JPH0246426A - Mounting structure - Google Patents

Mounting structure

Info

Publication number
JPH0246426A
JPH0246426A JP19648388A JP19648388A JPH0246426A JP H0246426 A JPH0246426 A JP H0246426A JP 19648388 A JP19648388 A JP 19648388A JP 19648388 A JP19648388 A JP 19648388A JP H0246426 A JPH0246426 A JP H0246426A
Authority
JP
Japan
Prior art keywords
liquid crystal
panel
film
film carriers
zigzag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19648388A
Other languages
Japanese (ja)
Inventor
Kunio Sakuma
佐久間　國雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP19648388A priority Critical patent/JPH0246426A/en
Publication of JPH0246426A publication Critical patent/JPH0246426A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE:To allow packaging of a driver IC even to a high-density dot panel by disposing film carriers mounted with the driver IC zigzag in two rows and connecting the same to the transparent electrode at the panel end. CONSTITUTION:The surface of the transparent electrode 5 at the panel end 6 is coated with a metal coating 5 and the film carriers 11a, 11b are disposed zigzag in two rows and are connected via an anisotropic conductive film 3 thereon. The panel electrode leading around patterns are also made into the patterns alternately repeated zigzag at every part corresponding to the film carriers in accordance with the zigzag structures of the film carriers 11a, 11b. Spreading of the film carrier junctures to about 200mum is possible even if the dot density of the liquid crystal panel is fine and the pitch is about 130mum. Packaging is executed in this way.

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は液晶パネルモジー−ルの実装構造に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a mounting structure for a liquid crystal panel module.

［従来の技術］ 従来の液晶パネルモジュールの実装構造は、第３図にそ
の断面構造を示すように、液晶パネルの上ガラス４の端
部に位置する透明電極５の部分にドライバーエ０１０を
搭載したフィルムキャリア１１を、異方性導電膜１３を
介して接合し、そのフィルムキャリアの反対側の端部を
、回路基板８の導体パッド９に接合していた。[Prior Art] In the conventional mounting structure of a liquid crystal panel module, as shown in the cross-sectional structure of FIG. The film carrier 11 was bonded via the anisotropic conductive film 13, and the opposite end of the film carrier was bonded to the conductor pad 9 of the circuit board 8.

また、平面構造的には第４図に示すように、パネルから
引き出された透明電極引き回しパターン群１４が等ピン
チにて繰り返えされた構成となっており、フィルムキャ
リア１１が一列にパネルの透明電極５０所に並んだ構造
であった。ここで、フィルムキャリア１１上の導体パタ
ーン１２とパネルの透明電極５との接続ピッチは通常７
１ｔｆｍ　２００μｍであった。In addition, in terms of planar structure, as shown in FIG. 4, the transparent electrode routing pattern group 14 drawn out from the panel is repeated in an even pinch, and the film carrier 11 is arranged in a row on the panel. It had a structure in which transparent electrodes were lined up at 50 locations. Here, the connection pitch between the conductor pattern 12 on the film carrier 11 and the transparent electrode 5 of the panel is usually 7
It was 1tfm 200μm.

［発明が解決しようとする課題］ しかし、前述の従来技術では、カラーパネル等のように
パネルのドツト密度が増し、それに伴ないパネル端部に
引き出された透明電極のピッチが２０口μｍ以下と微細
化した場合には、フィルムキャリアの導体パターンとの
接合が確実に行なえないという問題点を有する。すなわ
ち、位置合わせ精度が厳しくなることがら、瞬接したパ
ターンとショートしたり、また透明電極とフィルムキャ
リアの接合面積が狭くなることから、接合強度が弱くな
りオープンになる場合が発生したりするなどの不良が多
（なってくるという問題点である。[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, as the dot density of panels such as color panels increases, the pitch of the transparent electrodes drawn out at the edge of the panel becomes 20 μm or less. In the case of miniaturization, there is a problem that the bonding with the conductor pattern of the film carrier cannot be performed reliably. In other words, alignment accuracy becomes stricter, resulting in short-circuits with instantaneously connected patterns, and the bonding area between the transparent electrode and film carrier becomes narrower, which weakens the bonding strength and may cause open circuits. The problem is that the number of defects is increasing.

