JPH024596A - IC card manufacturing method and IC module - Google Patents

Abstract

PURPOSE:To prevent an adhesive for mounting from flowing out to an external terminal by a method wherein at the time of mounting an IC module in a recessed part of a card base, a masking film for hermetically sealing a through- hole is preliminarily adhered to the external terminal, and after the IC module is mounted, the film is released. CONSTITUTION:A masking film 30 for hermetically sealing a through-hole 14 is preliminarily adhered to an external terminal 13 of an IC module 11. Therefore, at the time of mounting the IC module 11 in a recessed part 25 of a card base 20, an adhesive 24 entering the through-hole 14 is prevented by the film 30 from flowing out to the exterior. Thus, the adhesive 24 will not flow out to the side of the external terminal 13, so that the appearance of the IC card 10 is prevented from being spoiled, and failure in contact at the external terminal 13 is obviated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an IC card manufacturing method and an IC module.

(Prior Art) In recent years, cards called chip cards, memory cards, microcomputer cards, or electronic cards (hereinafter simply referred to as I/O cards) equipped with IC chips such as microcomputers and memory
A variety of research is underway regarding the C-card.

Compared to conventional magnetic cards, such IC cards have
Because of its large storage capacity, banks are considering using it to store the history of deposits and savings in place of passbooks, and credit cards are considering storing transaction history such as shopping.

This kind of IC card is an IC equipped with an IC chip.
It consists of a module and a card base material having four parts for mounting the IC module.

Among these, an IC module is formed by providing external terminals on one surface of a substrate, providing a pattern layer and an IC chip on the other surface of the substrate, and molding the periphery of the IC chip and wiring portion with resin. Since the IC chip is provided approximately at the center of the substrate and the resin molding is performed to cover the IC chip, the IC module as a whole has a convex cross section.

Furthermore, multiple through holes are provided in the parts of the board that are not resin-molded, and conductive plating (for example, copper plating - nickel plating + gold plating) formed on the inner surface of the through holes allows external terminals to be connected. and the pattern layer are electrically connected.

(Problems to be Solved by the Invention) As described above, a plurality of through holes are provided through the substrate of the IC module, and the conductive plating formed on the inner surface of the through holes establishes conduction between the external terminal and the pattern layer. has been done. Further, the IC module is mounted and fixed in the IC module mounting recess of the card base material via an adhesive, and an IC card is thus produced.

However, when the IC module is mounted in the IC module mounting recess of the card base material, the adhesive in the recess of the card base material may leak from the pattern layer to the external terminal side through the through hole.

If the adhesive flows out to the external terminal side in this way, there is not only a problem with the appearance, but also a problem of poor contact between the external terminal and the terminal on the machine used when the IC card is used.

The present invention has been made in consideration of these points,
An object of the present invention is to provide a method for manufacturing an IC card and an IC module in which adhesive for mounting an IC module does not leak out to an external terminal side.

C Structure of the Invention] (Means for Solving the Problems) The present invention provides an external terminal on one side of a substrate and an I/O terminal on the other side.
A C chip and a pattern layer are provided, the periphery of the IC chip and the wiring section is molded with resin, and a plurality of through holes are formed to penetrate the substrate and conduct the external terminals and the pattern layer, thereby producing an IC with a convex cross section. Create a module and
A method for manufacturing an IC card in which the IC module is then mounted in a recess of a card base material via an adhesive, the method comprising:
An IC card characterized in that a masking film for sealing the through hole is pasted on the external terminal in advance, and the masking film is peeled off after the IC module is mounted in the recess of the card base material. A manufacturing method, an external terminal is provided on one side of a substrate, an IC chip and a pattern layer are provided on the other side of the substrate, and this I
An IC module having a convex cross-section formed by resin-molding the periphery of a C chip and a wiring section, wherein a plurality of through holes are provided to penetrate the substrate and conduct the external terminals and the pattern layer, The IC module is characterized in that a releasable masking film for sealing the through hole is attached to the IC module.

(Function) According to the present invention, an IC to which a masking film is attached
When the module is attached to the recessed portion of the card base material via an adhesive, the adhesive that enters the through hole is prevented from flowing out to the outside on the external terminal side by the masking film. This masking film is then peeled off to expose the external terminals to the outside.

(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

FIGS. 1 to 3 are diagrams showing an embodiment of an IC card manufacturing method and an IC module according to the present invention.

In FIG. 1, reference numeral 11 denotes an IC module, and the IC card 10 is constructed by mounting this IC module 11 into a recess 25 of a card base material 20 via an adhesive 24.

In FIG. 1, an external terminal 13 is provided on one surface of a substrate 12 made of a material with excellent flexibility and strength (e.g., glass epoxy, glass BT resin, polyimide, etc.), and a pattern layer 15 is provided on the other surface. It is provided.

Both the external terminal 13 and the pattern layer 15 are formed by applying copper plating, nickel plating, and gold plating to copper foil.

Further, an IC chip 1 is placed on the surface of the substrate 12 on the pattern layer 15 side.
7 is mounted, and after performing necessary wiring with the pattern layer 15 using bonding wires 18, the IC chip 1 is mounted.
The periphery of the wiring portion including 7 and bonding wire 18 is resin-molded with a molding resin to form a resin molded portion 19.

In this case, the resin molding is preferably performed by a transfer molding method, and the dimensions and shape of the molding resin are appropriately determined according to the IC chip 17 and the card base material 20. Further, the height of the resin molded portion 19 is smaller than the depth of a second recessed portion 25b, which will be described later.

