JPH0252420A - Treatment apparatus - Google Patents
Treatment apparatusInfo
- Publication number
- JPH0252420A JPH0252420A JP20345688A JP20345688A JPH0252420A JP H0252420 A JPH0252420 A JP H0252420A JP 20345688 A JP20345688 A JP 20345688A JP 20345688 A JP20345688 A JP 20345688A JP H0252420 A JPH0252420 A JP H0252420A
- Authority
- JP
- Japan
- Prior art keywords
- amorphous
- gas
- manifold
- coated
- corrosion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000012545 processing Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 34
- 238000005260 corrosion Methods 0.000 abstract description 27
- 230000007797 corrosion Effects 0.000 abstract description 27
- 235000012431 wafers Nutrition 0.000 abstract description 14
- 239000007795 chemical reaction product Substances 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 6
- 229910000808 amorphous metal alloy Inorganic materials 0.000 abstract description 5
- 239000012495 reaction gas Substances 0.000 abstract description 4
- 230000001590 oxidative effect Effects 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract 2
- 239000007789 gas Substances 0.000 description 29
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000010935 stainless steel Substances 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 239000002516 radical scavenger Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000005300 metallic glass Substances 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000953 kanthal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明は処理装置に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a processing device.
(従来の技術)
処理装置例えば、半導体製造プロセスに於ける熱処理工
程において熱処理用反応管内に腐食性の高いガスを流す
度合が多くなった。例えば塩酸酸化プロセスではドライ
02ガス中にMCIを数%添加する事により、Naなど
の金属不純物を安定な形で捕捉する効果があり、安定し
た特性のデバイスを製造することができる。また酸化用
反応管を一定期間毎に高温下でHCIを2〜3%を添加
したドライ02ガスで熱処理することにより、反応管内
の汚れを取り除くことができ、安定したプロセスを朋待
することができる等色々なメリットがある。しかし腐食
性の高いガスに耐えられるように反応管まわりの装置を
すべて石英ガラス等で制作する事は強度や寸法精度の問
題から難しく、例えば反応管を保持するマニホールドや
反応管の開口部を塞ぐキャップ等金属で作られた部分は
耐食性のあるステンレス(SUS)で作られたりまた、
さらに耐食性を増すためにSUSの表面にNi系の合金
をコーティングする等の耐腐食方法がとられてきた。特
に腐食性の強いHCIガス等を使用する場合などでは腐
食性ガスと接する部分の金属には、SUSの表面をNi
系の合金でコーティングしたものが用いられている。ま
た、プラズマエツチング装置等の反応容器内壁の腐食防
止を目的とした金属酸化物層をコーティングした技術が
特公昭57−52423号公報に開示されている。(Prior Art) For example, in a heat treatment process in a semiconductor manufacturing process, a highly corrosive gas is increasingly passed through a heat treatment reaction tube. For example, in the hydrochloric acid oxidation process, adding several percent of MCI to the dry 02 gas has the effect of stably trapping metal impurities such as Na, making it possible to manufacture devices with stable characteristics. In addition, by heat-treating the oxidation reaction tube at high temperatures for a certain period of time with dry 02 gas containing 2 to 3% HCI, dirt inside the reaction tube can be removed and a stable process can be maintained. There are various benefits that you can do. However, it is difficult to make all the equipment around the reaction tubes out of quartz glass, etc. to withstand highly corrosive gases due to issues with strength and dimensional accuracy. Metal parts such as caps are made of corrosion-resistant stainless steel (SUS),
Furthermore, in order to increase the corrosion resistance, corrosion-resistant methods such as coating the surface of SUS with a Ni-based alloy have been taken. Particularly when using highly corrosive HCI gas, etc., the surface of the SUS should be replaced with Ni for the metal parts that come into contact with the corrosive gas.
Coated with a similar alloy is used. Furthermore, Japanese Patent Publication No. 57-52423 discloses a technique in which a metal oxide layer is coated to prevent corrosion of the inner wall of a reaction vessel of a plasma etching apparatus or the like.
