JPH0247035U - - Google Patents

Info

Publication number: JPH0247035U
Authority: JP; Japan
Prior art keywords: bonding; bonding wire; semiconductor element; external lead; abnormality
Prior art date: 1988-09-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1988126127U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-09-27

Filing date

1988-09-27

Publication date

1990-03-30

1988-09-27 Application filed filed Critical

1988-09-27 Priority to JP1988126127U priority Critical patent/JPH0247035U/ja

1990-03-30 Publication of JPH0247035U publication Critical patent/JPH0247035U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01551—Changing the shapes of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Testing Or Measuring Of Semiconductors Or The Like (AREA)
Wire Bonding (AREA)

JP1988126127U 1988-09-27 1988-09-27 Pending JPH0247035U (mo)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1988126127U JPH0247035U (mo)	1988-09-27	1988-09-27

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1988126127U JPH0247035U (mo)	1988-09-27	1988-09-27

Publications (1)

Publication Number	Publication Date
JPH0247035U true JPH0247035U (mo)	1990-03-30

Family

ID=31377359

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1988126127U Pending JPH0247035U (mo)	1988-09-27	1988-09-27

Country Status (1)

Country	Link
JP (1)	JPH0247035U (mo)

1988
- 1988-09-27 JP JP1988126127U patent/JPH0247035U/ja active Pending

Publication	Publication Date	Title
JPS6422046U (mo)	1989-02-03
JPH01107141U (mo)	1989-07-19
JPH01142822U (mo)	1989-09-29
JPS62122359U (mo)	1987-08-03
JPS63128729U (mo)	1988-08-23
JPH045652U (mo)	1992-01-20
JPH01174932U (mo)	1989-12-13
JPS61149306U (mo)	1986-09-16
JPS63165846U (mo)	1988-10-28
JPH01140843U (mo)	1989-09-27
JPH01156562U (mo)	1989-10-27
JPH02102734U (mo)	1990-08-15
JPH01167044U (mo)	1989-11-22
JPS6296860U (mo)	1987-06-20
JPS6343432U (mo)	1988-03-23
JPH028053U (mo)	1990-01-18
JPH0238739U (mo)	1990-03-15
JPH0474463U (mo)	1992-06-30
JPS5839059U (ja)	1983-03-14	リ−ドフレ−ム
JPH0289849U (mo)	1990-07-17
JPH01160855U (mo)	1989-11-08
JPH0313754U (mo)	1991-02-12
JPH0361341U (mo)	1991-06-17
JPH0224548U (mo)	1990-02-19
JPS63157936U (mo)	1988-10-17