JPH0247003U - - Google Patents
Info
- Publication number
- JPH0247003U JPH0247003U JP12673288U JP12673288U JPH0247003U JP H0247003 U JPH0247003 U JP H0247003U JP 12673288 U JP12673288 U JP 12673288U JP 12673288 U JP12673288 U JP 12673288U JP H0247003 U JPH0247003 U JP H0247003U
- Authority
- JP
- Japan
- Prior art keywords
- film
- resistor
- electrode
- hole
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
第1図は本願考案のチツプ型半固定抵抗器の断
面図であり、第4図の―線断面に相当する図
、第2図は第1図のA部拡大図、第3図は抵抗体
皮膜3の形成方法の説明図、第4図は本願考案の
前提となるチツプ型半固定抵抗器の平面図、第5
図は第4図の―線断面図、第6図は第5図の
―線断面図、第7図は裏面図である。
1……セラミツク基板、2……透孔、3……抵
抗体皮膜、4……電極皮膜、5……電極金具、6
……カシメ軸筒、7……摺動子、7a……触子部
、10……樹脂コーテイング。
Fig. 1 is a sectional view of the chip-type semi-fixed resistor of the present invention, and corresponds to the cross section taken along the line - in Fig. 4. Fig. 2 is an enlarged view of section A in Fig. 1, and Fig. 3 shows the resistor. FIG. 4 is a plan view of a chip type semi-fixed resistor which is the premise of the invention of the present application, and FIG.
The drawings are a cross-sectional view taken along the line -- in FIG. 4, FIG. 6 is a cross-sectional view taken along the line -- in FIG. 5, and FIG. 7 is a back view. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 2... Through hole, 3... Resistor film, 4... Electrode film, 5... Electrode fitting, 6
...Caulking shaft cylinder, 7...Slider, 7a...Touch portion, 10...Resin coating.
Claims (1)
いて上記透孔を中心とする円弧部を有する馬蹄形
の抵抗体皮膜を形成するとともに、基板の一側面
ないし裏面に上記抵抗体皮膜の両端部とそれぞれ
導通する電極皮膜を形成し、かつ、上記抵抗皮膜
に樹脂コーテイングを施した後、上記電極皮膜を
ハンダメツキする一方、上記基板の裏面に沿つて
基板の他側部に至る薄板状の電極金具に設けたカ
シメ軸筒を上記透孔に通挿し、かつ、上記電極皮
膜に接触する触子部をもつ摺動子を上記カシメ軸
筒の先端部に回転可能にカシメてなるチツプ型半
固定抵抗器において、 上記電極皮膜は、目標膜厚を超える厚みの皮膜
を印刷形成した上で、その表面に上記ハンダメツ
キ施行の前に施される上記樹脂コーテイングとと
もに上記ハンダメツキ施行後所定深さ削除するこ
とにより、目標膜厚とするとともに、表面を露出
させていることを特徴とする、チツプ型半固定抵
抗器。[Claims for Utility Model Registration] A horseshoe-shaped resistor film having an arc portion centered on the through hole in plan view is formed on the upper surface of a substrate having a through hole in the center, and on one side or the back surface of the substrate. After forming electrode films that are electrically conductive with both ends of the resistor film and applying resin coating to the resistor film, the electrode films are solder-plated, while the other side of the board is coated along the back surface of the board. A caulking shaft tube provided on a thin plate-shaped electrode fitting leading to the above is inserted through the through hole, and a slider having a contact portion that contacts the electrode film is rotatably caulked to the tip of the caulking tube. In the chip-type semi-fixed resistor, the electrode film is formed by printing a film with a thickness exceeding the target film thickness, and then applying the resin coating to the surface of the film before the solder plating and after the solder plating. A chip-type semi-fixed resistor characterized in that a target film thickness is obtained by removing a predetermined depth and the surface is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12673288U JPH0247003U (en) | 1988-09-28 | 1988-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12673288U JPH0247003U (en) | 1988-09-28 | 1988-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247003U true JPH0247003U (en) | 1990-03-30 |
Family
ID=31378512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12673288U Pending JPH0247003U (en) | 1988-09-28 | 1988-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247003U (en) |
-
1988
- 1988-09-28 JP JP12673288U patent/JPH0247003U/ja active Pending
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