JPH0246673A - Contact element for semiconductor integrated circuit measurement device - Google Patents
Contact element for semiconductor integrated circuit measurement deviceInfo
- Publication number
- JPH0246673A JPH0246673A JP63198392A JP19839288A JPH0246673A JP H0246673 A JPH0246673 A JP H0246673A JP 63198392 A JP63198392 A JP 63198392A JP 19839288 A JP19839288 A JP 19839288A JP H0246673 A JPH0246673 A JP H0246673A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- fixed contact
- contactor
- spring
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体集積回路(以下ICと呼ぶ)の電気的特
性試験を行なう際に、特にICと測定回路とを結ぶ測定
装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a measurement device that connects an IC and a measurement circuit when testing the electrical characteristics of a semiconductor integrated circuit (hereinafter referred to as an IC). .
従来ICの電気的特性を測定する際、測定回路を有する
特性試験装置(以下ICテスタと呼ぶ)とICを自動的
に供給・収納する自動選別装置(以下ハンドラと呼ぶ)
により行なわれており、第4図に示すように被測定フラ
ットパッケージ■C1はハンドラ供給部よりICテスタ
との接続部分である測定部に送られ位置決めされた上で
ICテスタから伸長されたバネ性をもつ接触子(以下コ
ンタクタという)2によりICIのリード1aと電気的
導通を得て電気的特性の測定を可能にしていた。4は測
定回路を有する基板、5はバネ性をもつ接触子2と基板
4とを接続するケーブル、6はコンタクタブロック、3
はICIのリード1aをコンタクタ2に圧着するブツシ
ャである。Conventionally, when measuring the electrical characteristics of an IC, a characteristic testing device (hereinafter referred to as an IC tester) having a measurement circuit and an automatic sorting device (hereinafter referred to as a handler) that automatically supplies and stores ICs are used.
As shown in Fig. 4, the flat package C1 to be measured is sent from the handler supply section to the measurement section, which is the connection part with the IC tester, and positioned, and then the spring-strength package C1 is stretched from the IC tester. A contactor (hereinafter referred to as a contactor) 2 was used to establish electrical continuity with the lead 1a of the ICI, thereby making it possible to measure electrical characteristics. 4 is a board having a measurement circuit; 5 is a cable connecting the spring contact 2 and the board 4; 6 is a contactor block;
is a button for crimping the ICI lead 1a to the contactor 2.
最近のICはその高速化、高密度化に伴ない多ピン化に
なり、その結果フラットタイプ等のパッケージ出現等に
より電気的特性試験は非常に歎度の高いものとなってい
る。即ちICとICテスタの中間にあるコンタクタもそ
れが持つレジスタンス、リアクタンス成分が電気的特性
試験の上でその正確さを欠く一因となっているなめ、極
力コンタクタ長を含めICのリードとの接触部分からI
Cテスタの測定回路間の距離を縮める構造となり、更に
前述の多ピン化に伴ないそのコンタクタ部構造は非常に
複雑になっている。又コンタクタにはICのリードと接
触させるべく外部圧力が必要であり、更4ここの圧力を
全リードに均一にかけるため、コンタクタ自身にバネ性
を持たせている。従って、このコンタクタに安価な市販
のICソケットを利用している場合も多い、しかし、コ
ンタクタ自身が外部衝撃により破損しやすい等の欠点が
あり、その修理に際しては測定回路とコンタクタとの接
続配線を外す必要がある等かなりの保守工数及び技術が
必要とされる。Recent ICs have increased in speed and density, resulting in a large number of pins, and as a result, the appearance of packages such as flat types has made electrical property testing extremely demanding. In other words, contactors located between the IC and the IC tester also have resistance and reactance components that contribute to the lack of accuracy in electrical characteristic tests. Part to I
The structure of the C tester shortens the distance between the measurement circuits, and furthermore, as the number of pins increases as described above, the structure of the contactor section has become extremely complicated. In addition, the contactor requires external pressure to bring it into contact with the IC leads, and in order to apply this pressure evenly to all the leads, the contactor itself is provided with spring properties. Therefore, inexpensive commercially available IC sockets are often used for this contactor, but they have the disadvantage that the contactor itself is easily damaged by external shock, and when repairing it, it is necessary to connect the measurement circuit and the contactor with the wiring. Considerable maintenance man-hours and techniques are required, such as the need to remove the parts.
