JPH0247050U - - Google Patents
Info
- Publication number
- JPH0247050U JPH0247050U JP1988126173U JP12617388U JPH0247050U JP H0247050 U JPH0247050 U JP H0247050U JP 1988126173 U JP1988126173 U JP 1988126173U JP 12617388 U JP12617388 U JP 12617388U JP H0247050 U JPH0247050 U JP H0247050U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- metal base
- insulating frame
- frame
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……金属基体、１ａ……凹部、１ｂ……金属
層、２……絶縁枠体、４……メタライズ金属層、
５……ロウ材。
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……金属基体、１ａ……凹部、１ｂ……金属
層、２……絶縁枠体、４……メタライズ金属層、
５……ロウ材。
Claims (1)
- 上面に半導体素子を収容するための凹部を有す
る金属基体と、該基体上にロウ付けされた絶縁枠
体とを有し、前記絶縁枠体に、前記金属基体の凹
部中央部上を開放し且つ該枠体が凹部の周縁より
内方近傍部上を覆うように貫通孔を形成したこと
を特徴とする半導体素子収納用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126173U JPH0247050U (ja) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126173U JPH0247050U (ja) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247050U true JPH0247050U (ja) | 1990-03-30 |
Family
ID=31377445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126173U Pending JPH0247050U (ja) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247050U (ja) |
-
1988
- 1988-09-26 JP JP1988126173U patent/JPH0247050U/ja active Pending