JPH0248135B2 - DENKAIKONDENSA - Google Patents

Description

[Detailed description of the invention]

[Technical Field of the Invention] The present invention relates to an electrolytic capacitor having a novel structure that can meet market demands for smaller and thinner capacitors. [Technical background of the invention and its problems] In recent years, with the trend toward unitization of electronic components in various electronic devices, the market demand for smaller and thinner electronic components has become stronger. This is not an exception. An example of an electrolytic capacitor that can meet such market demands and whose demand will continue to increase in the future is, for example, a film package type electrolytic capacitor. Conventionally, the general structure of a film package type electrolytic capacitor is, for example, a three-layer laminate of a polyester film, an aluminum foil, and an ionomer sheet, or a four-layer laminate of a polyester film, an aluminum foil, an insulating layer, and an ionomer sheet, as shown in Figure 19. Using one of the laminated materials 41, the surfaces of the ionomer sheets of the laminated materials 41 are faced to each other, and an anode foil, a capacitor paper, and a cathode foil are stacked and rolled between them, and then flattened and electrolyzed for driving. A liquid-impregnated capacitor element 42 is sandwiched, lead terminals 43 and 44 led out from the capacitor element 42 are drawn out, and the periphery of the laminate material 41 is sealed by heat compression bonding or ultrasonic welding. . The aluminum foil is interposed in the laminate 41 to prevent the driving electrolyte from permeating through the polyester film surface, which is the outermost surface of the laminate 41, and to stably house the capacitor element 42. This is to keep the recess stable. However, the electrolytic capacitor with the above configuration is
There was a problem with the sealing part of the lead terminals 43 and 44 to the outside. In other words, when thermocompression bonding is used as a sealing method, it is very difficult to control the degree of pressure and temperature, and if the pressure temperature is too high, the melted ionomer sheet may melt during the process of placing the ionomer sheet in a molten state. Lead terminal 43,
44 moves, the aluminum foil contacts the lead terminals 43 and 44, and the lead terminals 43 and 44 are shot, and if the pressurizing temperature is insufficient, the seal is incomplete and the electrolyte leaks. In the case of ultrasonic welding, it is difficult to bond the ionomer sheet and the lead terminals 43, 44, and there is a risk of electrolyte leakage. . Also, if pressure is applied,
Even if these problems could be solved by carefully controlling the temperature, the capacitor element 42 constituting the electrolytic capacitor having the above structure is wound and flattened, and there are limits to the product dimensions, especially the thickness. For example, in order to achieve an extremely small capacitance, the dimensions of the anode foil can theoretically be small, but when making a wound element, there are limits to the winding machine, so it is necessary to increase the formation voltage of the electrode foil or to reduce the etching process. It should be possible to reduce the calculation by lowering the roughness ratio, but with a CV (capacitance x voltage) value of 75, the product size is 7 x 7 mm and the thickness is 2.5
mm, and it was impossible to make the film package electrolytic capacitor with the above structure even smaller and thinner. [Object of the invention] The present invention has been made in view of the above points, and
The object of the present invention is to provide an electrolytic capacitor having a novel structure that contributes to significant reduction in size and thickness and has stable electrical characteristics. [Summary of the Invention] The electrolytic capacitor of the present invention is made of a solderable metal and an etched and chemically treated valve metal, and has a protruding mounting portion having a through hole at any location. An organic semiconductor layer is sandwiched between cathode cladding materials made of an etched valve metal and a protruding mounting portion having through holes at arbitrary locations, and the valve metal surfaces are bonded to each other via a heat-fusible resin. It is characterized by the area around the contact being sealed and hermetically sealed by heat compression bonding or ultrasonic welding. [Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. That is, FIGS. 4 and 5 show an anode cladding material 1 constituting the present invention, and the anode cladding material 1 is made of, for example, aluminum,