本発明の目的は前記課題を解決した半導体集積回路測定
装置の接触素子を提供することにある。An object of the present invention is to provide a contact element for a semiconductor integrated circuit measuring device that solves the above problems.
上述した従来のバネ性をもったコンタクタに対し、本発
明はその部分を固定式とし、コンタクタのライフタイム
を延長できるという相違点を有する。The present invention differs from the above-mentioned conventional contactor having spring properties in that the contactor part is fixed and the life time of the contactor can be extended.
前記目的を達成するため、本発明は半導体集積回路の電
気的特性を測定する自動選別装置の接触素子において、
試験評価装置の電気回路へ接続を行なう品種基板に電気
的に接続された固定接触子と、ICのリードを前記固定
接触子へ押えつけるバネ性接触子とを有するものである
。In order to achieve the above object, the present invention provides a contact element of an automatic sorting device for measuring the electrical characteristics of semiconductor integrated circuits.
It has a fixed contact electrically connected to the product type board for connection to the electric circuit of the test and evaluation device, and a spring contact that presses the IC lead against the fixed contact.
以下、本発明の実施例を図により説明する。 Embodiments of the present invention will be described below with reference to the drawings.
(実施例1)
第1図は本発明の実施例1を示す断面図、第2図は固定
接触子を示す正面図である。(Example 1) FIG. 1 is a sectional view showing Example 1 of the present invention, and FIG. 2 is a front view showing a fixed contact.
図において、測定回路を有する基板4上に絶縁性のコン
タクタ台7を設置し、該コンタクタ台7上にフラットパ
ッケージICIのリード1aに対応するピッチで複数の
導体8.8・・・を敷設し、該導体8上に、ICIのリ
ード1aと導体8との接触抵抗を低下させる突起9を設
ける。また各導体8はケーブル5を介して基板4に電気
的に接続する。ここに、コンタクタ台7、導体8、突起
9等により固定接触子が構成される。In the figure, an insulating contactor stand 7 is installed on a board 4 having a measurement circuit, and a plurality of conductors 8, 8... are laid on the contactor stand 7 at a pitch corresponding to the leads 1a of the flat package ICI. , a protrusion 9 is provided on the conductor 8 to reduce the contact resistance between the lead 1a of the ICI and the conductor 8. Further, each conductor 8 is electrically connected to the substrate 4 via the cable 5. Here, the contactor stand 7, the conductor 8, the protrusion 9, etc. constitute a fixed contact.
一方、コンタクタ台7の上方位置には、ICIのリード
1aを導体8に圧着させるブツシャ(バネ性接触子)3
を昇降可能に設け、該ブツシャ3をバネ3aにて下向き
に付勢する。On the other hand, a button (spring contact) 3 for crimping the ICI lead 1a to the conductor 8 is located above the contactor stand 7.
is provided to be movable up and down, and the button 3 is biased downward by a spring 3a.
本発明によれば、ICのリードを圧着させる固定接触子
はバネ性をもたないため、その寸法を短縮化できるとと
もに、ICのリードと固定接触子との圧着時の衝撃はバ
ネ性接触子としてのブツシャ3にて吸収するため、IC
のリードに損傷を与えることはない。According to the present invention, since the fixed contact for crimping the IC lead does not have spring properties, its dimensions can be reduced, and the impact when the IC lead and the fixed contact are crimped is absorbed by the spring contact. IC
will not damage the leads.
(実施例2) 第3図は本発明の実施例2を示す断面図である。(Example 2) FIG. 3 is a sectional view showing a second embodiment of the present invention.
