JPH0249214U - - Google Patents
Info
- Publication number
- JPH0249214U JPH0249214U JP12886788U JP12886788U JPH0249214U JP H0249214 U JPH0249214 U JP H0249214U JP 12886788 U JP12886788 U JP 12886788U JP 12886788 U JP12886788 U JP 12886788U JP H0249214 U JPH0249214 U JP H0249214U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- ground conductor
- dielectric
- circuits
- microstrip line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Microwave Amplifiers (AREA)
Description
第1図a,b及び第2図a,bはそれぞれ本考
案の第1及び第2の実施例を示す部分切欠き平面
図、断面図、第3図a,bは従来のFET増幅器
の一例を示す部分切欠き平面図、断面図である。
1…気密パツケージ、2,2A〜2E…誘電体
基板、3A〜3F…マイクロストリツプライン回
路、4A,4B…接地パターン、5A,5B…F
ETチツプ、6…接続パターン、7…コンデンサ
、8…ボンデイング線、11…基板、12…蓋、
13…接地導体、14…接続ピン、21…切欠き
部。
Figures 1a and 2b are partially cutaway plan views and cross-sectional views showing the first and second embodiments of the present invention, respectively. Figures 3a and 3b are examples of conventional FET amplifiers. FIG. 1... Airtight package, 2, 2A to 2E... Dielectric substrate, 3A to 3F... Microstripline circuit, 4A, 4B... Ground pattern, 5A, 5B...F
ET chip, 6... Connection pattern, 7... Capacitor, 8... Bonding wire, 11... Board, 12... Lid,
13...Grounding conductor, 14...Connection pin, 21...Notch.
Claims (1)
板と、この基板の接地導体上に密着して設けられ
た1枚の誘電体基板と、この誘電体基板上の所定
の位置にそれぞれ設けられた複数のマイクロスト
リツプライン回路と、これら各マイクロストリツ
プ回路の間にそれぞれ設けられ、かつこれらマイ
クロストリツプライン回路を接続して多段縦続接
続型の増幅回路を形成する複数のFETチツプと
、これら各FETチツプの接地端を前記基板上の
接地導体に接続する手段とを有することを特徴と
するFET増幅器。 A package substrate with a ground conductor on its surface, one dielectric substrate closely attached to the ground conductor of this substrate, and a plurality of dielectric substrates each provided at a predetermined position on the dielectric substrate. microstrip line circuits, a plurality of FET chips provided between each of these microstrip circuits, and connecting these microstrip line circuits to form a multi-stage cascade-connected amplifier circuit; and means for connecting a ground end of each FET chip to a ground conductor on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12886788U JPH0249214U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12886788U JPH0249214U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0249214U true JPH0249214U (en) | 1990-04-05 |
Family
ID=31382607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12886788U Pending JPH0249214U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249214U (en) |
-
1988
- 1988-09-30 JP JP12886788U patent/JPH0249214U/ja active Pending
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