JPH0247050U - - Google Patents
Info
- Publication number
- JPH0247050U JPH0247050U JP1988126173U JP12617388U JPH0247050U JP H0247050 U JPH0247050 U JP H0247050U JP 1988126173 U JP1988126173 U JP 1988126173U JP 12617388 U JP12617388 U JP 12617388U JP H0247050 U JPH0247050 U JP H0247050U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- metal base
- insulating frame
- frame
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。
１……金属基体、１ａ……凹部、１ｂ……金属
層、２……絶縁枠体、４……メタライズ金属層、
５……ロウ材。
FIG. 1 is a cross-sectional view showing an embodiment of a package for housing semiconductor elements of the present invention, and FIG. 2 is a cross-sectional view of a conventional package for housing semiconductor elements. DESCRIPTION OF SYMBOLS 1... Metal base, 1a... Recessed part, 1b... Metal layer, 2... Insulating frame, 4... Metallized metal layer,
5... Wax wood.
Claims (1)
る金属基体と、該基体上にロウ付けされた絶縁枠
体とを有し、前記絶縁枠体に、前記金属基体の凹
部中央部上を開放し且つ該枠体が凹部の周縁より
内方近傍部上を覆うように貫通孔を形成したこと
を特徴とする半導体素子収納用パツケージ。 A metal base having a recess on the upper surface for accommodating a semiconductor element, and an insulating frame brazed onto the base, the insulating frame having a central part of the recess of the metal base open, and 1. A package for housing a semiconductor device, characterized in that the frame has a through hole formed so as to cover an area near the inner side of the periphery of the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126173U JPH0247050U (en) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126173U JPH0247050U (en) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247050U true JPH0247050U (en) | 1990-03-30 |
Family
ID=31377445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126173U Pending JPH0247050U (en) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247050U (en) |
-
1988
- 1988-09-26 JP JP1988126173U patent/JPH0247050U/ja active Pending