JPH0315145U - - Google Patents
Info
- Publication number
- JPH0315145U JPH0315145U JP7336089U JP7336089U JPH0315145U JP H0315145 U JPH0315145 U JP H0315145U JP 7336089 U JP7336089 U JP 7336089U JP 7336089 U JP7336089 U JP 7336089U JP H0315145 U JPH0315145 U JP H0315145U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- thermal head
- substrate
- printed circuit
- relay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims 2
- 230000001902 propagating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は、本考案のサーマルヘツドの断面図。
第２図は、本考案のサーマルヘツドの基板の斜視
図。第３図、第４図、第５図は、本考案のサーマ
ルヘツドの断面図。第６図、第７図は、本考案の
サーマルヘツドの配線圧接部の圧力分布を表す図
。第８図、第９図、第１０図は、従来のサーマル
ヘツドの断面図。
１…基板、２，２２，３５，４５，４６…凸の
盛り上がり、３，２３，３３，４３…配線、７…
中継配線、８，２８，３８，４８…弾性体、１１
，２１，３２，４２…グレース層、３４，４４…
溝、２５…ドライバＩＣ、２４…樹脂。
FIG. 1 is a sectional view of the thermal head of the present invention.
FIG. 2 is a perspective view of the substrate of the thermal head of the present invention. 3, 4, and 5 are cross-sectional views of the thermal head of the present invention. FIGS. 6 and 7 are diagrams showing the pressure distribution at the wiring press-contact portion of the thermal head of the present invention. 8, 9, and 10 are cross-sectional views of conventional thermal heads. 1... Board, 2, 22, 35, 45, 46... Convex swell, 3, 23, 33, 43... Wiring, 7...
Relay wiring, 8, 28, 38, 48... elastic body, 11
, 21, 32, 42...Grace layer, 34, 44...
Groove, 25...Driver IC, 24...Resin.
Claims (1)
るためのシグナルを伝搬する配線とを表面に有す
る基板と、上記配線と重なり接触して上記シグナ
ルの伝搬を中継する配線を有する中継プリント回
路と、この中継プリント回路と上記基板の重なり
部分を弾性圧力によつて押え配線同士の電気的接
続を維持する弾性体とを備えたサーマルヘツドで
あつて、 上記基板上の配線が、上記電気的接続を行う部
分において、上記中継プリント回路の配線に向か
つて凸となる上記基板表面の盛り上がりの上に形
成されていることを特徴とするサーマルヘツド。 (2) 前記凸の盛り上がりは、基板上に形成され
たグレース層の盛り上がりであることを特徴とす
る請求項１記載のサーマルヘツド。 (3) 上記基板上の配線が、上記電気的接続を行
う部分において、上記中継プリント回路の配線に
向かつて凹とされた基板上に形成され、前記中継
プリント回路の配線が、上記溝に向かつて凸にた
わんでいることを特徴とする請求項１記載のサー
マルヘツド。[Claims for Utility Model Registration] (1) A substrate having a heating element array and wiring for propagating a signal for driving the heating element array on its surface, overlapping and in contact with the wiring to relay the propagation of the signal. A thermal head comprising: a relay printed circuit having wiring that is connected to the substrate; and an elastic body that presses the overlapping portion of the relay printed circuit and the substrate by elastic pressure to maintain electrical connection between the wirings, the thermal head comprising: A thermal head characterized in that the wiring is formed on a bulge on the surface of the substrate that is convex toward the wiring of the relay printed circuit in the portion where the electrical connection is made. (2) The thermal head according to claim 1, wherein the raised convex portion is a raised portion of a gray layer formed on the substrate. (3) The wiring on the board is formed on a board that is recessed toward the wiring of the relay printed circuit in the part where the electrical connection is made, and the wiring of the relay printed circuit is directed toward the groove. The thermal head according to claim 1, characterized in that it is once curved in a convex manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7336089U JPH0315145U (en) | 1989-06-21 | 1989-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7336089U JPH0315145U (en) | 1989-06-21 | 1989-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0315145U true JPH0315145U (en) | 1991-02-15 |
Family
ID=31612115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7336089U Pending JPH0315145U (en) | 1989-06-21 | 1989-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0315145U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002067364A (en) * | 2000-08-28 | 2002-03-05 | Kyocera Corp | Thermal head |
-
1989
- 1989-06-21 JP JP7336089U patent/JPH0315145U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002067364A (en) * | 2000-08-28 | 2002-03-05 | Kyocera Corp | Thermal head |