JPH0245983Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention is a leadless chip carrier (hereinafter referred to as
This invention relates to an improvement in the structure of a connecting part when connecting a LCC (LCC) using a connector without using solder.

[Conventional technology and problems]

Conventionally, there is a structure of this type as shown in FIG. This connects the connection pattern 1-1 to the board 1 so that it faces the connection pattern 4-1 of the LCC4.
1, its periphery is surrounded by a positioning frame 2, and an LCC is connected therein via a conductive connector 3.
It has a structure that presses 4. The external dimensions of LCC4 are
Since manufacturing tolerances are large, the dimensions of the positioning frame 2 relative to the board pattern must be set to a size that accommodates the maximum dimension of the LCC 4. but,
If you put a smaller LCC4 into the frame 2 of this size,
LCC4 shakes or shifts in position within positioning frame 2.
Due to rotation or the like, opposing regular patterns may not be connected, resulting in poor connection. This malfunction condition is illustrated in FIGS. 4-6.

Further details will be given with reference to FIGS. 4 to 6. That is, the opening 2-1 of the LCC 4 and the positioning frame 2
If there is little play in the dimensions, the LCC side connection pattern 4-1 and the board side connection pattern 1-1 will be connected through the connector 3 at a predetermined location, but in reality, the LCC 4 has quite large manufacturing tolerances. In order to accommodate this, the dimension of the opening 2-1 of the frame body 2 is set to the maximum value. When a dimensionally smaller LCC is inserted into this frame, opening 2-1 and LCC
A large gap will appear between the patterns 4 and 4, and as shown in FIG. 5, the LCC 4 may be misaligned or rotated and come into contact with an adjacent pattern, causing contact failure.

Figure 6 is a partially enlarged view of the conductive connector 3 that connects the connection pattern 4-1 of the LCC 4 and the board side connection pattern 1-1, where the gold-plated thin wire conductor part 3-2 is made of silicone rubber. It is of the type that is buried in the insulating section 3-1. When using this connector 3, it is necessary to apply appropriate pressure from both sides. Therefore, in the conventional structure, a part of the fixing cover 5 is cut and bent to provide a pressing piece 5-1, so that a predetermined elastic force is exerted thereon. On the other hand, the LCC4 has a large tolerance in the thickness direction as well as a considerable variation in the plane direction, and unless this variation in the vertical direction is absorbed, it will not be possible to always apply an appropriate pressing force to the connector 3. This may cause poor contact. However, in the conventional structure described above, the thin plate-shaped pressing piece 5-1 is used to downsize the connection structure, so LCC
Absorbing the entire tolerance range of 4 would require a large dimensional capacity, exceed the maximum stress limit, etc., and is actually impossible.

Furthermore, in the conventional structure, when the LCC 4 is removed, it is completely housed in the frame 2, so it is necessary to turn the board 1 upside down and drop it, which causes inconvenience when it is incorporated into a device. There are cases.

[Purpose of invention]

This invention aims to eliminate the above drawbacks.
Even when the external size of the LCC4 varies, the LCC4 is always located at the center of the positioning frame.
The present invention also provides an improved connection structure that maintains appropriate pressure on the connector and facilitates removal.

〔Example〕

Next, the present invention will be explained in detail with reference to the drawings.

FIG. 1 shows the structure of the present invention in an exploded perspective view, and the difference from the conventional structure is that a support cover 7 for accommodating the LCC 4 is added. Conventionally, positioning was performed based on the dimensional relationship between the frame 2, the opening 2-1, and the LCC 4, but this is now done using the frame 8 and the support cover 7.

If the support cover 7 and the frame body 8 are manufactured by plastic molding or the like, they will be quite stable dimensionally, and no looseness will occur in the fitting dimension. next,
This structure eliminates the misalignment between the LCC 4 and the support cover 7, and this is a substantially frame-shaped cover with flexible elastic pieces 7-1 provided on all sides of the support cover 7. With this structure, even if the external dimensions of the LCC 4 vary, the LCC is pushed evenly from all sides, as shown by the two-dot chain line of the elastic piece 7-1 in Figure 2, so that it is always located at the center. become. Naturally, this elastic piece 7-1 is set to have appropriate springiness both when the size of the LCC 4 is at its minimum and when it is at its maximum, and is removed from the frame 8. In some cases, the support cover 7 can be removed all at once by lifting it up.

Further, the support cover 7 is formed with a protrusion 7-2 and a protrusion 7-3 at opposing locations, and at these two locations, a notch 8-2 and a notch 8-3 on the frame body 8 side are formed.
The support cover 7 is engaged with the support cover 7 to prevent rotational deviation. As a result, the board 1 side connection pattern 1-1 and the LCC 4 side connection pattern 4-
1 will ensure that the predetermined locations are facing each other,
Poor contact due to misalignment will no longer occur.

In the figure, the shape of the protrusions 7-2 and 7-3 of the support cover 7 is changed, for example, when the outer shape of the LCC 4 is square, the support cover 7
This is to ensure that if the stamped characters (the NEC mark in the figure) are aligned when engaging the frame body 8, there will be absolutely no reverse contact with the frame body 8 to be fitted next. Moreover, when the protrusions 7-2 and 7-3 are removed from the frame 8,
It is also something that can be grasped with one's fingers.

