JPH0249370A - Connecting terminal and manufacture thereof - Google Patents

Abstract

PURPOSE:To form a connecting terminal capable of making efficient and accurate connection of electronics devices, by utilizing laminated conductors which are cut in a specified direction with an intervening insulator set opposing to the arrangement of connecting electrodes of an electronics device to be equipped. CONSTITUTION:Plural V grooves 1a-1 are formed in parallel at specified intervals on one side of substrate 1a such as a silicon wafer and the like by means of a photo-lithography technique, a dry etching method and the like. After insulator films 5 are formed on both surface and back sides including the grooves, a metal conductor 1b of about 50mum diameter is inserted in every groove. Necessary number of such substrate are laminated and stuck in the same direction, and the thickness of the substrate 1a is determined so that a distance between adjoining conductors 1b may equal to an interval between the connecting electrodes 2a of an electronics device. A group of the substrates thus laminated are cut transverse to the direction of the groove, bumps 1b-1 are formed in places of the conductors 1b, and insulator films 5a are produced in other surface than the bumps to form a connecting terminal 1.

Description

[Detailed Description of the Invention] [Summary] Regarding connection terminals used when mounting electronic devices on a circuit board, etc., and a method for manufacturing the same, the electronic device can be inserted between the circuit board and the electronic device in an efficient and accurate manner. Both sides are at least insulated and grooves are drilled in parallel on one side to connect the
(2) forming substrates in which conductors are inserted in the grooves in the same direction so that bumps are provided on both end faces of the conductors arranged in a lattice pattern perpendicular to the (2) grooves; (1) inserting the rod-shaped conductor into the groove and laminating and bonding the substrates in the same direction to form a laminated substrate; (2) slicing the laminated substrate in a direction perpendicular to the groove to form a thin piece substrate;
The manufacturing method is configured to include a step of forming bumps on both end sliced surfaces of the conductor of the thin piece substrate.

[Industrial application field]

The present invention relates to a connection terminal used when mounting an electronic device on a circuit board or the like, and a method for manufacturing the same.

When mounting electronic devices, such as semiconductor bare chips, on a circuit board using the flip-chip method, solder balls are bonded to the electrode side of the semiconductor chips arranged in a grid or to the land side of the circuit board to form solder bumps. A semiconductor chip is placed on a circuit board and connected by heat and pressure bonding.

This solder ball is a copper ball with a diameter of about 100 μm that is solder-plated. When bonding, it is difficult to align the electrodes with high precision as the density of the electrode pinches on the semiconductor chip increases. Yes, and one solder ball
There is a problem in that it takes a considerable amount of man-hours to join each piece one by one.

Therefore, there is a need for a connection terminal that can be inserted between a circuit board and an electronic device for efficient (accurate) connection.

[Conventional technology]

Conventionally, as shown in the side sectional view of FIG.
A solder ball 104 is placed on the land 103a of the electronic device 102, for example, on the electrode 102a of a semiconductor chip knob.
The semiconductor chips 102 are bonded one by one to form a solder hump, and the semiconductor chip 102 is placed on the circuit board 103 and bonded under heat and pressure for mounting.

[Problem to be solved by the invention]

However, according to the bump connection described above, as the electrode pitch of the semiconductor chip becomes denser, the diameter of the solder ball also becomes smaller, and when bonding the solder ball with the minute diameter to the land of the circuit board, the position becomes smaller. There are problems in that it is difficult to perform alignment with high precision, and moreover, the number of man-hours required to join the solder balls one by one increases, which increases manufacturing costs.

In view of the above-mentioned problems, an object of the present invention is to provide a connection terminal that can efficiently and accurately connect an electronic device by inserting it between a circuit board and an electronic device, and a method for manufacturing the same.

[Means to solve the problem]

In order to achieve the above object, in the connection terminal and the method for manufacturing the same of the present invention, substrates are laminated in the same direction, both sides of which are at least insulated, V-grooves are bored in parallel on one side, and conductors are inserted into the grooves. Bumps are provided on both end faces perpendicular to the V-grooves of the conductors arranged in a lattice pattern.

a step of forming a groove in the substrate; a step of inserting the bar-shaped conductor into the V-groove and laminating and bonding the substrates in the same direction to form a laminated substrate; and forming a laminated substrate in a direction perpendicular to the V-groove. The manufacturing method is configured to include a step of slicing the thin substrate to form a thin piece substrate, and a step of forming bumps on both end sliced surfaces of the conductor of the thin piece substrate.

[Effect]

By creating a V-groove on one side of a board and stacking multiple boards in the same direction with rod-shaped conductors inserted, it is possible to arrange the conductors in a lattice pattern on a surface perpendicular to the groove, and the laminated board can be By slicing the conductor in orthogonal directions and forming bumps on both end surfaces of the conductor exposed on the sliced surface, the lands of the circuit board and the electrodes of the electronic device can be connected at once.

〔Example〕

The gist of the present invention will be explained in detail below based on embodiments shown in the drawings.