そこで本発明はこのような問題点をＲ’Ｎ決するもので
、その目的とするところは、カラーパネル等の微細トノ
トノぐネルへのドライバーＩＣの実装を可能）よらしめ
る（荷造を提供するところにある。Therefore, the present invention is intended to solve these problems, and its purpose is to make it possible to mount driver ICs on minute channels such as color panels. be.

１課題を解決するための手段」 本発明の実装構造は、液晶パネルモジー−−ルにおいて
、以下の構成を特徴とずろ。1. Means for Solving the Problems The mounting structure of the present invention is a liquid crystal panel module characterized by the following configuration.

σ）　　ドライバーＩＣを搭載したフィルムキャリアが
、液晶パネル端部の電極に、複数個接続され、そのフィ
ルムキャリアが千鳥状に二列に配置された構造。σ) A structure in which multiple film carriers carrying driver ICs are connected to electrodes at the edge of the liquid crystal panel, and the film carriers are arranged in two rows in a staggered manner.

ｈ）　前記の接続構造に対応して、液晶パネル端部の電
極引き回しパターンの構成として、液晶封入側の一列の
フィルムキャリアに対応した電極引き回しパターンに比
較して、パネル端ｆｌＩｌｔの一列のフィルムキャリア
に対応した電極引き回しパターンの方が、その最狭部の
配線ピッチが小さい構成。h) Corresponding to the above connection structure, as for the structure of the electrode routing pattern at the end of the liquid crystal panel, compared to the electrode routing pattern corresponding to a row of film carriers on the liquid crystal enclosure side, a row of film carriers at the panel end flIlt is used. The electrode routing pattern corresponding to this configuration has a smaller wiring pitch at its narrowest part.

Ｃ）　前記電極引き回しパターン表面を、メツキにより
メタライズし、抵抗値を下げた構造。C) A structure in which the surface of the electrode routing pattern is metalized by plating to lower the resistance value.

［実施例］ 第１図は本発明の実施例における主要断面図であって、
パネル端部６に位置する透明電極５の表面を金属被膜１
５により被覆し、その上に異方性導電膜１６を介して、
フィルムキャリア１１σ。[Example] FIG. 1 is a main sectional view in an example of the present invention,
The surface of the transparent electrode 5 located at the panel end 6 is coated with a metal coating 1.
5 and an anisotropic conductive film 16 thereon,
Film carrier 11σ.

１１ｂを千鳥状二列に接続した構造となっている第２図
は第１図の平面図であって、フィルムキャリアが千鳥状
でかつ平面的に重なりあった構造であり、パネル電極の
引き回しパターンもそれに対応し、１６σ：、１６ｂで
示したように、１フイルムギヤリア対応）ηＩＳ分ごと
に交互に千鳥状に繰り返したパターン群となっている。11b is connected in two rows in a staggered manner. FIG. 2 is a plan view of FIG. 16σ:, as shown in 16b, is a pattern group that is alternately repeated every ηIS (corresponding to one film gear) in a staggered manner.

そして、異方性導電膜１ろを介してフィルムキャリアと
接続されろ部分のパターンピンチを出来る限り大きくと
るために、液晶封入部に近い一列のフィルムキャリアに
対応した引き回しパターン群１６　（７，は、液晶部か
らストレートに引き出された後、扇彫に広げられ、そし
てより大きなパターンピッチにて再びストレートに引き
回されて接続部へ至っている。In order to maximize the pattern pinch of the portion connected to the film carrier via the anisotropic conductive film 1, the routing pattern group 16 (7, , after being pulled out straight from the liquid crystal section, it is spread out in a fan pattern, and then straightly routed again at a larger pattern pitch to reach the connection section.

また液晶パネル端側の一列のフィルムキャリアに対応し
た引き回しパターン群１６／Ｊは、液晶部からストレー
トに引き出された後、−旦より小さなパターンピッチに
絞られ、そして次に再び液晶部近傍より大きなパターン
ピッチに広げられる。この−旦くびれだ部分は、引き回
しパターン群１６ａの広げられた部分に隣接しており、
この１６σに接続されるフィルムキャリア１１σのパタ
ーンピンチを、出来るだけ大きくするためにくびれだ引
き回しにしている。In addition, the routing pattern group 16/J corresponding to a row of film carriers on the edge side of the liquid crystal panel is drawn out straight from the liquid crystal section, then narrowed down to a smaller pattern pitch, and then again larger than that near the liquid crystal section. Spread to pattern pitch. This constricted part is adjacent to the widened part of the routing pattern group 16a,
In order to make the pattern pinch of the film carrier 11σ connected to this 16σ as large as possible, it is routed in a constricted manner.