本実施例はコンタクタ台7に、導体8を基板4上に形成
されている配線パターンに直線接続するためのスルーホ
ール10を設けたものである。この実施例ではICのリ
ードとの接触部から測定回路までの距離を短くできるた
め、前述したレジスタンス、リアクタンス成分の低減を
図ることができるという利点を有する。In this embodiment, a contactor stand 7 is provided with a through hole 10 for linearly connecting a conductor 8 to a wiring pattern formed on a substrate 4. This embodiment has the advantage that the distance from the contact portion with the IC lead to the measurement circuit can be shortened, so that the resistance and reactance components described above can be reduced.
尚、ICのリードをコンタクタに押えつけるブツシャは
各ビンの圧力のバラツキを低減させる為には各ピン毎に
独立した動きをもつ可動ブツシャが好ましい。It is preferable that the bushings for pressing the IC leads against the contactors be movable bushings that move independently for each pin in order to reduce variations in the pressure of each pin.
以上説明したように本発明はコンタクタ部を固定構造に
することにより、コンタクタ長を短くし、リアクタンス
、レジスタンス成分を減少させることができ、又コンタ
クタ自身の耐久性の向上にもなり、保守工数の低減を実
現できる効果がある。As explained above, by making the contactor part a fixed structure, the present invention can shorten the contactor length, reduce reactance and resistance components, improve the durability of the contactor itself, and reduce maintenance man-hours. It has the effect of achieving reduction.
第1図は本発明の実施例1を示す断面図、第2図は固定
接触子を示す正面図、第3図は本発明の実施例2を示す
断面図、第4図は従来例を示す断面図である。
1・・・IC3・・・ブツシャ
4・・・測定回路を有する基板
5・・・ケーブル
6・・・コンタクタブロック
7・・・コンタクタ台 8・・・導体9・・・突起
10・・・スルーホールε
第
図
第
図
第
図Fig. 1 is a sectional view showing Embodiment 1 of the present invention, Fig. 2 is a front view showing a fixed contact, Fig. 3 is a sectional view showing Embodiment 2 of the invention, and Fig. 4 is a conventional example. FIG. 1... IC3... Button 4... Board with measurement circuit 5... Cable 6... Contactor block 7... Contactor stand 8... Conductor 9... Protrusion 10... Through Hall ε Figure Figure Figure
Claims (1)
装置の接触素子において、試験評価装置の電気回路へ接
続を行なう品種基板に電気的に接続された固定接触子と
、ICのリードを前記固定接触子へ押えつけるバネ性接
触子とを有することを特徴とする半導体集積回路測定装
置の接触素子。(1) In a contact element of an automatic sorting device that measures the electrical characteristics of semiconductor integrated circuits, a fixed contact electrically connected to the product type board that connects to the electric circuit of the test evaluation device and the leads of the IC are connected to the 1. A contact element for a semiconductor integrated circuit measuring device, comprising a spring contact that is pressed against a fixed contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63198392A JPH0246673A (en) | 1988-08-09 | 1988-08-09 | Contact element for semiconductor integrated circuit measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63198392A JPH0246673A (en) | 1988-08-09 | 1988-08-09 | Contact element for semiconductor integrated circuit measurement device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0246673A true JPH0246673A (en) | 1990-02-16 |
Family
ID=16390365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63198392A Pending JPH0246673A (en) | 1988-08-09 | 1988-08-09 | Contact element for semiconductor integrated circuit measurement device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246673A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5896651A (en) * | 1994-10-17 | 1999-04-27 | Lsi Logic Corporation | Method of mounting microelectronic circuit package |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6258879B2 (en) * | 1982-09-30 | 1987-12-08 | Isowa Industry Co |
-
1988
- 1988-08-09 JP JP63198392A patent/JPH0246673A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6258879B2 (en) * | 1982-09-30 | 1987-12-08 | Isowa Industry Co |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5896651A (en) * | 1994-10-17 | 1999-04-27 | Lsi Logic Corporation | Method of mounting microelectronic circuit package |
| US5923538A (en) * | 1994-10-17 | 1999-07-13 | Lsi Logic Corporation | Support member for mounting a microelectronic circuit package |
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