The connection terminal 1 of this embodiment is used when an electronic device 2, for example, a semiconductor chip having a grid array of electrodes, is mounted on a circuit board 3 by a flip-chip method, as shown in the side cross-sectional view of FIG.

The connection terminal 1 is provided with V grooves 1a-1 on one side of a substrate 1a, for example a silicon wafer, corresponding to the electrodes (Au) 2a of the semiconductor chip 2 and arranged at the same spacing, and the entire surface of the substrate 1a is subjected to insulation oxidation treatment to form V grooves 1a-1. By inserting a rod-shaped conductor 1b, that is, a gold wire (Au) or a copper wire (Cu) with a diameter of approximately 50 μm, into J*1a-1 and stacking the substrates 1a in the same direction, the groove 1a is formed.
A conductor 1b having the same lattice arrangement as the conductor t12a of the semiconductor chip 2 is formed on a surface perpendicular to the groove 1a-1, and bump metal, that is, lead (Pb) is vapor-deposited on both end surfaces of the conductor 1b perpendicular to the groove 1a-1. The formed bump 1b-1 is provided in a protruding manner.

Next, a method for manufacturing the connection terminal 1 will be described using side sectional views shown in the order of steps in FIG.

FIG. 1 (al indicates the process of forming a resist pattern).

Substrate 1a, that is, plate thickness 3 having a Miller index of 100 on the front surface and a Miller index of 111 on the groove 1a-1 surface formed in a later process.
Grooves 1a with the same spacing as the electrodes 2a connected by photolithography on one side of the 00 μm silicon wafer.
A resist pattern 4 is formed for etching. The thickness of the substrate 1a is the same as that of the V-groove 1 formed in the next step.
In relation to the depth of a-1, a conductor i is placed in the V-groove 1a-1 in a later process.
When the conductors 1b are inserted and laminated and crimped, the spacing between the conductors 1b in the lamination direction is determined to correspond to and be the same as the spacing between the electrodes 2a to be connected.

FIG. 1 tb+ shows the step of forming the groove 1a-1. After forming a V-groove 1a-1 with an apex angle of about 70 mm using anisotropic etching using a dry etching method, for example, a plasma etching method, the resist pattern 4 is removed. ■ Groove 1a
-1 depth is the depth of conductor 1 when conductor 1b is in contact with the V-groove surface.
The upper surface of the substrate 1b is made to protrude from the surface of the substrate 1a.

FIG. 1(C) shows the step 5 of forming an insulating film. An insulating film (SiO□) 5 is formed on the front and back surfaces of the substrate 1a including the V-groove 1a-2 by a steam oxidation method.

FIG. 1(d) shows the process of laminating the substrate 1a. A rod-shaped conductor 1b, that is, a diameter of about 50μ, is placed in the electrically insulated V-groove 18-1.
m gold wire (Au) or copper wire (Cu) is inserted, and the substrate 1
(a) are laminated one after another in the same direction and pressed together with an adhesive 6, such as a polyimide resin adhesive or a low melting point glass adhesive. The number of laminated layers of substrates 1a is matched to the number of arrays of electrodes 2a to be connected. 11a may be stacked.

FIG. 1(e) shows the slicing process of the laminated substrate 12a.

Using a multi-wire saw cutting machine, the laminated substrate 1a, that is, the laminated substrate 12a, is cut 10 times in the direction perpendicular to the groove 1a-1.
Slice to a thickness of 0-200 μm. That is, conductor 1b
It is possible to obtain a thin piece substrate 13a in which a multi-core lattice-like arrangement/column is formed.

FIG. 1(f) shows the process of forming the insulating film 5a. Since the base material of the substrate 1a is exposed on the front and back sliced surfaces of the thin substrate 13a and there is no electrical insulation, an insulating film (S
ing) form 5a. At this time, the adhesive 6 used for lamination, ie, polyimide resin or low melting point glass adhesive, is acid resistant and will not be attacked. Note that the conductor 1b
If the wire is not a gold wire but a copper wire, there is a step in which the oxidized copper oxide (Cub) film (as shown in the figure) is peeled off and removed by hydrochloric acid treatment for the next step.

FIG. 1 (gl indicates the bump formation process. Thin substrate 13
After forming a resist pattern (path shown) on the front and back surfaces of a by exposing only the conductor 1b using photolithography technology,
Bump metal, namely lead (
A low melting point metal such as Pb) or tin (Sn) is vacuum-deposited by a vapor deposition method to form bumps 1b to 1 with a height of about 10 μm, thereby completing the connection terminal 1.

Note that the bump metal used to form the bump 1b-1 is selected depending on the material of the electrode 2a to be connected, but unlike the gold in the above example, gold (^
U) is deposited. In addition to the vapor deposition method, the vapor deposition may be performed by a sputtering method or an electroplating method.

FIG. 2 shows the completed connection terminal 1 in FIG. 1 (phantom perspective view).