Valve metals such as tantalum, titanium, niobium, etc. and solderable metals such as copper, nickel, iron, etc. are brought close together or in close contact at room temperature without applying heat, and explosives are placed on the outside to instantaneously generate a large amount of energy. The clad material is made of a valve metal 2 and a solderable metal 3, which are made of a so-called low-temperature solid-phase bonded material that is explosively bonded and rolled to a desired thickness. After etching only the two valve metal surfaces, the valve metal is masked with an acid-resistant adhesive tape, and then washed. Chemical conversion treatment is performed at a voltage suitable for the product's rated voltage to form an oxide film. After cleaning, the three metal surfaces can be soldered. The masked acid-resistant adhesive tape is removed. 6 and 7 show the cathode cladding material 4 constituting the present invention.
Like the anode cladding material 1, it is made of a valve metal 5 and a solderable metal 6, which are so-called low-temperature solid phase welded and rolled to a desired thickness, and only the valve metal 5 surface is bonded by the same means as the anode cladding material 1. It is made by applying only etching treatment. FIG. 8 shows a heat-fusible resin sheet 7 made of polyethylene,
It is made of polypropylene, ionomer (polyethylene methacrylate ester), or a mixture of polyethylene and ionomer, and has a rectangular punched part 8 of the required size formed inside. In addition, FIG. 9 shows the quinolinium-TCNQ complex salt, dimethylfericinium, which constitutes the present invention.
TCNQ complex salt, cobalticinium-TCNQ complex salt,
The organic semiconductor sheet 9 is formed into a sheet by heating N-normal propyl xinoline-TCNQ complex salt, methylquinoline-TCNQ complex salt, ethylquinoline-TCNQ complex salt, TTF-TCNQ complex salt, etc. using a mold. Thus, the electrolytic capacitor of the present invention is constructed using the anode cladding material 1, the cathode cladding material 4, the heat-fusible resin sheet 7, and the organic semiconductor sheet 9, and the combined structure thereof is shown in FIG. explain. That is, first, the cathode cladding material 4 is cut into a size calculated according to the capacitance to be obtained, and the cathode cladding material 4 is provided with a protruding mounting part 11 having a through hole 10 at an arbitrary location, and then the etched valve metal 5 side is cut. A heat-fusible resin sheet 7 having the same size as the outer diameter of the cathode cladding material 4 and having a rectangular punched part 8 on the inside is placed on the valve metal 5 side with the valve metal 5 facing upward. Square punching part 8
An anode cladding material in which an organic semiconductor sheet 9 is arranged, and a protruding mounting portion 13 having a through hole 12 at an arbitrary location, which is cut to a size calculated based on the desired capacitance, similar to the cathode cladding material 4 described above. 1,
Two surfaces of the etched and chemically treated valve metal are placed in contact with the heat-fusible resin sheet 7, and then the fusible resin sheet 7 is attached to the periphery by heat compression bonding or ultrasonic welding. At the same time as melting and sealing the periphery of the valve metals 2 and 5, an organic semiconductor sheet 9 is sandwiched between the valve metal 2 of the anode cladding material 1 and the valve metal 5 of the cathode cladding material 4. The finished product will be as shown in Figure 2. According to the electrolytic capacitor constructed as described above, the electrodes that determine the capacitance are the valve metals 2 and 5 of the anode cladding material 1 and the cathode cladding material 4 constituting the exterior, so that the required electrostatic charge is reduced. Depending on the capacity, anode cladding material 1 and cathode cladding material 4
There is a proportional relationship between the capacitance and the size of the anode cladding material 1 and the cathode cladding material 4. Therefore, for electrolytic capacitors with extremely small capacitance, the product dimensions will also be proportional. This greatly contributes to miniaturization and thinning, and is extremely effective in achieving maximum component mounting density when used on wiring boards. Further, the protruding mounting parts 13 and 11 provided on the anode cladding material 1 and the cathode cladding material 4, respectively, function as external terminals as they are, and as shown in FIG.
The conductor 14 is inserted into the through holes 10 and 12 of 1 and 13.
By connecting to the board 15 through the board 1
Electrical and mechanical connections at 5 can be easily made. Furthermore, unlike conventional film package type electrolytic capacitors, there is no need to lead out external terminals from the seal portion, so it has excellent electrical properties such as not only preventing electrical short circuits but also ensuring excellent sealing performance. Next, the actual state of miniaturization and thinning according to the present invention will be described based on specific examples shown below. That is, the first
Design value 50WV.DC constructed using the materials shown in the table.
As a result of investigating the initial electrical characteristics, product dimensions, and weight of the 0.1μF example (A) and the design value 50WV.DC - 0.47μF example (B), the results are as shown in Tables 2 and 3. Summer.

