic mold conveyance device according to the present invention, FIG. 2 shows its control circuit, and FIG. 3 shows another embodiment of the control circuit. 1... Fixed plate, 2... Movable plate, 3... Mold,
4, 5, 11...roller, 21-23...mold sensor.
Claims (1)
め調節可能になつた可動盤とから成る横型締式金
型取付盤のそれぞれの金型受け上へ、自動的に作
動する搬送装置で金型を搬入するように成つた金
型自動搬送装置付き成形機において、 金型が固定盤内面へ接触もしくは接近状態で所
属の金型受け上へ搬入されるのを検知する第1の
金型センサと、 前記金型が可動盤内面へ接触もしくは接近状態
で所属の金型受け上へ搬入されるのを検知する第
2の金型センサと、 前記金型が前記可動盤における搬送装置側を向
いた側面に接近した領域へ搬入されるのを検知す
る第3の金型センサと、 この第3の金型センサの検知信号の発生又は前
記第1及び第2の金型センサのうちいずれか一方
のみの検知信号の発生に応答して前記搬送装置の
作動を中断させる制御回路と、を備えたことを特
徴とする金型自動搬送装置付き成形機。[Scope of Claim for Utility Model Registration] A horizontal clamping type mold mounting board consisting of a fixed board and a movable board whose lateral distance can be adjusted in advance. In a molding machine equipped with an automatic mold transport device that transports molds using a transport device that operates automatically, it is important to prevent molds from being transported onto the associated mold holder while touching or approaching the inner surface of the fixed plate. a first mold sensor for detecting; a second mold sensor for detecting when the mold is brought into its own mold receiver in contact with or close to the inner surface of the movable platen; a third mold sensor for detecting that the movable platen is being carried into an area close to the side facing the conveying device; and generation of a detection signal from the third mold sensor or the first and second mold sensors; A molding machine with an automatic mold conveyance device, comprising: a control circuit that interrupts operation of the conveyance device in response to generation of a detection signal from only one of the mold sensors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP970584U JPS60123211U (en) | 1984-01-28 | 1984-01-28 | Molding machine with automatic mold transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP970584U JPS60123211U (en) | 1984-01-28 | 1984-01-28 | Molding machine with automatic mold transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60123211U JPS60123211U (en) | 1985-08-20 |
| JPH0244972Y2 true JPH0244972Y2 (en) | 1990-11-29 |
Family
ID=30490180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP970584U Granted JPS60123211U (en) | 1984-01-28 | 1984-01-28 | Molding machine with automatic mold transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60123211U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0615191B2 (en) * | 1986-11-06 | 1994-03-02 | マツダ株式会社 | Molding equipment using dies |
| JP5807908B2 (en) * | 2011-10-31 | 2015-11-10 | ダイハツ工業株式会社 | Mold setting method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS532999A (en) * | 1976-06-30 | 1978-01-12 | Hochiki Co | Method of extinguishing fire |
-
1984
- 1984-01-28 JP JP970584U patent/JPS60123211U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60123211U (en) | 1985-08-20 |
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