JPH01160843U - - Google Patents
Info
- Publication number
- JPH01160843U JPH01160843U JP1988050064U JP5006488U JPH01160843U JP H01160843 U JPH01160843 U JP H01160843U JP 1988050064 U JP1988050064 U JP 1988050064U JP 5006488 U JP5006488 U JP 5006488U JP H01160843 U JPH01160843 U JP H01160843U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- heat sink
- semiconductor device
- pulled out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の第１の実施例の断面図、第２
図は本考案の第２の実施例の断面図、第３図は従
来の絶縁型樹脂封止半導体装置の断面図である。 １……放熱板、２……外部リード、３，４，１
０……吊りピン、５……エポキシ接着剤、６……
半導体チツプ、７……ボンデイングワイヤ、８…
…封止樹脂、９……裏面樹脂。
図は本考案の第２の実施例の断面図、第３図は従
来の絶縁型樹脂封止半導体装置の断面図である。 １……放熱板、２……外部リード、３，４，１
０……吊りピン、５……エポキシ接着剤、６……
半導体チツプ、７……ボンデイングワイヤ、８…
…封止樹脂、９……裏面樹脂。
Claims (1)
- 一方の端部から外部リードが外方に引き出され
、反対側の端部から吊りピンが外方に引き出され
た放熱板に半導体チツプをマウントし、樹脂封止
した絶縁型の樹脂封止半導体装置において、前記
吊りピンは、絶縁性接着剤により前記放熱板の本
体部に絶縁分離で取付けられていることを特徴と
する樹脂封止半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988050064U JPH01160843U (ja) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988050064U JPH01160843U (ja) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160843U true JPH01160843U (ja) | 1989-11-08 |
Family
ID=31276140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988050064U Pending JPH01160843U (ja) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160843U (ja) |
-
1988
- 1988-04-13 JP JP1988050064U patent/JPH01160843U/ja active Pending