ここで具体的寸法として、液晶パネルのドツトのピッチ
が１３０μｍで、引き出し本数が１フイルムキヤリアあ
たり１６０本の場合、１６ａ、１６ｈ共に、液晶部から
の引き出し部はｐ１３０μｍであり、フィルムキャリア
との接合部はｐ２０口μｍである。また１６ｂのくびれ
た部分のパターンはｐ６０μｍである。また引き回しパ
ターンの幅とすきまの比は１対１であり、厚みとしては
透明電極の厚みがｉ、ｏｏｏＸ、その上のニノヶルメノ
ギ′が１．　ｓ　ｏ　ｏ　Ｘである。使用するフィルム
キャリアは絶縁樹脂が７５μｍ厚のポリイミドであり、
導体は１８μｍ厚の銅箔で表面に錫メツキが０５μｍ施
されている。Here, as a specific dimension, if the dot pitch of the liquid crystal panel is 130 μm and the number of drawn out films is 160 per film carrier, the drawn out portion from the liquid crystal part of both 16a and 16h is p130 μm, and the bonding with the film carrier is The part is p20μm. Further, the pattern of the constricted portion 16b is p60 μm. The width and clearance ratio of the routing pattern is 1:1, and the thickness of the transparent electrode is i, oooX, and the thickness of the transparent electrode is 1. It's s o o x. The film carrier used is a polyimide insulating resin with a thickness of 75 μm.
The conductor is made of copper foil with a thickness of 18 μm, and the surface is tin-plated to a thickness of 05 μm.

以上のような構成によれば、液晶パネルのドツト密度が
非常に細かく、ピッチで１６０μｍ程度の場合であって
も、フィルムキャリアとの接続部は、ｐ２００μｍ程度
の接続可能なピッチまで広げろことが出来、かつ引き回
しパターンの抵抗値も、部分的に９６０μｍとパターン
を細く絞ったにもかかわらず、透明電極上のメタライズ
層により、問題の無いレベルまで下げることが出来、１
２インチレベルの６４０Ｘ４００ドツトのカラーパネル
その他の実装が可能となる。According to the above configuration, even if the dot density of the liquid crystal panel is very fine and the pitch is about 160 μm, the connection part with the film carrier can be expanded to a connectable pitch of about 200 μm. , and even though the pattern was narrowed down to 960 μm in some parts, the resistance value of the routing pattern could be lowered to a non-problematic level due to the metallized layer on the transparent electrode.
It becomes possible to implement a 2-inch level 640 x 400 dot color panel and other devices.

［発明の効果］ 以上述べたように本発明によれば、液晶パネルの透明電
極の実装用引き回しパターン部を、ドライバーＩＣのフ
ィルムキャリアが千鳥状２　列Ｋ　ＩＫｄ置されるよう
に構成し、かつ透明電極上にメツキによりメタライズを
施したことにより、液晶パネルノトソトピノチが細かく
とも、フィルムキャリア接続部の引き回しパターンを接
合可能なピンチにまで拡大することが出来、かつ引き回
しの抵抗増大を問題のないレベルにおさえることが出来
ることから、大容量カラー液晶パネル等の高密度ドツト
パネルであっても実装が可能となるという透れた効果を
有する。[Effects of the Invention] As described above, according to the present invention, the mounting routing pattern portion of the transparent electrode of the liquid crystal panel is configured such that the film carriers of the driver ICs are arranged in two staggered rows, and By applying metallization to the transparent electrode by plating, even if the thickness of the liquid crystal panel is small, the routing pattern of the film carrier connection part can be expanded to a pinch that can be joined, and the increase in routing resistance can be solved. Since it is possible to suppress the dot density to an extremely low level, it has the obvious effect that even high-density dot panels such as large-capacity color liquid crystal panels can be mounted.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の実装構造の一実施例を示す主要断面図
。 第２図は第１図の平面図。 第６図は従来の実装構造を示す主要断面図。 第４図は第６図の平面図。 １・・・・・・・−・液　晶 ２・・・・・・・・シール部 ６・・・・・・・下ガラス ４・・・・・・・・上ガラス ５・・−・・・透明電極 ６・・・・・・・・パネル端部 ７・・・・・・粘着テープ ８・・・・・・・回路基板 ９・・・・・・・導体パッド ０・・・・・・ドライバーエ０ １・・・・・・フィルムキャリア １ａ・・・液晶封入部側のフィルムキャリア１ｂ・・・
パネル端部側のフィルムキャリア２・・・・・・フィル
ムキャリアの導体３・・・・・・異方性導電膜 ４・・・・・・引き回しパターン群 ５・・・・・・金属被膜 ６ａ・・・液晶封入部側の引き回しノくターン群６ｂ・
・・パネル端部側の引き回しノぐターン群以上FIG. 1 is a main sectional view showing an embodiment of the mounting structure of the present invention. FIG. 2 is a plan view of FIG. 1. FIG. 6 is a main sectional view showing a conventional mounting structure. FIG. 4 is a plan view of FIG. 6. 1......Liquid crystal 2...Seal part 6...Bottom glass 4...Top glass 5...・Transparent electrode 6... Panel end 7... Adhesive tape 8... Circuit board 9... Conductor pad 0...・Driver area 0 1...Film carrier 1a...Film carrier 1b on the liquid crystal enclosure side...
Film carrier 2 on the panel end side... Film carrier conductor 3... Anisotropic conductive film 4... Routing pattern group 5... Metal coating 6a・・・Route turn group 6b on the liquid crystal enclosure side
...More than a group of turns on the panel end side

