JPH0249155U - - Google Patents
Info
- Publication number
- JPH0249155U JPH0249155U JP12715188U JP12715188U JPH0249155U JP H0249155 U JPH0249155 U JP H0249155U JP 12715188 U JP12715188 U JP 12715188U JP 12715188 U JP12715188 U JP 12715188U JP H0249155 U JPH0249155 U JP H0249155U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- cooling element
- thermoelectric cooling
- optical fiber
- constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000013307 optical fiber Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000012544 monitoring process Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の一実施例の縦断面図、第２図
は第１図で示す実施例の有効性を従来の場合と比
較した接合面のハンダ厚に対する接着強度を示す
説明図、第３図は第１図、第２図で示す実施例の
有効性を従来の場合と比較した冷熱衝撃試験（−
４０℃〜＋７０℃）のサイクル数に対するΔＴの
劣化量を示す説明図である。
１……半導体レーザ、２……モニタ用フオトダ
イオード、３……ステム、４……サブマウント、
５……温度検出素子、６……球レンズ、７……電
子冷却素子、８……パツケージ、９……集束性ロ
ツドレンズ、１０……集束性ロツドレンズ保持部
品、１１……保持部品、１２……光フアイバ保持
部品、１３……光フアイバ、１４……半田、１５
……メタルキヤツプ。
FIG. 1 is a longitudinal cross-sectional view of an embodiment of the present invention, FIG. 2 is an explanatory diagram showing the effectiveness of the embodiment shown in FIG. Figure 3 shows a thermal shock test (-
FIG. 4 is an explanatory diagram showing the amount of deterioration of ΔT with respect to the number of cycles (40° C. to +70° C.). 1...Semiconductor laser, 2...Monitor photodiode, 3...Stem, 4...Submount,
5... Temperature detection element, 6... Ball lens, 7... Electronic cooling element, 8... Package, 9... Focusing rod lens, 10... Focusing rod lens holding part, 11... Holding part, 12... Optical fiber holding part, 13... Optical fiber, 14... Solder, 15
...Metal cap.
Claims (1)
電子冷却素子上に搭載された半導体レーザとモニ
タ用フオトダイオードと温度検出素子と該半導体
レーザと光フアイバとを光結合する結合光学系と
該光フアイバとから成る電子冷却素子付半導体レ
ーザモジユールに於て、気密パツケージ内壁面と
、該半導体レーザ、モニタ用フオトダイオード温
度検出素子とを搭載した部品の該電子冷却素子低
温側の接合面に多数の溝あるいは、段差形状を設
け該溝あるいは段差の高さを一定にし、該電子冷
却素子と接合面の厚さを一定にすることを特徴と
する半導体レーザモジユール。 A thermoelectric cooling element housed in an airtight package, a semiconductor laser mounted on the thermoelectric cooling element, a monitoring photodiode, a temperature detection element, a coupling optical system for optically coupling the semiconductor laser and the optical fiber, and the optical fiber. In a semiconductor laser module with a thermoelectric cooling element, a large number of grooves are formed on the inner wall surface of the airtight package, and on the joining surface of the component on which the semiconductor laser and the monitoring photodiode temperature detection element are mounted, on the low temperature side of the thermoelectric cooling element. Alternatively, a semiconductor laser module is characterized in that a step shape is provided, the height of the groove or the step is constant, and the thickness of the bonding surface with the electronic cooling element is constant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12715188U JPH0249155U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12715188U JPH0249155U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0249155U true JPH0249155U (en) | 1990-04-05 |
Family
ID=31379318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12715188U Pending JPH0249155U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249155U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001319984A (en) * | 2000-05-11 | 2001-11-16 | Furukawa Electric Co Ltd:The | Package for photo semiconductor device and optical semiconductor device module using package |
| JP2012044095A (en) * | 2010-08-23 | 2012-03-01 | Sumitomo Electric Ind Ltd | Optical module |
-
1988
- 1988-09-30 JP JP12715188U patent/JPH0249155U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001319984A (en) * | 2000-05-11 | 2001-11-16 | Furukawa Electric Co Ltd:The | Package for photo semiconductor device and optical semiconductor device module using package |
| JP2012044095A (en) * | 2010-08-23 | 2012-03-01 | Sumitomo Electric Ind Ltd | Optical module |
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