JPH0247066A - Manufacture of ceramic electronic component - Google Patents
Manufacture of ceramic electronic componentInfo
- Publication number
- JPH0247066A JPH0247066A JP63197235A JP19723588A JPH0247066A JP H0247066 A JPH0247066 A JP H0247066A JP 63197235 A JP63197235 A JP 63197235A JP 19723588 A JP19723588 A JP 19723588A JP H0247066 A JPH0247066 A JP H0247066A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- pattern
- laminate
- ceramic
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims abstract description 68
- 239000011347 resin Substances 0.000 claims abstract description 68
- 239000002131 composite material Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000005245 sintering Methods 0.000 claims abstract description 11
- 238000010030 laminating Methods 0.000 claims abstract description 8
- 238000000206 photolithography Methods 0.000 claims abstract description 6
- 238000000354 decomposition reaction Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- 239000011148 porous material Substances 0.000 abstract description 16
- 239000000843 powder Substances 0.000 abstract description 16
- 239000011230 binding agent Substances 0.000 abstract description 6
- 238000007429 general method Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract 1
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 241000238876 Acari Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 241001483078 Phyto Species 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Transducers For Ultrasonic Waves (AREA)
- Inorganic Insulating Materials (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Laminated Bodies (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はセラミック電子部品の製造方法に関し、ざらに
詳しくは高精度の微細な空孔か形成されたセラミック電
子部品の製）貴方法に関づるものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing ceramic electronic components, and more specifically, to a method for manufacturing ceramic electronic components in which fine pores are formed with high precision. It is something that can be written.
［従来の技術］
従来、セラミック電子部品中に空孔を形成する方法とし
ては、セラミック焼成時に、熱分解・飛散する材料から
なるペーストをセラミックグリーンシート上に印刷し、
他のグリーンシートとｌｌ［、熱圧着して積層体を作製
し、この積層体を焼結して空孔を形成する方法、あるい
は所定のパターンに加工した高分子樹脂をグリーンシー
トと共に積層、熱圧着し、１？られた積層体を焼結して
空孔を形成する方法がある。これらの場合、ペーストあ
るいは高分子樹脂か焼結の際に熱分解・飛散して、これ
らと相似形の空孔かセラミックス中に形成される。[Prior Art] Conventionally, a method for forming pores in ceramic electronic components is to print a paste made of a material that thermally decomposes and scatters during ceramic firing on a ceramic green sheet.
There is a method in which a laminate is created by thermo-compression bonding with other green sheets, and this laminate is sintered to form holes, or a polymer resin processed into a predetermined pattern is laminated together with a green sheet and heated. Crimp and 1? There is a method of forming pores by sintering the laminate. In these cases, the paste or polymer resin is thermally decomposed and scattered during sintering, and pores similar to these are formed in the ceramic.
［発明か解決しようとする課題］
しかし、従来の空孔形成方法では、セラミックス中に微
細な空孔を高精度に形成できなかったり、空孔中にセラ
ミックス粉末が残留するなどの問題点がおった。例えば
、高温で分解・飛散するペーストをグリーンシート上に
スクリーン印刷して空孔を形成する方法では、スクリー
ン印計りの精度から１００ＩＪＩｎ幅のパターンを２０
０Ｘ／＃ｌピツチで形成するのか限界であり、またパタ
ーン厚さも１０〜２０如が限界である。従ってセラミッ
クス中に形成される空孔の形状も高々この程度であり、
電子部品用の空孔としては不充分でおる。[Problem to be solved by the invention] However, conventional pore forming methods have many problems such as not being able to form fine pores in ceramics with high precision and ceramic powder remaining in the pores. Ta. For example, in the method of screen printing a paste that decomposes and scatters at high temperatures on a green sheet to form holes, a pattern with a width of 100 IJIn can be printed on a green sheet with a width of 20
There is a limit to forming the pattern with a pitch of 0x/#l, and a pattern thickness of 10 to 20 mm is the limit. Therefore, the shape of the pores formed in ceramics is at most this size,
This is insufficient as a hole for electronic parts.
また高分子樹脂を用いる方法では、樹脂として感光性樹
脂を用い、フォトリソグラフィ技術を適用することで、
高精度にパターン化された感光性樹脂パターンを得るこ
とができるか、グリーンシーｌ〜と共に積層、熱圧着し
て積層体を作製し、これを脱バインダ、焼結して作製し
たセラミックスの空孔内部にはセラミックス粉末が残留
するという問題がある。セラミックス内に形成された空
孔内部にセラミックス粉末か残留する原因は、脱パイン
ダニ程で感光性樹脂か軟化してグリーンシートと密着し
、さらに収縮しながら分解づる時にグリーンシートの一
部を剥離さけ、この剥翻１されたセラミックスが焼結後
も粉末として残ることによると考えられる。In addition, in the method using polymer resin, photosensitive resin is used as the resin, and by applying photolithography technology,
Is it possible to obtain a highly precisely patterned photosensitive resin pattern? Ceramic voids are produced by laminating and thermo-compression bonding together with green seals, making a laminate, removing the binder, and sintering the laminate. There is a problem that ceramic powder remains inside. The reason why ceramic powder remains inside the pores formed in the ceramic is that the photosensitive resin softens during the removal of mites and adheres closely to the green sheet, and when it further shrinks and decomposes, part of the green sheet is peeled off. This is thought to be because the exfoliated ceramic remains as a powder even after sintering.
以上の点から、例えば、セラミックス内の空孔部分をイ
ンク流路として用いるインクジＴツｌ、／＼ッドを従来
の空孔形成方法により作製した場合には、インク滴の噴
出が良好に行えない等の欠点か生じていた。From the above points, for example, when an ink cartridge using the pores in ceramics as ink flow paths is manufactured using the conventional pore formation method, ink droplets can be ejected well. There were some drawbacks, such as not having any.
本発明の目的は、これらの問題点を解決し、精度の高い
微細な空孔がセラミックス内に形成されたセラミック電
子部品の製造方法を提供することにある。An object of the present invention is to solve these problems and provide a method for manufacturing a ceramic electronic component in which highly precise fine pores are formed in ceramic.
［課題を解決するための手段］
本発明は、感光性樹脂中に該感光性樹脂より分解温度の
高い材料を分散させた複合感光性樹脂層を基板上に形成
する工程と、該複合感光性樹脂層にフォトリソグラフィ
技術で所定のパターンを形成する工程と、該パターン上
にセラミックグリーンシートを積層、熱圧着して積層体
を作製する工程と、該積層体を焼結する工程とを備えて
なることを特徴とするセラミック電子部品の製造方法１
、Ｊ−３よび感光性樹脂中に離型性を有する材料を分散
させた複合感光性樹脂層を基板上に形成する工程と、該
複合感光性（か１脂層に）４トリソグラノイ技（・トＪ
で所定のパターンを形成する工程と、該パターン上にセ
ラミックグリーンシートを積層、熱圧着して積層体を作
製する工程と、該積層体を焼結する工程とを備えてなる
ことを特徴とするセラミック電子部品の製造方法である
。[Means for Solving the Problem] The present invention comprises a step of forming a composite photosensitive resin layer on a substrate in which a material having a higher decomposition temperature than the photosensitive resin is dispersed in the photosensitive resin; The method includes a step of forming a predetermined pattern on a resin layer using photolithography technology, a step of laminating a ceramic green sheet on the pattern and thermocompression bonding to produce a laminate, and a step of sintering the laminate. Method 1 for manufacturing ceramic electronic components characterized by
, a process of forming a composite photosensitive resin layer on a substrate in which a material having mold releasability is dispersed in J-3 and a photosensitive resin, and a step of forming the composite photosensitive resin layer (on the first resin layer) using the 4-trisogranoy technique (・To J
The method is characterized by comprising the steps of: forming a predetermined pattern in the process, laminating ceramic green sheets on the pattern and thermocompression bonding to produce a laminate, and sintering the laminate. This is a method for manufacturing ceramic electronic components.
本発明において、感光性樹脂としては、一般にレジスト
用に使用されているアクリル系、ナイロン系、ポリウレ
タン系等の感光性樹脂を用いることかできる。In the present invention, as the photosensitive resin, acrylic, nylon, polyurethane, and other photosensitive resins that are generally used for resists can be used.
また、これらの感光性樹脂に分散させる離型性を有する
材料としては、積層体の作製工程で感光性）か１脂が軟
化した時、グリーンシートとの密着力を低下さける作用
を有する材料であれば使用可能で必る。このような作用
を有する何科としては、例えば、テフロン系樹脂、シリ
コン系樹脂等が挙げられる。In addition, the material with mold releasability to be dispersed in these photosensitive resins is a material that has the effect of preventing the adhesion with the green sheet from decreasing when the photosensitive resin or resin softens during the process of manufacturing the laminate. If there is, it must be usable. Examples of materials having such effects include Teflon resins and silicone resins.
さらに、本発明で感光性樹脂中に分散させる該感光性樹
脂よりも分解湿度の高い＋Ａ利は、用いられる感光性樹
脂により異なるか、例えばデフロン系（か１脂、シリコ
ン系樹脂、カーボン、グラフフィト等が挙げられる。Furthermore, in the present invention, the +A rate, which has a higher decomposition humidity than that of the photosensitive resin dispersed in the photosensitive resin, may vary depending on the photosensitive resin used. Examples include phyto etc.
［作用］
本発明によれば、複合感光性樹脂を用い、フォトリソグ
ラフィ技術により空孔パターンを形成するため、非常に
微■１なパターンを粘度良く形成することができる。ま
た、感光性樹脂として、通常用いられる感光性樹脂に、
これよりも分解湿度の高い材料、あるいは離型性を有づ
る材料を分解ざぜた複合感光性樹脂を用いることによっ
て、形成された空孔内部中のセラミックス粉末の残留を
防ぐことかできる。[Function] According to the present invention, since a hole pattern is formed by photolithography using a composite photosensitive resin, a very fine pattern can be formed with good viscosity. In addition, as photosensitive resin, commonly used photosensitive resin,
By using a material with a higher decomposition humidity than this, or a composite photosensitive resin in which a material with mold releasability is decomposed, it is possible to prevent the ceramic powder from remaining inside the formed pores.
感光性樹脂中に該感光・［１（か１脂より分解湿度の商
い材料を分散させた複合感光性樹脂を用いると、説バイ
ンダ時、即ち複合感光性樹脂中の感光性樹脂が軟化、分
解する時の複合感光性樹脂の収縮率が極めて小さくなり
、該複合感光性樹脂がグリーンシートの一部を剥離する
ことがなくなる。また、感光性樹脂に離型性を有する材
料を分散させた複合感光性樹脂を用いると、脱バインダ
時の複合感光性樹脂パターンとグリーンシートの密着力
が極めて小さくなる。When using a composite photosensitive resin in which a material with a decomposition humidity higher than that of the photosensitive resin is used, the photosensitive resin in the composite photosensitive resin softens and decomposes when the binder is used. The shrinkage rate of the composite photosensitive resin when molding is extremely small, and the composite photosensitive resin will not peel off a part of the green sheet. If a photosensitive resin is used, the adhesion between the composite photosensitive resin pattern and the green sheet during binder removal becomes extremely small.
以上のことから、空孔内部にセラミックス粉末か残沼す
ることかなくなる。As a result of the above, there is no possibility of ceramic powder remaining inside the pores.