Further, a protective resist layer 16 is provided around the periphery of the resin molded portion 19 on the pattern layer 15.

Furthermore, as shown in FIG. 2, an external terminal 13, a substrate 12,
A plurality of through holes 14 are formed through the pattern layer 15, and an external terminal 13 is provided on the inner surface of the through hole 14.
A conductive plating 14a is formed to electrically connect the pattern layer 15 and the pattern layer 15. IC module 1 with such a configuration
1 has a convex cross section as a whole.

Furthermore, a removable masking film 30 that seals the through hole 14 is adhered to the external terminal 13 of the IC module 11 via an adhesive layer (not shown).

This masking film 30 prevents the adhesive 24 from leaking out from the through hole 14 to the external terminal 13 side when the IC module 11 is attached to the four parts 25 of the card base material 20.

Next, the material of the masking film 30 will be explained in detail.

As the material of the masking film 30, for example, 1)
Plastic films such as polyester, polypropylene, cellophane, polyimide, polyethylene, and polyvinyl alcohol; 2) Metal foils such as aluminum foil; 3) Paper materials such as tissue paper, capacitor vapor, and parchment paper. These masking films 30 are attached to the external terminal 1.
The adhesive layer for adhering to the card substrate 3 may be any adhesive as long as it can be peeled off after the IC module is attached to the card base material, and is made of, for example, an acrylic, silicone, or rubber adhesive.

On the other hand, a recess 25 is formed in the card base material 20, and this recess 25 consists of a relatively shallow first recess 25a and a relatively deep second recess 25b.
5b is a portion where the resin molded portion 19 is mainly attached.

In this case, the depth of the second recess 25b is
It is important that there is a space between the resin mold part 19 of the IC module 11 and the second recess 25b when the IC module 1 is mounted, or that the depth is such that they fit together in an adhesive or non-adhesive state. be.

Further, the recess 25 formed in the card base material 20 is formed so that the IC module 11 to be buried therein can be easily inserted.
It is desirable that it be equal to or slightly larger than the C module 11 (approximately 0.05 to 0.1 degrees).

Next, a method for manufacturing the IC card 10 will be explained.

On the bottom surface of the first recess 25a formed in the card base material 20,
Place the adhesive 24 as shown in FIGS. 1 and 2,
The IC module 11 with the masking film 30 pasted on the external terminals 13 in advance is inserted. Subsequently, the IC module 11 is fixed in the four parts 25 of the card base material 20 by locally pressing only the surface of the IC module 11 with a hot stamper (not shown).

Subsequently, the masking film 30 stuck on the external terminal 13 is peeled off to expose the surface of the external terminal 13, thus obtaining the IC card 10 (FIG. 3).

In this case, the adhesive 24 can be formed of, for example, a double-sided adhesive tape in which an acrylic adhesive is applied to both sides of a nonwoven fabric, or a room-temperature curing urethane adhesive. Furthermore, in order to obtain stronger adhesion, for example, a polyester-based thermal adhesive sheet is also preferably used.

According to this embodiment, the external terminal 13 of the IC module 11
Masking film 3 sealing through hole 14 on top
Since 0 is pasted in advance, the concave portion 2 of the card base material 20
5, the adhesive 24 that enters the through hole 14 is attached to this masking film 30.
This prevents leakage to the outside. In this way, since the adhesive 24 does not leak out to the external terminal 13 side, the
It does not spoil the appearance of the C card 10, and the external terminal 1
3. Poor contact can be prevented.

〔Effect of the invention〕

According to the present invention, when an IC module is attached to a recessed portion of a card base material via an adhesive, the adhesive that enters the through hole is prevented from flowing out to the outside on the external terminal side by the masking film. In this way, since the adhesive does not flow out to the outside of the external terminal side, the appearance of the IC card is not impaired, and poor contact of the external terminals can be prevented.

[Brief Description of the Drawings] Figures 1 to 3 are diagrams showing an embodiment of the IC card manufacturing method and IC module according to the present invention, of which Figure 1 is a side sectional view of the IC card; Figure 2 is the first
FIG. 3 is an enlarged view of part A in FIG. 3, showing a state in which the masking film in FIG. 1 has been peeled off. 10...IC card, 11...IC module, 1
2... Substrate, 13... External terminal, 14... Through hole, 14a... Conductive plating, 15... Pattern layer, 17... IC chip, 18... Bonding wire, 19... ... Resin mold part, 20 ... Card base material, 24 ... Adhesive, 25 ... Recessed part, 30 ... Masking film. Figure 1 Trap Figure 2

Claims (1)

[Claims] 1. An external terminal is provided on one side of a substrate, an IC chip and a pattern layer are provided on the other side, the periphery of the IC chip and the wiring portion is molded with a resin, and the external terminal is formed by penetrating the substrate. A method for manufacturing an IC card, in which a plurality of through holes are formed to conduct electricity between an external terminal and the pattern layer to create an IC module having a convex cross section, and the IC module is then attached to a concave portion of a card base material via an adhesive. When mounting the IC module in the recess of the card base material, a masking film for sealing the through hole is pasted on the external terminal in advance, and the IC module is mounted in the recess of the card base material. After that, the masking film is peeled off. 2. An IC module having a convex cross section, in which an external terminal is provided on one surface of a substrate, an IC chip and a pattern layer are provided on the other surface of the substrate, and the periphery of the IC chip and the wiring portion is molded with resin, A plurality of through holes are provided to penetrate the substrate and conduct the external terminals and the pattern layer, and a removable masking film that seals the through holes is adhered to the external terminals. An IC module used in the method according to claim 1.