Claims (1)

【特許請求の範囲】 液晶バネルモジュールにおいて、以下の構成を特徴とす
る実装構造。 ａ）ドライバーＩＣを搭載したフィルムキャリアが、液
晶パネル端部の電極に、複数個接続され、そのフィルム
キャリアが千鳥状に二列に配置された構造。 ｂ）前記の接続構造に対応して、液晶パネル端部の電極
引き回しパターンの構成として、液晶封入側の一列のフ
ィルムキャリアに対応した電極引き回しパターンに比較
して、パネル端側の一列のフィルムキャリアに対応した
電極引き回しパターンの方が、その最狭部の配線ピッチ
が小さい構成。 ｃ）前記電極引き回しパターン表面を、メッキによりメ
タライズし、抵抗値を下げた構造。[Claims] A mounting structure in a liquid crystal panel module characterized by the following configuration. a) A structure in which a plurality of film carriers carrying driver ICs are connected to electrodes at the ends of the liquid crystal panel, and the film carriers are arranged in two rows in a staggered manner. b) Corresponding to the above connection structure, the configuration of the electrode routing pattern at the edge of the liquid crystal panel is such that a single row of film carriers on the panel edge side The electrode routing pattern corresponding to this configuration has a smaller wiring pitch at its narrowest part. c) A structure in which the surface of the electrode routing pattern is metalized by plating to lower the resistance value.
JP19648388A 1988-08-06 1988-08-06 Mounting structure Pending JPH0246426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19648388A JPH0246426A (en) 1988-08-06 1988-08-06 Mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19648388A JPH0246426A (en) 1988-08-06 1988-08-06 Mounting structure

Publications (1)

Publication Number Publication Date
JPH0246426A true JPH0246426A (en) 1990-02-15

Family

ID=16358536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19648388A Pending JPH0246426A (en) 1988-08-06 1988-08-06 Mounting structure

Country Status (1)

Country Link
JP (1) JPH0246426A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212576A (en) * 1990-12-18 1993-05-18 Mitsubishi Denki Kabushiki Kaisha Insulating material with coefficient linear expansion matching that of one substrate over connection between two conductive patterns
US5312172A (en) * 1992-02-28 1994-05-17 Aisin Seiki Kabushiki Kaisha Brake control system
KR100551439B1 (en) * 1998-09-04 2006-05-12 삼성전자주식회사 LCD Module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212576A (en) * 1990-12-18 1993-05-18 Mitsubishi Denki Kabushiki Kaisha Insulating material with coefficient linear expansion matching that of one substrate over connection between two conductive patterns
US5312172A (en) * 1992-02-28 1994-05-17 Aisin Seiki Kabushiki Kaisha Brake control system
KR100551439B1 (en) * 1998-09-04 2006-05-12 삼성전자주식회사 LCD Module

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