Furthermore, a point different from the conventional one is that a conical coil spring 9-1 is provided inside the cover 9, and this feature allows the connection between the LCC 4 and the board 1 to be maintained even when the thickness direction of the LCC 4 varies. It is possible to maintain the spring pressure for applying a predetermined pressure to the connector 3 (details of the structure have been explained in the conventional example and omitted), and it is also possible to use the connector 3 even in a narrow space. That is, by making the coil spring 9-1 conical, the space in the thickness direction can be reduced when the cover 9 is engaged and held on the frame 8. This is because, as can be seen from Fig. 2, the coil spring 9-1 exerts a predetermined spring pressure without taking up much space in the flexed state, and even when the thickness of the LCC 4 varies slightly, the spring is It performs its functions without being bulky.

To explain a specific implementation method of the present invention, first, the frame 8 is attached around the connection pattern 1-1 provided on the substrate 1 side. The frame 8 has a fulcrum hole 8-5 for fixing a fulcrum 9-2 on the cover 9 side and a locking part 8-4 that engages with a locking piece 9-3 on the cover 9 side. Install it so that it can be opened and closed freely. The locking piece 9-3 has spring properties, and the locking portion 8-4
It is designed to be engaged and held using deflection, and the locking force is set in consideration of spring pressure so that it can be opened and closed with a predetermined force. Then connector 3
into the opening 8-1. The LCC 4 is placed into the support cover 7 with the orientation taken into consideration in advance. (In the figure, in order to avoid misunderstanding the direction, align the support cover 7 with the display characters NEC stamped on the LCC4.
I am also doing something to display NEC characters. )
In this state, the support cover 7 is fitted onto the frame body 8 as described above, and then the cover 9 is closed, thereby making the connection. Conversely, when removing it for replacement or maintenance, it is sufficient to lift the cover 9 with a jig or the like, pinch the support cover 7 with your fingers and take it out, and then remove the LCC 4.

[Effect of idea]

As described above, according to the present invention, in order to achieve the miniaturization of the connection part accompanying the miniaturization of electronic devices, it can be implemented without taking up much space even when there is no margin in the thickness direction, and Up until now, it had not been considered much.
A connection structure for a leadless chip carrier can be obtained which has excellent practical features such as being able to prevent poor contact accidents due to variations in LCC manufacturing tolerances and being easy to handle.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view showing a leadless chip carrier connection structure according to the present invention, Fig. 2 is a sectional view of the structure shown in Fig. 1 of the present invention, and Fig. 3 is a conventional leadless chip carrier connection structure. FIG. 4 is a sectional view of the structure shown in FIG. 3, FIG. 5 is a correlation diagram between a connection pattern and a leadless chip carrier, and FIG. 6 is a partially enlarged view of a connector. In the figure, 1... Board, 1-1... Connection pattern, 2... Frame, 2-1... Opening, 2-2...
Fulcrum hole, 2-3... Locking part, 3... Connector, 3
-1... Insulating section, 3-2... Conductor section, 4... Leadless chip carrier, 4-1... Connection pattern, 5... Cover, 5-1... Pressing piece, 5-2...
...Fully point, 5-3...Locking piece, 6...Pin, 7...
Support cover, 7-1...Elastic piece, 7-2...Protrusion, 7-3...Protrusion, 8...Frame, 8-1
...opening, 8-2...notch, 8-3...notch, 8-4...locking part, 8-5...fulcrum hole,
9...Cover, 9-1...Coil spring, 9
-2... fulcrum, 9-3... locking piece.

Claims (1)

[Claims for Utility Model Registration] (1) In a connection structure in which a first connection pattern of a leadless chip carrier is connected to a second connection pattern on a board via a connector, the leadless chip carrier is substantially fitted. a support cover that has a frame shape that fits together and has elastic pieces on at least two sides of the inside of the frame so as to sandwich the leadless chip carrier; and a support cover that fits into the outer shape of the support cover so as to hold the support cover. A leadless chip carrier connection structure including a frame body and a cover that fits and presses and holds the support cover into which the leadless chip carrier is fitted onto the frame body. (2) The support cover has a protrusion of a non-uniform shape provided on the opposite edge thereof so as to protrude outward, and the frame body has a notch that fits into the protrusion. A leadless chip carrier connection structure according to claim 1 of the patented utility model. (3) A first predetermined symbol is provided on one of the protrusions, and a second predetermined symbol is provided at a position on the leadless chip carrier corresponding to the protrusion provided with the first predetermined symbol. A leadless chip carrier connection structure according to claim 2 of the utility model registration claim, characterized in that it is provided with: (4) The leadless chip carrier according to claim 1, wherein the cover is formed of a thin sheet metal and includes a conical coil spring on the inner surface of the center portion for pressing the leadless chip carrier. Chip carrier connection structure. (5) The leadless chip carrier connection structure according to any one of claims 1 to 4, wherein the support cover and the frame are made of plastic.