When mounting the semiconductor chip 2 on the land 3a of the circuit board 3 using this connection terminal 1, solder is applied to the bump 1b-1 of the connection terminal 1 as shown in the side sectional view showing the mounting state in FIG. The connection terminals 1 are temporarily fixed to the electrodes 2a of the semiconductor chip 2 by adhering a paste (as shown in the diagram), and then temporarily fixed onto the lands 3a of the circuit board 3, followed by heat-pressing and mounting.

In addition, after the step of slicing the laminated substrate shown in FIG. 1(e) above, before forming the insulating film 5a, both the front and back surfaces of the thin substrate 13a are etched to reduce the thickness to t, and the conductor 1b is slightly etched. A wet etching step for protrusion may also be incorporated. That is, as shown in the side sectional view of FIG.
When b is a gold wire, the sliced surface is left as it is without forming a resist pattern because there is no risk of corrosion, and when the conductor 1b is a W4 wire, photolithography is performed on both the front and back sides of the sliced thin substrate 13a. After forming a resist pattern (the path shown in the figure) covering both sliced surfaces of the conductor 1b and exposing only the surface of the thin substrate 13a using a technique, only the thin substrate 13a is etched using hydrofluoric acid etching. This allows the conductor 1b to protrude, making it easier to form the bump 1b1, and making it possible to securely connect the conductor 1b.

The side sectional view of FIG. 4 shows the bump 1b-1 formed by this method.

In this way, according to the connecting terminal having the above structure and its manufacturing method, by forming a high-precision V-groove in the board, inserting conductors and stacking them in multiple layers, conductors can be arranged in a grid pattern on a surface perpendicular to the grooves. By slicing this laminated board in the direction perpendicular to the groove and protruding bumps on both end faces of the conductor, it can be inserted between the land of the circuit board and the electrode of the semiconductor chip in a short time. Can be connected.

In addition, in this case, since the same silicon wafer as the semiconductor chip is used as the substrate material, the grooves processed by etching can be processed extremely finely and precisely, allowing them to accurately correspond to the electrodes of electronic devices. A connection terminal can be formed.

Furthermore, since the substrates have the same coefficient of thermal expansion, the reliability of mechanical and electrical connections will not be impaired due to differences in thermal expansion caused by heat generation of the semiconductor chip.

Furthermore, since the mounting work on the circuit board uses bumps that have been placed in advance according to the electrodes to be connected, it is faster than attaching solder balls one by one to the circuit board or electronic device as in the past. Connections can be made in batches, making the work extremely simple and greatly reducing man-hours.

〔Effect of the invention〕

As described in detail above, according to the present invention, grooves are formed in a substrate such as a silicon wafer corresponding to the electrodes of an electronic device, and the grooves are stacked with conductors inserted therein, thereby forming, for example, a lattice-like arrangement. By forming a terminal and forming a bump on the terminal in advance to form a single multi-core connection terminal, a circuit board and an electronic device can be efficiently and accurately mounted at once, and connection reliability is improved. It exhibits extremely useful effects industrially, such as being able to improve sophistication and reduce manufacturing costs.

[Brief explanation of the drawing]

Figures 1 (fa) to (9) are side sectional views showing the process order of an embodiment according to the present invention, Figure 2 is a perspective view of the completed connection terminal shown in Figure 1 (g), and Figure 3 is a FIG. 4 is a side sectional view showing a state in which the conductor shown in FIG. 1(g) is protruded to form a bump; FIG. In the figure, ■ is a connection terminal, 1a and l1a are substrates, 1a-1 is a V-groove, 1b is a conductor, 1b-1 is a bump, 2 is an electronic device (semiconductor chip), 2a is an electrode, 3 is a circuit board, 3a is a land, 4 is a resist pattern, 5.5a is an insulating film, 6 is an adhesive, 12a is a laminated board, and 13a is a thin piece board.Resist pattern forming process fal ■Groove forming process (bl) of the substrate Stone stacking process Laminated substrate slicing process fal Insulating film formation process fl Bump formation process gl

Claims (1)

[Scope of Claims] [1] Both sides are at least insulated and one side has a V-groove (1a-1
) are bored in parallel and the conductors (1b) are inserted into the V-grooves (1a-1).The substrates (1a) are laminated in the same direction, and the conductors (1b) are arranged in a grid pattern. ) A connection terminal comprising bumps (1b-1) on both end faces orthogonal to the bumps (1b-1). [2] Forming a V-groove (1a-1) in the substrate (1a), inserting the rod-shaped conductor (1b) into the V-groove (1a-1), and laminating and bonding the substrate (1a) in the same direction. Laminated board (1
2a) and slicing the laminated substrate (12a) in a direction perpendicular to the V-groove (1a-1) to form a thin piece substrate (
13a) and forming bumps (1b-1) on both end sliced surfaces of the conductor (1b-1) of the thin piece substrate (13a).
) A method for manufacturing a connection terminal, the method comprising: