JPH0247088U - - Google Patents
Info
- Publication number
- JPH0247088U JPH0247088U JP12645288U JP12645288U JPH0247088U JP H0247088 U JPH0247088 U JP H0247088U JP 12645288 U JP12645288 U JP 12645288U JP 12645288 U JP12645288 U JP 12645288U JP H0247088 U JPH0247088 U JP H0247088U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- sectional
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図ａ，ｂはそれぞれ本考案の第一の実施例
を説明するための多層印刷配線板の平面図および
そのＡ―Ａ′線縦断面図、第２図および第３図は
それぞれ本考案の具体的使用例を説明するため第
１図に示す多層印刷配線板に部品を搭載した状態
の縦断面図、第４図ａ，ｂはそれぞれ本考案の第
二の実施例を説明するための多層印刷配線板の平
面図およびそのＢ―Ｂ′線縦断面図、第５図ａ〜
ｆは主要工程順に示した本考案の多層印刷配線板
の断面図、第６図乃至第８図はそれぞれ従来の例
を説明するための部品搭載状態での多層印刷配線
板の縦断面図である。
１……多層印刷配線板、２……スルーホール、
３……ランド、４……表面パターン、５……内部
パターン、６……部品装着用パターン、７……座
ぐり部、８，８′，８″……部品、９，９′……
部品リード、１０……半田接続部、１１……チツ
プ部品、１２……チツプ部品側接続部、１３……
絶縁板、１４……銅箔、１５，１５′……両面板
、１５ａ，１５ａ′……パターン、１６……テフ
ロンテープ、１７……積層体。
1A and 1B are a plan view and a vertical cross-sectional view taken along the line A-A' of a multilayer printed wiring board for explaining the first embodiment of the present invention, and FIGS. In order to explain a specific usage example of the present invention, Fig. 1 is a vertical cross-sectional view of a state in which components are mounted on a multilayer printed wiring board, and Figs. A plan view of the multilayer printed wiring board and a vertical cross-sectional view taken along the line B-B', FIG.
f is a cross-sectional view of the multilayer printed wiring board of the present invention shown in the order of main steps, and FIGS. 6 to 8 are longitudinal cross-sectional views of the multilayer printed wiring board with components mounted, respectively, to explain conventional examples. . 1...Multilayer printed wiring board, 2...Through hole,
3... Land, 4... Surface pattern, 5... Internal pattern, 6... Parts mounting pattern, 7... Counterbore, 8, 8', 8''... Parts, 9, 9'...
Component lead, 10...Solder connection part, 11...Chip component, 12...Chip component side connection part, 13...
Insulating plate, 14...Copper foil, 15, 15'...Double-sided board, 15a, 15a'...Pattern, 16...Teflon tape, 17...Laminated body.
Claims (1)
その凹状座ぐり部底面に部品装着用の内部パター
ンを露出させたことを特徴とする多層印刷配線板
。 Form a concave counterbore at an arbitrary depth from the surface,
A multilayer printed wiring board characterized in that an internal pattern for mounting components is exposed on the bottom surface of the concave counterbore.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12645288U JPH0247088U (en) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12645288U JPH0247088U (en) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247088U true JPH0247088U (en) | 1990-03-30 |
Family
ID=31377991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12645288U Pending JPH0247088U (en) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247088U (en) |
-
1988
- 1988-09-27 JP JP12645288U patent/JPH0247088U/ja active Pending
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