JPH0250344U - - Google Patents
Info
- Publication number
- JPH0250344U JPH0250344U JP13009488U JP13009488U JPH0250344U JP H0250344 U JPH0250344 U JP H0250344U JP 13009488 U JP13009488 U JP 13009488U JP 13009488 U JP13009488 U JP 13009488U JP H0250344 U JPH0250344 U JP H0250344U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding plate
- thermal head
- back surface
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 6
Landscapes
- Electronic Switches (AREA)
Description
第１図は、本考案によるサーマルヘツドの第１
の実施例を示す断面図、第２図は、本考案による
サーマルヘツドの第２の実施例を示す斜視図、第
３図は、本考案によるサーマルヘツドの第３の実
施例を示す断面図、第４図、第５図は、従来のサ
ーマルヘツドを示す断面図である。
１，２１，３１……基板、２，２２，３２……
発熱体アレイ、３，２３，３３……保持板、４，
２４，３４……ゴム弾性体、５，２５……斜面、
６，２６……接触面、７，２７，３６，３７……
接触エツジ。
Figure 1 shows the first part of the thermal head according to the present invention.
2 is a perspective view showing a second embodiment of the thermal head according to the present invention; FIG. 3 is a sectional view showing a third embodiment of the thermal head according to the present invention; 4 and 5 are cross-sectional views showing a conventional thermal head. 1, 21, 31... board, 2, 22, 32...
Heating element array, 3, 23, 33... Holding plate, 4,
24, 34...Rubber elastic body, 5, 25...Slope,
6, 26...Contact surface, 7, 27, 36, 37...
contact edge.
Claims (1)
保持する保持板とを備え、上記基板の一辺近傍の
表面にかかる弾性圧力をもつて、上記基板の裏面
の一部と上記保持板を密着させる構造のサーマル
ヘツドにおいて、上記弾性圧力のかかる基板一辺
近傍の裏面と接触する部位の保持板の面を、上記
基板の裏面に対して傾いた面に形成し、この傾い
た面と上記基板を略線接触としたことを特徴とす
るサーマルヘツド。 (2) 少なくとも前記発熱体アレイの配置領域の
裏面を、前記保持板の傾いた面と異なる部分で、
保持板と接触させたことを特徴とする実用新案登
録請求の範囲第１項記載のサーマルヘツド。[Claims for Utility Model Registration] (1) A substrate having a heating element array and a holding plate for holding this substrate, and an elastic pressure applied to the surface near one side of the substrate, In a thermal head having a structure in which a portion of the holding plate is in close contact with the holding plate, a surface of the holding plate at a portion that contacts the back surface near one side of the substrate to which the elastic pressure is applied is formed to be a surface inclined with respect to the back surface of the substrate; A thermal head characterized in that the inclined surface and the substrate are in approximate line contact. (2) At least the back surface of the heating element array arrangement area is different from the inclined surface of the holding plate,
The thermal head according to claim 1, characterized in that the thermal head is brought into contact with a holding plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13009488U JPH0250344U (en) | 1988-10-04 | 1988-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13009488U JPH0250344U (en) | 1988-10-04 | 1988-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0250344U true JPH0250344U (en) | 1990-04-09 |
Family
ID=31384950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13009488U Pending JPH0250344U (en) | 1988-10-04 | 1988-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0250344U (en) |
-
1988
- 1988-10-04 JP JP13009488U patent/JPH0250344U/ja active Pending