JPH0245660U - - Google Patents

Info

Publication number
JPH0245660U
JPH0245660U JP12483488U JP12483488U JPH0245660U JP H0245660 U JPH0245660 U JP H0245660U JP 12483488 U JP12483488 U JP 12483488U JP 12483488 U JP12483488 U JP 12483488U JP H0245660 U JPH0245660 U JP H0245660U
Authority
JP
Japan
Prior art keywords
semiconductor light
lead
bonding wire
insulator
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12483488U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12483488U priority Critical patent/JPH0245660U/ja
Publication of JPH0245660U publication Critical patent/JPH0245660U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例の樹脂封止型発
光ダイオードの縦断面図、第２図は本考案の第２
の実施例の縦断面図、第３図は従来の発光ダイオ
ードの縦断面図である。 １……発光素子、２……ボンデング線、３……
発光素子搭載リード、４……ボンデング線接続リ
ード、５……エポキシ樹脂、６……絶縁体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体発光素子搭載リードと、ボンデング線が
    接続されているリードが封止樹脂内部で絶縁体を
    介して接着されていることを特徴とする樹脂封止
    型半導体発光装置。
JP12483488U 1988-09-22 1988-09-22 Pending JPH0245660U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12483488U JPH0245660U (ja) 1988-09-22 1988-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12483488U JPH0245660U (ja) 1988-09-22 1988-09-22

Publications (1)

Publication Number Publication Date
JPH0245660U true JPH0245660U (ja) 1990-03-29

Family

ID=31374910

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12483488U Pending JPH0245660U (ja) 1988-09-22 1988-09-22

Country Status (1)

Country Link
JP (1) JPH0245660U (ja)

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