JPS6197813A - Electrolytic capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an electrolytic capacitor having a novel structure that can meet market demands for smaller and thinner capacitors.

[Technical cart of the invention and its problems] In recent years, with the trend toward unitization of electronic components in various electronic devices, the market demand for smaller and thinner electronic components has become stronger. This is not an exception. An example of an electrolytic capacitor that can meet such market demands and whose demand is likely to increase in the future is, for example, a film package type electrolytic capacitor.

Conventionally, the general structure of a film package type electrolytic capacitor is, for example, a three-layer laminate of a polyester film, aluminum foil, and an ionomer sheet, or a four-layer laminate of a polyester film, an aluminum foil, an insulating layer, and an ionomer sheet, as shown in Figure 18. Using any of the laminates U (21) of the laminate material, the ionomer sheets of the laminate material (21) are placed with their faces facing each other, and the anode foil, capacitor paper, and cathode foil are stacked therebetween and rolled and flattened. A capacitor element (22) impregnated with a driving electrolyte is sandwiched between the capacitor elements (22), the lead terminals (23024) led out from the capacitor element (22) are pulled out, and the periphery of the laminate material (21) is heat-pressed or ultrasonically bonded. It is sealed by welding.

The purpose of interposing aluminum foil in the laminate (21) is to prevent the driving electrolyte from permeating through the polyester film surface, which is the outermost surface of the laminate (21), and to stabilize the capacitor element (22). This is to keep the recess formed for storage stable.

However, the electrolytic capacitor having the above structure has a problem in the sealing portion of the lead terminal (23) (24) to the outside. In other words, when thermocompression bonding is used as a sealing method, it is very difficult to control the degree of pressure and temperature, and if the temperature of the pressure is too high, the ionomer sheet may be melted during the process of being placed in a molten state. The terminals (23) and (24) move, and the aluminum foil and lead terminals (
23) (24) will come into contact and cause a short circuit between the lead terminals (23N24), and if the pressurized temperature is insufficient, the seal will be incomplete and the electrolyte will leak. For ultrasonic welding,
It was difficult to bond the ionomer sheet and the lead terminal (23H24), and there was a risk of electrolyte leakage, which was a fatal problem as an electrolytic capacitor. Furthermore, even if these problems could be solved by carefully controlling the pressure and temperature, the capacitor elements that make up the electrolytic capacitor with the above configuration (
22) is a product that is rolled and flattened, and there are limits to the product dimensions, especially the thickness.For example, in order to achieve an extremely small capacitance, the anode foil size can theoretically be small, but When making a circuit element, there is a limit to the winding process, and it should be possible to reduce it by increasing the formation voltage of the electrode foil or lowering the roughness of the etching, but the CV (capacitance fix voltage)
Value 75, product dimensions 7 x 7 mm, thickness 2.5 m
m is the limit, and it was impossible to further reduce the size and thickness of the 14-component film package electrolytic capacitor described above.

[Purpose of the Invention] The present invention has been made in view of the above points, and it is an object of the present invention to provide an electrolytic capacitor that contributes to significant reduction in size and thickness, and has a novel structure with stable electrical characteristics. The purpose is to

[Summary of the Invention] The electrolytic capacitor of the present invention comprises an anode cladding material made of a solderable metal and an etched and chemically treated valve metal, and a cathode cladding material made of a solderable metal and an etched valve metal. It is characterized by sandwiching an organic semiconductor layer therebetween and sealing the area around the contact between the valve metal surfaces using heat-pressure bonding or ultrasonic welding via a heat-fusible resin.

[Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. That is, FIGS. 4 and 5 show the anode cladding material (1) constituting the present invention, and the anode cladding material (1) is made of, for example, aluminum.

Valve metals such as tantalum, titanium, and niobium and solderable metals such as copper, nickel, and iron are brought close together or in close contact at room temperature without applying heat, and explosives are placed on the outside to instantaneously generate a large amount of energy. The clad material is made of a valve metal Jim (2) and a solderable metal (3), which is made of a cladding material that has been subjected to so-called low-temperature solid-state welding and rolled to a desired thickness. ) surface made of polypropylene, polyester, etc.
4 Mask with M adhesive tape and remove the valve metal (2).
It is made by etching only the surface, cleaning it, chemically treating it at a voltage suitable for the product's rated voltage to form an oxide film, and then removing the acid-resistant adhesive tape that masked the solderable metal (3) surface. be.

Figures 6 and 7 show a cathode cladding material (4) constituting the present invention, and the cathode cladding material (4) is subjected to so-called low-temperature solid phase bonding in the same manner as the anode cladding material (1). It consists of a valve metal (5) rolled to a thickness of This is what happens. Figure 8 shows a heat-fusible resin sheet (7), including polyethylene, polypropylene,
Ionomer (polyethylene methacrylate)
Alternatively, it is made of a mixture of polyethylene and ionomer, and has a rectangular punched part (8) of the required size formed inside. In addition, FIG. 9 shows the quinolinium-TCNQ complex salt constituting the present invention, dimethylferridinium-TC.
NQ complex salt, cobalticinium-TCNQ complex salt, N-normal bropyl xinoline-TCNQ complex salt, methylquinoline-TCNQ name salt, ethylquinoline-TCNQ complex salt,
This is an organic semiconductor sheet (9) made by heating T, T, F-TCNQ complex salts, etc. using a mold to form a sheet. Thus, the anode cladding material (1) and the cathode cladding material (4).

Thermoadhesive resin sheet (1) and organic semiconductor sheet (9)
) is used to construct the electrolytic capacitor of the present invention, and the combined structure thereof will be explained with reference to FIG. That is, first, place the cathode cladding material (4) cut into a size calculated according to the capacitance to be obtained with the etched valve metal (5) side facing upward. ) A heat-fusible resin sheet (7) set to the same size as the outer diameter of the cathode cladding material (4) and having a rectangular punched portion (8) inside is placed on the surface, and the rectangular punched portion is cut out. An organic semiconductor sheet (9) is placed in the section (8), and the anode cladding material (1), which is heated to a size calculated based on the desired capacitance like the cathode cladding material (4), is etched and etched. Place the chemically treated valve metal Ir1 (2) surface in contact with the heat-fusible resin sheet 1-(7) surface,
Thereafter, the heat-fusible resin sheet (7) is melted by heat-pressing or ultrasonic welding at the peripheral portion to form the valve metal!
(2) At the same time as sealing the peripheral part of (5), the organic semiconductor sheet (9) is attached to the valve metal (2) of the anode cladding material (1).
) and the valve metal (5) of the cathode cladding material (4) to form a finished product as shown in FIGS. 1 and 2.

According to the electrolytic capacitor constructed as described above, the electrode itself that determines the capacitance is the valve metal (2) of the anode cladding material (1) and the cathode cladding material (4) that constitute the exterior.
)(5), the size of the anode cladding material (1) and the cathode cladding material (4) is determined by the required capacitance.
) and the size of the cathode cladding material (4) have a proportional relationship. Therefore, in electrolytic capacitors with extremely small capacitance, the product dimensions are proportionally smaller, contributing greatly to miniaturization and thinning, and making it suitable for use in wiring boards. This is extremely effective in obtaining maximum component mounting density. Also, anode cladding material (1)
The solderable metals (3) and (6) of the cathode cladding material (4) function as external terminals, and can be easily mounted and used as a chip-type electrolytic capacitor.
It is possible to easily connect a lead terminal of any configuration to any location on the solderable metal surfaces (3) and (6), and it is suitable for arbitrary incorporation into various devices.

Furthermore, unlike conventional film package type electrolytic capacitors, there is no need to lead out external terminals from the sealing portion, so it has excellent electrical properties such as not only preventing electrical short circuits but also ensuring excellent airtightness.

Next, the actual state of miniaturization and thinning according to the present invention will be described based on specific examples shown below. In other words, the example (A) has a design value of 50 WV, DC-0, 1 μF and a design value of 5 Q WV, DC-0, 47 μF, which is constructed using the materials shown in Table 1.
As a result of examining the initial electrical characteristics, product dimensions, and weight of each of Example (8) of F, the results are shown in Tables 2 and 3.

Table 3 The sealing means for electrolytic capacitors is 160~'';70
"By heating and pressing for 2 to 3 seconds. Also, W, H, and t showing the product dimensions in Table 3 indicate V, H, and t shown in Figure 1. Next, the above example (Δ) and Example (B) 85℃
Figures 10 to 15 show the capacity unity ratio, tan δ, and leakage current characteristics with respect to the falling time. Na J3 1st
(C) in Figures 0 to 15 represents the above embodiments (A) and (B).
A curve is shown based on a conventional reference example of 3 mmφ x 5 mm L using an aluminum case with the same general head and a rubber stopper.

As is clear from Table 2, the electrolytic capacitor according to the present invention can be made smaller, thinner, and lighter in proportion to the desired capacitance, and is the smallest and thinnest product based on wound elements. For example, 7 MX 7 m, which was impossible with film package type electrolytic capacitors.
Very small particles of less than m can be easily obtained,
In addition, the initial characteristics of capacitance, tan δ, and leakage current are also extremely excellent. Furthermore, as is clear from FIGS. 10 to 15, these characteristics have little change over time and are more reliable than the conventional reference example (C), and are extremely effective in practical use. Recognize.