(発明が解決しようとする課B)
しかし、通常のコーティングは、第3図に示すように例
えばステンレスやアルミニュームの母材金属(1)の表
面に耐食性を持つ酸化皮膜、即ち、不働態皮膜(2)を
コーティングするが、この母材(1)は種々の結晶欠陥
や不純物の偏析が含まれ、例えば母材(1)の表面部分
に結晶と結晶の境目である結晶粒界(3)が存在すると
、この結晶粒界では、コーティングされた不働態皮膜(
2)が丈夫でなく皮膜が破れてしまい(4)、ここが腐
食の起点となり腐食が始まってゆく。この欠点を防ぐた
めに第2の不働態皮膜(5)を施すがどうしても不働態
皮膜(5)に欠陥(6)例えばピンホールができてしま
いこの欠陥(6)から再び腐食が始まることになるため
、この欠陥を軽減するために第3の不働態皮膜(7)と
幾重にもコーティングを施している。このように耐食性
の強さは、腐食ガスが、幾重にも施した不働態皮膜の欠
陥を伝わって最後に母材金属に到達するまでの時間とな
る。一方、第4図に示すようにアモルファス合金(11
)は腐食され易い結晶粒界や上記ピンホール等の欠陥を
含まない性質を持った非晶質金属で、結晶に比べて化学
的に反応し易いため、腐食される環境では直ちに表面で
化学反応が起こり表面にアモルファス合金の中の例えば
クロムが濃縮されて純クロムに近い成分の酸化膜即ち不
働態皮膜(12)が急速に厚く形成される為、極めて耐
食性の高い性質を持つ。従って、母材金属(13)に結
晶粒界(14)が有っても、不働態皮膜(12)、アモ
ルファス合金(11) Nに保護され腐食が進まず、腐
食が進む速度はほとんどゼロに近くなる。他方、例えば
SUS母材にNr系のコーティングを施したものは、H
CIガス充填の雰囲気の中でコーティングをしていない
5US316と比べて腐食速度は約171O即ち、約1
0倍の耐食性を有している。しかしながら実際のHC’
1等のプロセスでは腐食が激しくコーティングしたSU
Sでも使えない場所や腐食がそれほと激しくなくても、
ゴミ等の発生つながるため定期的に腐食部分の清掃、交
換等の為装置を停止しなければならずメインテナンスに
非常に時間がかかるとゆう問題があった。またN1等の
コーティングで強化したSUS等でも耐食性が足りない
部分では金属の表面を石英ガラスでカバーし金属と石英
ガラスカバーとの間をN2等の不活性ガスでパージする
方法がとられているがガスの配管や、構造、制御が複雑
になると共に石英ガラスのカバーをするため形状的制約
即ち機構的な制約を受は最適形状等を作ることができな
いという問題点があった。(Problem B to be solved by the invention) However, as shown in FIG. (2), but this base material (1) contains various crystal defects and segregation of impurities. For example, the surface of the base material (1) has grain boundaries (3) that are boundaries between crystals. is present, the grain boundaries are coated with a passive film (
2) is not durable and the film breaks (4), which becomes the starting point for corrosion. In order to prevent this defect, a second passive film (5) is applied, but defects (6) such as pinholes are formed in the passive film (5), and corrosion starts again from this defect (6). In order to reduce this defect, a third passive film (7) and multiple coatings are applied. In this way, the strength of corrosion resistance is determined by the time it takes for corrosive gas to travel through the defects in the multiple layers of passive film and finally reach the base metal. On the other hand, as shown in Figure 4, amorphous alloy (11
) is an amorphous metal that does not contain defects such as grain boundaries or pinholes that are easily corroded, and it is more chemically reactive than crystals, so chemical reactions occur immediately on the surface in corrosive environments. As a result, for example, chromium in the amorphous alloy is concentrated on the surface, and an oxide film, that is, a passive film (12) having a composition close to that of pure chromium, is rapidly formed thickly, so that it has extremely high corrosion resistance. Therefore, even if the base metal (13) has grain boundaries (14), it is protected by the passive film (12) and the amorphous alloy (11) and corrosion does not progress, and the rate of corrosion is almost zero. It gets closer. On the other hand, for example, a SUS base material coated with Nr-based
Compared to uncoated 5US316 in an atmosphere filled with CI gas, the corrosion rate is about 171O, or about 1
It has 0 times the corrosion resistance. However, the actual HC'
SU coated with severe corrosion in the 1st grade process
Even if S cannot be used in places or the corrosion is not too severe,
This leads to the generation of dust and the like, which causes the problem that the equipment must be stopped periodically to clean or replace corroded parts, making maintenance very time consuming. In addition, in areas where corrosion resistance is insufficient even with SUS reinforced with a coating such as N1, a method is used in which the surface of the metal is covered with quartz glass and the space between the metal and the quartz glass cover is purged with an inert gas such as N2. However, the gas piping, structure, and control become complicated, and the quartz glass cover imposes geometrical constraints, that is, mechanical constraints, making it impossible to create an optimal shape.
