JPH0247036U - - Google Patents
Info
- Publication number
- JPH0247036U JPH0247036U JP1988126126U JP12612688U JPH0247036U JP H0247036 U JPH0247036 U JP H0247036U JP 1988126126 U JP1988126126 U JP 1988126126U JP 12612688 U JP12612688 U JP 12612688U JP H0247036 U JPH0247036 U JP H0247036U
- Authority
- JP
- Japan
- Prior art keywords
- wire clamp
- determines
- plate
- angle
- installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例１を示す斜視図、第２
図は実施例１をワイヤボンダのボンデイングステ
ージに装着した側面図、第３図、第４図は本考案
の実施例２を示す斜視図である。
１，１１……ベース、２ａ，２ｂ……取付孔、
３……クロスライン、４……目盛、５，１２……
位置形決め板、６ａ，６ｂ，６ｃ，６ｄ……固定
ネジ、７，１５……角度板、８……角度指示板、
９……角度目盛、１０，１６……高さ決め板、１
３ａ，１３ｂ，１３ｃ，１３ｄ……アリ溝、１４
……ストツパ、１７……脱着方向、１０１……ワ
イヤークランプ、１０２……アルミワイヤ、１０
３……ボンデイングステージ、１０４……ボンデ
イングホーン、１０５……ツール。
Fig. 1 is a perspective view showing the first embodiment of the present invention; Fig. 2 is a perspective view showing the first embodiment of the present invention;
The figure is a side view showing the first embodiment mounted on a bonding stage of a wire bonder, and FIGS. 3 and 4 are perspective views showing the second embodiment of the present invention. 1, 11...Base, 2a, 2b...Mounting hole,
3...Cross line, 4...Scale, 5,12...
Positioning plate, 6a, 6b, 6c, 6d... fixing screw, 7, 15... angle plate, 8... angle indicating plate,
9... Angle scale, 10, 16... Height determining plate, 1
3a, 13b, 13c, 13d...Dovetail groove, 14
... Stopper, 17 ... Attachment and removal direction, 101 ... Wire clamp, 102 ... Aluminum wire, 10
3...Bonding stage, 104...Bonding horn, 105...Tool.
Claims (1)
クロスラインと、ワイヤークランプの取付角度を
決定する角度板と、ワイヤークランプの取付高さ
を決定する高さ決め板とを有することを特徴とす
るワイヤークランプ位置決め治具。 A wire clamp characterized by having a cross line that serves as a reference point when installing the wire clamp, an angle plate that determines the installation angle of the wire clamp, and a height determining plate that determines the installation height of the wire clamp. Positioning jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126126U JPH0247036U (en) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126126U JPH0247036U (en) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247036U true JPH0247036U (en) | 1990-03-30 |
Family
ID=31377357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126126U Pending JPH0247036U (en) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247036U (en) |
-
1988
- 1988-09-27 JP JP1988126126U patent/JPH0247036U/ja active Pending
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