In the above embodiment, the case where the unit condensers were made individually was explained as an example, but as shown in Fig. 16, a large anode cladding material (10) and a large cathode cladding material (1
1) Lay out a heat-fusible resin sheet (13) with a plurality of punched parts (12) between them, and place a row of semiconductor sheets (74 sheets) in each of the punched parts (12). By sealing the periphery of the organic semiconductor sheet (14) and then cutting the sealed portion except for the outer periphery, Inuyama's products can be made in one go, which greatly contributes to improving work efficiency. In the example, a sheet-like organic semiconductor layer was exemplified, but a structure in which the above-mentioned material is made into a paste form and printed on, for example, a cathode cladding material or an anode cladding material, or a cathode cladding material as shown in FIG. (15)
A heat-fusible resin sheet (16) is placed on the heat-fusible resin sheet (16), a powdered organic semiconductor layer (18) is placed on the punched portion (17) provided in the heat-fusible resin sheet (16), and the anode cladding (1 The same effect can be obtained by overturning and sealing the organic semiconductor layer.

In the above embodiments, the square shape was briefly described, but it goes without saying that other shapes can be applied depending on the purpose.

[Effects of the Invention] According to the present invention, there is a novel structure that has two good electrical characteristics, can be proportionally downsized according to one capacitance, and can obtain the maximum component mounting density when used in a wiring board. It is possible to obtain an electrolytic capacitor with a similar structure.

[Brief explanation of the drawing]

Figures 7J1 to 9 relate to an embodiment of the present invention, and Figures 1 and 2 show an electrolytic capacitor, with Figure 1 being a perspective view, Figure 2 being a sectional view taken along line xx in Figure 1, and Figure 2 being a perspective view. Fig. 3 is a perspective view explaining the configuration during assembly, Figs. 4 and 5 show the anode cladding material, Fig. 4 is a perspective view, Fig. 5 is an enlarged view of part A in Fig. 4, and Figs. Figure 7 shows the cathode cladding material.
The figure is a perspective view, FIG. 7 is an enlarged view of the mouth part of FIG. 6, FIG. 8 is a perspective view showing a heat-fusible resin sheet, FIG. - Volume weight change rate characteristic curve diagram, Figure 11 is a time-tan δ characteristic curve diagram, &! ] Figure 2 is a R-leakage current characteristic curve, Figure 13 is a time-volume σ change rate characteristic curve, Figure 14 is a time-tan δ characteristic curve, and Figure 15 is a time-leakage current characteristic curve. FIG. 16 is a perspective view illustrating the construction of an electrolytic capacitor in the middle of assembly according to another embodiment of the present invention, FIG. 17 is a perspective view illustrating the construction of an electrolytic capacitor in the middle of assembly according to another embodiment of the present invention, and FIG. FIG. 2 is a perspective view illustrating the configuration of an electrolytic capacitor according to a reference example in the middle of being assembled. (1) (10) (19)...N+'U cladding material (2H5)...Valve metal (3) (6)... ......Solderable metal (4H11) (15)...Cathode cladding material (7) (13) (16)...Thermal fusion activation Resin sheet (9H14)・・・・・・・・・・・・Semiconductor sheet (18)・・・・・・・・・・・・・・・
...Organic semiconductor powder patent applicant Marukon Electronics Co., Ltd. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6. Fig. 17 Fig. 18 Fig. 1θ: rfl (-fL) Fig. 12: rfl (n) Fig. 13: 4 squares (5) Fig. 1Lf Fig. 75 Haruen (hole)

Claims (4)

[Claims] (1) An anode cladding material in which only the valve metal surface of the cladding material made of a solderable metal and a valve metal is etched and chemically treated, and the valve made of a cladding material made of a solderable metal and a valve metal. a cathode cladding material with only the working metal surface etched; an organic semiconductor layer sandwiched between the valve metal surface of the cathode cladding material and the valve metal surface of the anode cladding material; An electrolytic capacitor characterized by comprising a heat-fusible resin that bonds working metal surfaces. (2) The electrolytic capacitor according to claim (1), wherein the solderable metal is made of copper, nickel, iron, or the like. (3) The organic semiconductor layer is quinolinium-TCNQ complex salt, dimethylferricinium-TCNQ complex salt, cobalticinium-TCNQ complex salt, N-n-n-propyl xinoline-TCNQ complex salt, methylquinoline-TCNQ complex salt, ethylquinoline-TCNQ complex salt, T, An electrolytic capacitor according to claim 1 or claim 2, characterized in that the electrolytic capacitor is made of a T,F-TCNQ complex salt. (4) The heat-fusible resin is polyethylene, polypropylene,
An electrolytic capacitor according to claims (1) to (3), characterized in that it is made of an ionomer, a mixture of polyethylene and an ionomer, or the like.