本発明は上記点を改善するために成されたもので、耐腐
食性の優れた処理装置を提供しようとするものである。The present invention has been made to improve the above-mentioned problems, and is intended to provide a processing device with excellent corrosion resistance.
(課題を解決するための手段)
この発明は処理室内の、露出している金属部分の少なく
とも一部分をアモルファスコーティングしたことを特徴
とする処理装置を得るものである。(Means for Solving the Problems) The present invention provides a processing apparatus characterized in that at least a portion of the exposed metal portion within the processing chamber is coated with an amorphous coating.
(作用)
本発明によれば、処理室内の、露出している金属部分の
少なくとも一部分をアモルファスコーティングしたこと
により、耐腐食性を非常に高くできる効果がある。(Function) According to the present invention, since at least a portion of the exposed metal parts in the processing chamber are coated with an amorphous coating, corrosion resistance can be greatly improved.
(実施例)。(Example).
以下本発明処理装置を縦型CVD装置に適用した一実施
例につき図面を参照して説明する。An embodiment in which the processing apparatus of the present invention is applied to a vertical CVD apparatus will be described below with reference to the drawings.
縦型CVD装置は第1図に示すように、軸方向を垂直軸
とする円筒状プロセスチューブ(21)を有し、このプ
ロセスチューブ(21)は耐腐食性の優れた例えば石英
ガラス製で、外筒(21a)と内筒(21b)とから成
り、内W (2l b)内には半導体ウェハ(22)を
水平状態で、かつ、上下で離間した状態で複数枚配列支
持した例えば石英ガラス製のボート(23)があり、こ
のボートはく23)は垂直方向に沿って搬入可能であり
、また、このボー) (23)の下方にはボート(23
)を炉芯に位置させ、プロセスチューブ内の熱を下方に
逃がさないための保温筒(24)が配管されている。ま
た内筒(21b)には耐腐食性の優れた例えば石英ガラ
ス製またはアモルファスコーティングしたステンレス製
のプロセスガス導入管(25)がその下端より上端に向
かって挿入支持されており、上記ボー) (23)に配
列支持されたウェハ(22)とウェハ(22)とのほぼ
中間に位置するようにガス噴き出し孔(26)が設けら
れ、この噴き出し孔(26)と対向した位置の内筒(2
l b)のほぼ半周〜415周にわたりガス排出孔(2
7)が複数個形成されている。そしてプロセスガス等の
排気は上記排出孔(27)を介して外筒(21a)に導
き、外筒(21a)の下端を保持している例えばステン
レス製で内表面をアモルファスコーティングした円環状
マニホールド(28)部分のガス導出口(28a)を介
して排気するようになっている。また また前記プロセ
スチューブ(21)の周囲には加熱装置(29)として
例えばカンタル線から成る抵抗加熱ヒーターが包むが如
く配置されている。そして、前記保温筒(24)を保持
し、マニホールド(28)と当接しプロセスチューブ内
の気密を保つ例えばステンレス製で表面をアモルファス
コーティングした円板状蓋体(30)を上下動して前記
ボート(23)をプロセスチューブ(21)に対してロ
ード、アンロードするローダ−装置く31)が設けられ
ている。また上記マニホールド(28)と蓋体く30)
との当接部には図示しないシール部材例えば0−リング
が設けられ気密保持が可能となっている。尚、この保温
W (24)を回転自在に構成することができ、温度、
ガスの均一性を向上することが可能である。As shown in FIG. 1, the vertical CVD apparatus has a cylindrical process tube (21) whose axis is vertical, and this process tube (21) is made of, for example, quartz glass, which has excellent corrosion resistance. It consists of an outer cylinder (21a) and an inner cylinder (21b), and inside the inner W (21b), a plurality of semiconductor wafers (22) are supported horizontally and vertically spaced apart, for example, quartz glass. There is a boat (23) made of aluminum, which can be carried in vertically.
