JPH0245607U - - Google Patents

Info

Publication number
JPH0245607U
JPH0245607U JP12552688U JP12552688U JPH0245607U JP H0245607 U JPH0245607 U JP H0245607U JP 12552688 U JP12552688 U JP 12552688U JP 12552688 U JP12552688 U JP 12552688U JP H0245607 U JPH0245607 U JP H0245607U
Authority
JP
Japan
Prior art keywords
substrate
hole
back surface
caulking shaft
electrode fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12552688U
Other languages
English (en)
Other versions
JP2542000Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988125526U priority Critical patent/JP2542000Y2/ja
Publication of JPH0245607U publication Critical patent/JPH0245607U/ja
Application granted granted Critical
Publication of JP2542000Y2 publication Critical patent/JP2542000Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【図面の簡単な説明】
第１図は本願考案のチツプ型半固定抵抗器の一
実施例の要部を示す断面図であつて、第２図の
−線断面に相当する図、第２図は底面図、第３
図はチツプ型半固定抵抗器の基本構成を示す平面
図、第４図は第３図の−線断面図、第５図は
第４図の−線断面図、第６図は底面図、第７
図はチツプ型半固定抵抗器が実装される回路基板
におけるパツド例を示す平面図である。 １……セラミツク基板、２……透孔、３……抵
抗体皮膜、４……電極皮膜、５……電極金具、６
……カシメ軸筒、７……摺動子、７ａ……触子部
、１１……凹陥部。

Claims (1)

  1. 【実用新案登録請求の範囲】 透孔を有する基板の上面に、平面視において上
    記透孔を中心とする円弧部を有する馬蹄形の抵抗
    体皮膜を形成するとともに、基板の一側面ないし
    裏面に上記抵抗体皮膜の両端部とそれぞれ導通す
    る外部電極を形成する一方、上記基板の裏面に沿
    つて基板の他側部に至る薄板状の電極金具に設け
    たカシメ軸筒を上記透孔に通挿し、かつ、上記電
    極皮膜に接触する触子部をもつ摺動子を上記カシ
    メ軸筒の先端部に回転可能にカシメてなるチツプ
    型半固定抵抗器において、 上記基板の裏面における上記透孔の開口近傍か
    ら上記電極金具が沿う部分に凹陥部を設けるとと
    もに、上記電極金具のカシメ軸筒側端部を基板の
    裏面に対して段落ちさせ、かつこの部を上記凹陥
    部の内部に配置したことを特徴とする、チツプ型
    半固定抵抗器。
JP1988125526U 1988-09-26 1988-09-26 チップ型半固定抵抗器 Expired - Lifetime JP2542000Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988125526U JP2542000Y2 (ja) 1988-09-26 1988-09-26 チップ型半固定抵抗器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988125526U JP2542000Y2 (ja) 1988-09-26 1988-09-26 チップ型半固定抵抗器

Publications (2)

Publication Number Publication Date
JPH0245607U true JPH0245607U (ja) 1990-03-29
JP2542000Y2 JP2542000Y2 (ja) 1997-07-23

Family

ID=31376212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988125526U Expired - Lifetime JP2542000Y2 (ja) 1988-09-26 1988-09-26 チップ型半固定抵抗器

Country Status (1)

Country Link
JP (1) JP2542000Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465412U (ja) * 1990-10-16 1992-06-08

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173303A (ja) * 1987-01-12 1988-07-16 株式会社村田製作所 可変抵抗器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173303A (ja) * 1987-01-12 1988-07-16 株式会社村田製作所 可変抵抗器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0465412U (ja) * 1990-10-16 1992-06-08

Also Published As

Publication number Publication date
JP2542000Y2 (ja) 1997-07-23

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