［実施例］
次に本発明の実施例について図面を参照して詳細に説明
プる。[Embodiments] Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図（ａ）〜（ｄ）は本発明の一実施例を工程順に示
ず断面図でおる。まずポリエステルなどのキＡ・す■−
フィルム上に、感光性樹脂に高分解温度何科または離型
性材料を分散させた複合感光性樹脂を所定の厚さにコー
ティング覆る。この上にパターン形成用のフォトマスク
を重ねて光を照射後、露光し、その後現＠処理を行って
、複合感光性樹脂パターンを形成する。第１図（ａ）は
このようにして作製されたキャリヤーフィルム１２上の
複合感光性樹脂パターン１１を示したものである。FIGS. 1(a) to 1(d) are sectional views of an embodiment of the present invention without showing the steps in the order of steps. First of all, materials such as polyester etc.
A composite photosensitive resin in which a photosensitive resin with a high decomposition temperature or a release material is dispersed is coated on the film to a predetermined thickness. A pattern-forming photomask is placed on top of this, irradiated with light, exposed, and then exposed to light to form a composite photosensitive resin pattern. FIG. 1(a) shows a composite photosensitive resin pattern 11 on a carrier film 12 produced in this manner.
複合感光性樹脂は、感光性樹脂を溶剤に溶解し、その溶
液中に離型性を有する材料、市るいは該感光性樹脂より
分解温度の高い材料の粉末を混合し、充分攪拌すること
で容易に複合感光性樹脂を製造することができる。Composite photosensitive resin can be produced by dissolving a photosensitive resin in a solvent, mixing in the solution a powder of a material with mold releasability, or a material with a higher decomposition temperature than the photosensitive resin, and stirring thoroughly. A composite photosensitive resin can be easily produced.
第１図（ｂ）はグリーンシート１３および複合感光性樹
脂パターン１１の積層工程を示したものである。FIG. 1(b) shows the process of laminating the green sheet 13 and the composite photosensitive resin pattern 11.
セラミックグリーンシート１３は一般的な方法に従って
セラミックス粉末、有機バインダ、可塑剤、溶剤等を混
合分散することにより泥１π状態とし、これをドクター
ブレード法、キャスティング法等によりプラスチックフ
ィルム等の上にコーティングし、乾燥することによって
作製する。積層はグリーンシート１３、複合感光性樹脂
パターン１１か所定の三次元的配置になるように金型中
に積層１し、１１０熱しながら圧力を加え−（一体止さ
せることで行われる。The ceramic green sheet 13 is made into a muddy 1π state by mixing and dispersing ceramic powder, an organic binder, a plasticizer, a solvent, etc. according to a general method, and then coated on a plastic film, etc. by a doctor blade method, a casting method, etc. , prepared by drying. The lamination is carried out by laminating the green sheet 13 and the composite photosensitive resin pattern 11 in a mold in a predetermined three-dimensional arrangement, applying pressure while heating (110), and fixing them together.
第１図（Ｃ）は一体止された積層体１４を示している。FIG. 1(C) shows the laminate 14 that is integrally fixed.
その後、積り体１４は、脱パインダニ程、焼成工程を経
て、第１図（ｄ）に示す焼結体１５になる。Thereafter, the stacked body 14 undergoes a sintering process to remove pine nuts, and becomes a sintered body 15 shown in FIG. 1(d).
この焼結体１５内には複合感光性樹脂パターン１１は消
失し、それと相似形の空孔１６が形成される。In this sintered body 15, the composite photosensitive resin pattern 11 disappears, and holes 16 having a similar shape are formed.
該工程における脱パインダニ程は、通常のセラミック製
造の場合と同様であり、積層体１４を、例えは６５０℃
で５時間程度保持することにより、脱バインダすると共
に、有機物を消失させる。また焼成条１′４−は使用す
るぜラミックの種類によって異なる。The de-pine mite step in this process is the same as in the case of ordinary ceramic manufacturing, and the laminate 14 is heated at 650°C, for example.
By holding it for about 5 hours, the binder is removed and the organic matter disappears. Furthermore, the firing strip 1'4- differs depending on the type of Zeramic used.
第２図は本発明の方法で作製したセラミックス−電極一
体型のオンデマント型インクジェットヘットを示したも
ので、同図（ａ）はその平面図、同図（ｂ）は（ａ）に
おけるＡ−Ａ′線に沿う断面図である。このオンデマン
ド型インクジェットヘッドでは圧電セラミックス２１と
してＰｂ Ｔ ｉ ０３−Ｐｂ ７ｒ ０３系のセラミ
ックスを用いた。また電（！２２の材料としては△［］
／Ｐｄの比率が７０／３０（質量比）の電極ペースト
を用いた。空孔パターン用の複合感光性樹脂層は、アク
リル系光硬化性ｉか１脂を溶剤中に溶解した後、テフロ
ン粉末をその溶液に分散させ、ポリエステルフィルム上
に塗イｂし、乾燥させて作製した。複合感光性樹脂の組
成、即ら感光性樹脂／テフロン粉末の比率は５０／ ５
０（質量比）とした。空孔パターンはこの複合感光性樹
脂を紫外線で露光し、メチルエチルケトンを用いて現像
することにより作製した。得られた空孔パターンおよび
グリーンシートを積層し、１カ２５０Ｋ（］／ Ｃｍ２
、温度１１０°Ｃの条件で金型中て熱圧着し、積層体を
作製した。このようにして得られた積層体を５°Ｃ／時
間の昇温速度で空気中で加熱し、６５０’Ｃで３時間保
持することで、積層体中の有機物を分解消失させた。焼
結は同じく空気中で行い、１１５０’Ｃで２時間保持し
て行った。Figure 2 shows a ceramic-electrode integrated on-demand type inkjet head manufactured by the method of the present invention, in which (a) is a plan view, and (b) is an A-- FIG. 3 is a sectional view taken along line A'. In this on-demand type inkjet head, a Pb Ti 03-Pb 7r 03 series ceramic was used as the piezoelectric ceramic 21 . Also, as a material for electricity (!22) △[]
An electrode paste having a ratio of /Pd of 70/30 (mass ratio) was used. The composite photosensitive resin layer for the hole pattern is made by dissolving acrylic photocurable resin in a solvent, dispersing Teflon powder in the solution, coating it on a polyester film, and drying it. Created. The composition of the composite photosensitive resin, that is, the ratio of photosensitive resin/Teflon powder is 50/5.
0 (mass ratio). A hole pattern was created by exposing this composite photosensitive resin to ultraviolet light and developing it using methyl ethyl ketone. The obtained hole pattern and green sheets were laminated and one sheet was heated to 250K (]/cm2
A laminate was produced by thermocompression bonding in a mold at a temperature of 110°C. The thus obtained laminate was heated in air at a temperature increase rate of 5°C/hour and held at 650'C for 3 hours to decompose and eliminate organic matter in the laminate. Sintering was also carried out in air and held at 1150'C for 2 hours.
このようにして作製したインクジェットｌ＼ツ１〜は電
極２２に１００Ｖ、１００μｓのパルス電圧を印加する
ことにより、電極部分が振動し、ノズル２３から良好な
インク滴の噴出が確認された。なお形成したノズル部分
は８０珈角の形状でおり、内部の圧乃至２４の部分には
高さ８０ＩＪＩｎ２幅が最大で５ｍｍの寸法の、剥離粉
末の残留しない空孔が形成されていた。When a pulse voltage of 100V and 100 μs was applied to the electrode 22 of the inkjet 1~ produced in this way, the electrode part vibrated, and it was confirmed that good ink droplets were ejected from the nozzle 23. The formed nozzle part had a shape of 80 angles, and in the inner part from 24 to 24, a hole was formed with a height of 80IJIn2 and a maximum width of 5 mm, in which no peeling powder remained.
第３図は本発明の方法で作製した圧電発音体を示したも
ので、同図（ａ）はその平面図、同図（ｂ）は（ａ）に
おけるＢ−８−線に沿う断面図である。FIG. 3 shows a piezoelectric sounding body manufactured by the method of the present invention, in which (a) is a plan view thereof, and (b) is a cross-sectional view taken along line B-8 in (a). be.
この発音体では圧電セラミックス３１として、Ｐｂ Ｔ
ｉ ０３−Ｐｂ Ｚｒ ０３系の圧電材料を、電）Φ
材料としては白金を用いた。複合感光性樹脂はフイロン
系感光性樹脂とテフロン粉末を用い、前ｊホした方法で
複合感光性樹脂図を基板上に形成し、露光、現像して空
孔パターンを作製した。圧電発音体はその内部に一部の
電（※３２を含む圧電ヒラミックス３１の駆動部を介し
て空気室３４かあり、この空気室３４は空孔３３によっ
て外部に通じていると共に、該電極３２は圧電セラミッ
クス表面の導体配線部３５に接続している。この圧電発
音体を用い、電（〜に交流電圧を加えたところ、ｌＫＨ
２の音が発生した。なおこの場合、振動体の上下にある
空気￥３４については、グリーンシートの状態で孔を形
成し、音か外部に伝わる構造とする。In this sounding body, PbT is used as the piezoelectric ceramic 31.
i 03-Pb Zr 03 series piezoelectric material, electric) Φ
Platinum was used as the material. For the composite photosensitive resin, a phyllon-based photosensitive resin and Teflon powder were used, and a composite photosensitive resin pattern was formed on a substrate by the method described above, and then exposed and developed to create a hole pattern. The piezoelectric sounding body has an air chamber 34 inside thereof via a driving part of a piezoelectric hiramix 31 including a part of electricity (*32), and this air chamber 34 communicates with the outside through a hole 33, and the electrode 32 is connected to a conductor wiring part 35 on the surface of the piezoelectric ceramic. When using this piezoelectric sounding body and applying an AC voltage to the electric current (~), lKH
2 sounds occurred. In this case, holes are formed in the green sheet for the air above and below the vibrating body, so that the sound can be transmitted to the outside.
本実施例で１ｄられた圧電発音体は、空孔のセラミック
ス粉末による詰まりかなく、特性の優れたものであった
。The piezoelectric sounding element 1d in this example had excellent characteristics, with no clogging of the pores by ceramic powder.
なお、本実施例ではインクジェットヘットおよび圧電発
音体の場合について述べたが、これらの他にもセラーミ
ックフィルタ、セラミック発振子、圧電マイクロホン、
セラミックス粉末等の空孔を必要とする電子部品のいず
れにも適用できる。In addition, in this example, the case of an inkjet head and a piezoelectric sounding body was described, but in addition to these, a ceramic filter, a ceramic resonator, a piezoelectric microphone,
It can be applied to any electronic component that requires holes such as ceramic powder.
［発明の効果］
以−り説明したように、本発明の１Ｊ法による複合感光
性樹脂からなる空孔パターンをグリーンシートに組込む
ことによって、脱バインダニ程におけるセラミックス粉
末の剥離を防止力ることかでき、特性の優れたセラミッ
ク電子部品を得ることかできる。[Effects of the Invention] As explained below, by incorporating a hole pattern made of a composite photosensitive resin into a green sheet using the 1J method of the present invention, it is possible to prevent the ceramic powder from peeling off during the debinding process. It is possible to obtain ceramic electronic components with excellent characteristics.