) is located in the furnace core, and a heat insulating cylinder (24) is piped to prevent the heat inside the process tube from escaping downward. In addition, a process gas introduction tube (25) made of quartz glass or amorphous-coated stainless steel with excellent corrosion resistance is inserted and supported in the inner cylinder (21b) from its lower end toward its upper end. A gas blowout hole (26) is provided so as to be located approximately midway between the wafers (22) arranged and supported by the wafers (23).
The gas exhaust hole (2
7) are formed. The exhaust gas such as process gas is guided to the outer cylinder (21a) through the discharge hole (27), and the lower end of the outer cylinder (21a) is held by a circular manifold made of, for example, stainless steel with an amorphous coating on the inner surface. The gas is exhausted through the gas outlet (28a) in the section 28). Furthermore, a resistance heater made of, for example, a Kanthal wire is arranged as a heating device (29) around the process tube (21) so as to surround it. Then, a disc-shaped lid (30) made of, for example, stainless steel and having an amorphous coating on the surface is moved up and down to hold the heat insulating cylinder (24) and keep the inside of the process tube airtight by coming into contact with the manifold (28). A loader device (31) for loading and unloading (23) onto and from the process tube (21) is provided. Also, the above manifold (28) and lid body 30)
A sealing member (not shown), such as an O-ring, is provided at the abutting portion to maintain airtightness. In addition, this heat insulation W (24) can be configured to be rotatable, and the temperature,
It is possible to improve gas uniformity.
次に金属部分から成るマニホールド(28)部分及び蓋
体く30)のアモルファスコーティングを第2図を用い
て説明する。Next, the amorphous coating of the manifold (28) and the lid (30), which are made of metal parts, will be explained with reference to FIG.
例えば材質ステンレスのマニホールド(28)は内部の
露出した表面(40)や円管状ガス導出口(2日)の内
表面(42)で反応ガス及び反応生成物と触れる可能性
のある部分および、プロセスチューブ外筒(21a)及
び内筒(2l b)との当接する表面(41)部分にア
モルファスコーティングが施されている。また、例えば
材質ステンレスの蓋体(30)は上記マニホールド(2
8)と当接し、反応容器を形成し反応ガスや反応生成物
と触れる可能性の有る内表面(43)にアモルファスコ
ーティングが施されている。ざらにマニホールド(28
)と蓋体く30)とが当接する対向表面各々にアモルフ
ァスコーティングをしてもよい。また、アモルファス金
属母材としては耐腐食性の優れたTa系を才料またはC
r系材料を用い厚さ5〜20ミクロンに例えばスパッタ
リング方法等によりアモルファスコーティングする。For example, a manifold (28) made of stainless steel has internal exposed surfaces (40) and inner surfaces (42) of a circular gas outlet (2 days) that may come into contact with reaction gases and reaction products, and An amorphous coating is applied to the surface (41) portion that comes into contact with the tube outer cylinder (21a) and the inner cylinder (21b). In addition, for example, the lid body (30) made of stainless steel is connected to the manifold (2).