【table】

【table】

[Table] The sealing method for electrolytic capacitors is 160 to 170℃.
By heat compression bonding for 2 to 3 seconds. In addition, W, H, t indicating product dimensions in Table 3 are W, H, t shown in Fig. 1.
shows. Next, 85 of the above Example (A) and Example (B)
Figures 11 to 16 show the capacitance change rate, tan δ, and leakage current characteristics with respect to time at ℃.
Note that C in Figures 11 to 16 represents the above embodiment (A).
(B) Shows curves based on a conventional reference example of 3mmφ x 5mmL with a rubber stopper closure and using an aluminum case with the same design values. As is clear from Table 2, the electrolytic capacitor according to the present invention can be made smaller, thinner, and lighter in proportion to the desired capacitance, and is the smallest and thinnest among the wound element-based devices. For example, it is possible to easily obtain extremely small capacitors of 7 mm x 7 mm or less, which was impossible with film package type electrolytic capacitors, and the initial characteristics of capacitance, tan δ, and leakage current are also improved. It is extremely excellent. Furthermore, the 11th
As is clear from FIGS. 16 to 16, these characteristics change little over time, and compared to the conventional reference example (C), it is more reliable and extremely effective in practice. In the above embodiment, the case where the unit capacitors are made individually has been explained, but as shown in FIG. A heat-fusible resin sheet 19 is placed on the punched portion 1.
If an organic semiconductor sheet 20 is arranged in each of the parts 8 and the peripheral part of the organic semiconductor sheet 20 is sealed and then the sealed part except the outer peripheral part is cut, a large amount can be made at one time and work efficiency can be improved. You can make a big contribution. In the figure, 21 and 22 are protruding mounting portions, and 23 and 24 are through holes. In addition, in the above embodiments, a sheet-like organic semiconductor layer was exemplified, but a structure in which the above-mentioned material is made into a paste and printed on, for example, a cathode cladding material or an anode cladding material, or as shown in FIG. A heat-fusible resin sheet 26 is placed on the cathode cladding material 25, a powdered organic semiconductor powder 28 is placed in the punched portion 27 provided in the heat-fusible resin sheet 26, and the anode cladding material 29 is covered and sealed. The same effect can be obtained even if the organic semiconductor layer is made of organic semiconductor. In the figure, 30 and 31 are protruding mounting portions, and 32 and 33 are through holes. Furthermore, although the above embodiments have been described with reference to square shapes, it goes without saying that other shapes can be applied depending on the purpose. [Effects of the Invention] According to the present invention, a novel product which has good electrical characteristics, can be downsized proportionally according to the capacitance value, and can obtain maximum component mounting density when used in a wiring board. It is possible to obtain an electrolytic capacitor with this structure.

[Brief explanation of drawings]

Figures 1 to 9 relate to an embodiment of the present invention, and Figures 1 and 2 show an electrolytic capacitor, with Figure 1 being a perspective view and Figure 2 being a sectional view taken along line XX in Figure 1. ,
Figure 3 is a perspective view explaining the structure during assembly, Figures 4 and 5 show the anode cladding material, Figure 4 is a perspective view, Figure 5 is an enlarged view of part A in Figure 4, and Figures 6- Figure 7 shows the cathode clad material, Figure 6 is a perspective view, Figure 7 is an enlarged view of the bottom part of Figure 6, Figure 8 is a perspective view of the heat-fusible resin sheet, and Figure 9 is an organic material. FIG. 10 is a perspective view showing a semiconductor sheet, FIG. 10 is a sectional view showing an electrolytic capacitor according to an embodiment of the present invention attached to a substrate, FIG. 11 is a time-capacitance change rate characteristic curve, and FIG. 12 is a time-based diagram. - tan δ characteristic curve diagram, No. 13
The figure is a time-leakage current characteristic curve, Figure 14 is a time-capacitance change rate characteristic curve, and Figure 15 is a time-tanδ characteristic curve.
FIG. 16 is a time-leakage current characteristic curve diagram, FIG. 17 is a perspective view illustrating a configuration during assembly of an electrolytic capacitor according to another embodiment of the present invention, and FIG. 18 is a diagram showing another embodiment of the present invention. FIG. 19 is a perspective view illustrating a configuration during assembly of an electrolytic capacitor according to a conventional reference example. 1, 16, 29... Anode cladding material, 2, 5...
... Valve metal, 3,6... Solderable metal, 4,17,25... Cathode cladding material, 7,1
9,26... Heat-fusible resin sheet, 9,20...
Organic semiconductor sheet, 11, 21, 30... protruding attachment part, 13, 22, 31... protruding attachment part, 28...
...organic semiconductor powder, 10,23,32...through hole, 12,24,33...through hole.

Claims (1)

[Scope of Claims] 1. An anode clad material in which only the valve metal surface of the clad material is made of a solderable metal and a valve metal and is provided with a protruding mounting portion having a through hole at an arbitrary location and subjected to chemical conversion treatment. A cathode cladding material made of a solderable metal and a valve metal and having a protruding mounting portion having a through hole at an arbitrary location etched only on the valve metal surface of the cladding material, and a valve of the cathode cladding material. an organic semiconductor layer sandwiched between a working metal surface and a valve metal surface of the anode cladding material; and a heat-fusible resin disposed around the organic semiconductor layer and bonding between the valve metal surfaces. Features of electrolytic capacitors. 2 Claim 1 characterized in that the solderable metal is made of copper, nickel, iron, etc.
Electrolytic capacitors listed in section. 3 Organic semiconductor layer is quinolinium-TCNQ complex salt,
Dimethylfelicinium-TCNQ complex salt, cobalticinium-TCNQ complex salt, N-n-n-propyl xinoline-TCNQ complex salt, methylquinoline-TCNQ complex salt, ethylquinoline-TCNQ complex salt,
The electrolytic capacitor according to claim 1 or 2, characterized in that it is made of a TTF-TCNQ complex salt. 4. The electrolytic capacitor according to claims 1 to 3, wherein the heat-fusible resin is made of polyethylene, polypropylene, an ionomer, or a mixture of polyethylene and an ionomer.