第１図は本発明の一実施例を工程順に示づ断面図、第２
図は本発明の方法によって製造したオンデマンド型イン
クジェットヘッドを示す図で、（ａ）はその平面図、（
ｂ）は（ａ）におけるＡ−Ａ −線に沿う断面図、第３
図は本発明の方法によって製造した圧電発音体を示す図
で、（ａ）はその平面図、 （ｂ）は（ａ）にあけるＢ
−Ｂ”線に沿う断面図でおる。
１・・・複合感光性樹脂パターン
２・・・キャリキノ−フィルム
３・・・セラミックグリーンシート
４・・・積岡体 １５・・・焼結体６．３３
・・・空孔
２１、３１・・・圧電セラミックス
２２、３２・・・電（セ ２３・・・ノズル２
４・・・圧力室 ３４・・・空気室３５・・
・導体配線部Figure 1 is a sectional view showing one embodiment of the present invention in the order of steps;
The figure shows an on-demand inkjet head manufactured by the method of the present invention, (a) is a plan view thereof, (
b) is a cross-sectional view taken along line A-A in (a), the third
The figures show a piezoelectric sounding body manufactured by the method of the present invention, (a) is a plan view thereof, (b) is a B cut in (a).
This is a cross-sectional view taken along line -B. 33
...Vacancies 21, 31...Piezoelectric ceramics 22, 32...Electric (cell) 23...Nozzle 2
4...Pressure chamber 34...Air chamber 35...
・Conductor wiring section
Claims (2)
材料を分散させた複合感光性樹脂層を基板上に形成する
工程と、該複合感光性樹脂層にフォトリソグラフィ技術
で所定のパターンを形成する工程と、該パターン上にセ
ラミックグリーンシートを積層，熱圧着して積層体を作
製する工程と、該積層体を焼結する工程とを備えてなる
ことを特徴とするセラミック電子部品の製造方法。(1) Forming a composite photosensitive resin layer on a substrate in which a material with a higher decomposition temperature than the photosensitive resin is dispersed in the photosensitive resin, and forming a predetermined pattern on the composite photosensitive resin layer using photolithography technology. 1. A ceramic electronic component characterized by comprising: a step of forming a ceramic green sheet on the pattern, a step of laminating and thermocompression bonding a ceramic green sheet to produce a laminate, and a step of sintering the laminate. Production method.
複合感光性樹脂層を基板上に形成する工程と、該複合感
光性樹脂層にフォトリソグラフィ技術で所定のパターン
を形成する工程と、該パターン上にセラミックグリーン
シートを積層，熱圧着して積層体を作製する工程と、該
積層体を焼結する工程とを備えてなることを特徴とする
セラミック電子部品の製造方法。(2) A step of forming on a substrate a composite photosensitive resin layer in which a material having mold releasability is dispersed in a photosensitive resin, and a step of forming a predetermined pattern on the composite photosensitive resin layer using photolithography technology. A method for manufacturing a ceramic electronic component, comprising: a step of laminating and thermocompression-bonding ceramic green sheets on the pattern to produce a laminate; and a step of sintering the laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19723588A JP2718077B2 (en) | 1988-08-09 | 1988-08-09 | Manufacturing method of ceramic electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19723588A JP2718077B2 (en) | 1988-08-09 | 1988-08-09 | Manufacturing method of ceramic electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0247066A true JPH0247066A (en) | 1990-02-16 |
| JP2718077B2 JP2718077B2 (en) | 1998-02-25 |
Family
ID=16371095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19723588A Expired - Lifetime JP2718077B2 (en) | 1988-08-09 | 1988-08-09 | Manufacturing method of ceramic electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2718077B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622251A (en) * | 1985-06-27 | 1987-01-08 | Nippon Telegr & Teleph Corp <Ntt> | Photosensitive resin composition and pattern formation |
| JPS62135377A (en) * | 1985-12-09 | 1987-06-18 | Nec Corp | Ink jet head and manufacture thereof |
-
1988
- 1988-08-09 JP JP19723588A patent/JP2718077B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622251A (en) * | 1985-06-27 | 1987-01-08 | Nippon Telegr & Teleph Corp <Ntt> | Photosensitive resin composition and pattern formation |
| JPS62135377A (en) * | 1985-12-09 | 1987-06-18 | Nec Corp | Ink jet head and manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2718077B2 (en) | 1998-02-25 |
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