An amorphous coating is applied to the inner surface (43) which comes into contact with 8), forms a reaction vessel, and has the possibility of coming into contact with reaction gas and reaction products. Zarani Manifold (28
) and the lid body 30) may be coated with an amorphous coating. In addition, as the amorphous metal base material, we use Ta-based material with excellent corrosion resistance, or C-based material.
Amorphous coating is performed using an r-based material to a thickness of 5 to 20 microns, for example, by sputtering.
次に上述した縦型CVD装置の動作を説明する。Next, the operation of the above-mentioned vertical CVD apparatus will be explained.
図示しないウェハ移替え装置によりカセットからウェハ
(22)をボート(23)移し替え、ウェハ(22)が
積載されたボート(23)をローダ−装置(31)によ
り所定量上昇させ、上記プロセスチューブ(21)内の
予め定められた位置に、プロセスチューブの内筒(21
b)内壁に接触させる事なく搬入する。この時、上記プ
ロセスチューブ(21)下方のマニホールド(2日)と
上記蓋体(30)を当接させることにより、自動的にウ
ェハ(22)を位置決めすると共に上記プロセスチュー
ブ(21)内部を気密にする。次に、上記プロセスチュ
ーブ(21)内を所望の圧力状態例えば0.1〜3To
rrに保つように図示しない真空ポンプで排気制御し、
加熱1ll(29)により所望の温度例えば600 S
−1200℃程度に設定する。そして、この設定後上記
排気制御しながらガス供給源から図示しないマスフロー
コントローラ等で流量制御しながら反応ガス例えば。A wafer transfer device (not shown) transfers the wafer (22) from the cassette to the boat (23), the boat (23) loaded with the wafer (22) is raised by a predetermined amount by the loader device (31), and the process tube ( The inner cylinder (21) of the process tube is placed at a predetermined position within the process tube (21).
b) Deliver the product without contacting the inner wall. At this time, by bringing the manifold (2 days) below the process tube (21) into contact with the lid (30), the wafer (22) is automatically positioned and the inside of the process tube (21) is airtight. Make it. Next, the inside of the process tube (21) is set to a desired pressure state, for example, 0.1 to 3To.
Exhaust control is performed using a vacuum pump (not shown) to maintain the temperature at rr.
Heating 1 liter (29) to the desired temperature e.g. 600 S
Set to about -1200℃. After this setting, while controlling the exhaust, a reaction gas, for example, is supplied from the gas supply source while controlling the flow rate using a mass flow controller (not shown) or the like.
5i82CI2(ジクロロルシラン)とH2(水素)を
プロセスチューブ(21)内にガス導入管(25)から
所定時間供給するとプロセスチューブ(21)内に設置
されたウェハ(22)表面には次に示すSi膜が堆積す
る。When 5i82CI2 (dichlorosilane) and H2 (hydrogen) are supplied into the process tube (21) from the gas introduction pipe (25) for a predetermined period of time, the following will appear on the surface of the wafer (22) installed in the process tube (21). A Si film is deposited.
S i H2C12+H2→Si+2HClこの場合上
記プロセスチューブ(21)内で強い酸化力を持つMC
Iが生成される。しかし、プロセス容器を形成している
うち金属製のマニホールド(2日)および蓋体(30)
の内表面はアモルファスコーティングが施して有るため
反応ガスおよびHCI等の反応生成物が内表面に接触ま
たは堆積する事があっても腐食は起こらず、腐食による
ゴミの発生はほとんど無く、上記プロセスナューブ(2
工)内およびウェハ(22)の汚染を防止する事ができ
る。また、アモルファス合金の特徴として耐摩耗性にも
優れているためマニホールド(28)と蓋体く30)と
の当接するときの微少な摩擦の繰り返し等によるゴミの
発生を防止する事が可能である。S i H2C12+H2→Si+2HCl In this case, MC with strong oxidizing power in the process tube (21)
I is generated. However, the metal manifold (2 days) and lid body (30 days) that form the process container
Since the inner surface of the product is coated with an amorphous coating, even if reaction gases and reaction products such as HCI come into contact with or deposit on the inner surface, corrosion will not occur, and there is almost no generation of dust due to corrosion. Bu (2
It is possible to prevent contamination of the inside of the wafer (22) and the inside of the wafer (22). In addition, as amorphous alloy has excellent wear resistance, it is possible to prevent the generation of dust due to repeated minute friction when the manifold (28) and lid body 30) come into contact with each other. .
このようなCVD処理後、反応ガスの供給を止め、不活
性ガス例えば、N2ガスをガス導入管(25)より導入
し、上記プロセスチューブ内を常圧復帰した後、上記ウ
ェハを積載したボー)(23)をローダ−装置(31)
によりプロセスチューブ(21)内より取り出し図示し
ない移替え装置に渡し処理が終了する。After such CVD processing, the supply of the reaction gas is stopped, and an inert gas such as N2 gas is introduced from the gas introduction pipe (25) to return the inside of the process tube to normal pressure. (23) Loader device (31)
This completes the process of taking out the material from the process tube (21) and transferring it to a transfer device (not shown).
上記実施例では縦型CVD装置について説明したが、上
記実施例に限らず、反応ガスや反応生成物と接し酸化ま
たは腐食され易い場所の金属表面にアモルファスコーテ
ィングを施すことにより耐腐食性の効果が期待できる0
例えば、処理装置の排気部分は、第5図に示すように処
理室内からの排気ガスの排気を行なう例えばステンレス
製箱型状のスカベンジャー(51)に於て、このスカベ
ンジャー(51)内部には例えば石英ガラス製の反応管
を保持する円環状例えばステンレス製マニホールド(5
2)があり、このマニホルド(52)の開口をプロセス
時には熱遮蔽しく排気ガス等は流れる)、ウェハを積載
した例えば石英ガラス製ボートを反応管内へロード・ア
ンロードする時は待避する如く円板状例えばステンレス
製のシャッター(53)が、例えばエアーシリンダー等
からなる駆動機構(54)により駆動される。また、反
応管からの排気ガスや反応生成物は排気管(55)を通
りスカベンジャー(51)より負圧に保たれた外部の排
気処理装置へと排出される。上述のようにスカベンジャ
ー(51)内にはプロセス中の反応ガスや反応生成物が
流れ、または付着し、酸化や腐食しやすいため上記スカ
ベンジャ−(51)内部表面や上記シャッター(53)
の全面および駆動機構(54)のスカベンジャー(51
)内部に配置される金属製機器や部品、排気管(55)
および、その他スカベンジャー(51)因に配置または
取り付けられる部品等にアモルファスコーティングを施
すと良い。In the above embodiments, a vertical CVD apparatus was explained, but the present invention is not limited to the above embodiments. Corrosion resistance can be achieved by applying an amorphous coating to metal surfaces in areas that are likely to be oxidized or corroded when in contact with reaction gases or reaction products. Expected 0
For example, as shown in FIG. 5, the exhaust part of the processing apparatus is a box-shaped scavenger (51) made of stainless steel that exhausts exhaust gas from the processing chamber. An annular, for example, stainless steel manifold (5
2), the opening of this manifold (52) is used as a heat shield during processing and exhaust gases, etc. flow through), and a circular plate is used to provide a shelter when loading and unloading, for example, a quartz glass boat loaded with wafers into the reaction tube. A shutter (53) made of stainless steel, for example, is driven by a drive mechanism (54) comprising, for example, an air cylinder. Further, the exhaust gas and reaction products from the reaction tube are discharged from the scavenger (51) through the exhaust pipe (55) to an external exhaust treatment device maintained at negative pressure. As mentioned above, reaction gases and reaction products during the process flow or adhere to the inside of the scavenger (51) and are easily oxidized and corroded.
Scavenger (51) on the entire surface and drive mechanism (54)
) Metal equipment and parts placed inside, exhaust pipes (55)
In addition, it is preferable to apply an amorphous coating to other parts arranged or attached to the scavenger (51).
またアモルファスコーティングされた金属は耐摩耗性に
優れているため反応管やウェハ周辺部の塵埃を嫌う摺動
部例えば拡散装置等の炉口付近に設けられるドアーやシ
ャッター またはウェハの把持装置、移し変え装置、搬
送装置、その他駆動部品等に適用するとよい。また、ア
モルファスコーティング方法は金属表面の全面でなくと
もよく、適用部品の形状等によっては部分的に施しても
良く例えばメツシュ状等にアモルファス金属層を設けて
も良い。In addition, amorphous-coated metal has excellent abrasion resistance, so there are sliding parts that do not like dust around reaction tubes and wafers, such as doors and shutters installed near the furnace mouth of diffusion devices, wafer gripping devices, and transfer devices. It is suitable for application to devices, conveyance devices, and other driving parts. Furthermore, the amorphous coating method does not have to be applied to the entire surface of the metal, and depending on the shape of the applied part, the amorphous metal layer may be applied partially, for example, in the form of a mesh.
このようにCVD装置、拡散・酸化装置の他、エツチン
グ装置、アッシング装置、洗浄装置、塗布装置等でも同
様な効果が得られる。In this way, similar effects can be obtained with etching equipment, ashing equipment, cleaning equipment, coating equipment, etc. in addition to CVD equipment and diffusion/oxidation equipment.
(発明の効果)
以上述べたように本発明によれば、処理室内の露出して
いる金属部分の少なくとも一部分をアモルファスコーテ
ィングすることにより、耐腐食性が非常に高く、メイン
テナンス性が良く腐食によるゴミの発生を非常に少なく
てきる効果がある。(Effects of the Invention) As described above, according to the present invention, by amorphous coating at least a portion of the exposed metal parts in the processing chamber, corrosion resistance is very high, maintenance is easy, and dirt caused by corrosion is removed. This has the effect of greatly reducing the occurrence of
また加工のし易い金属が使えるため機構的制約に縛られ
ることがなく最適形状に設計製作できる効果がある。In addition, since metals that are easy to process can be used, it is possible to design and manufacture an optimal shape without being bound by mechanical constraints.
第1図は本発明装置の一実施例を説明するための縦型C
VDVi置の構成図、第2図は第1図のマニホールド近
傍の説明図、第3図乃至第4図は第1図のコーティング
の説明図、第5図は他の実施例の説明図である。FIG. 1 is a vertical type C for explaining one embodiment of the device of the present invention.
FIG. 2 is an explanatory diagram of the vicinity of the manifold in FIG. 1, FIGS. 3 to 4 are explanatory diagrams of the coating in FIG. 1, and FIG. 5 is an explanatory diagram of another embodiment. .
Claims (1)
をアモルファスコーティングしたことを特徴とする処理
装置。A processing device characterized in that at least a portion of exposed metal parts within a processing chamber are coated with an amorphous coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20345688A JPH0252420A (en) | 1988-08-16 | 1988-08-16 | Treatment apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20345688A JPH0252420A (en) | 1988-08-16 | 1988-08-16 | Treatment apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6261917A Division JP2714576B2 (en) | 1994-09-30 | 1994-09-30 | Heat treatment equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252420A true JPH0252420A (en) | 1990-02-22 |
Family
ID=16474425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20345688A Pending JPH0252420A (en) | 1988-08-16 | 1988-08-16 | Treatment apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252420A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5484484A (en) * | 1993-07-03 | 1996-01-16 | Tokyo Electron Kabushiki | Thermal processing method and apparatus therefor |
| US5578132A (en) * | 1993-07-07 | 1996-11-26 | Tokyo Electron Kabushiki Kaisha | Apparatus for heat treating semiconductors at normal pressure and low pressure |
| JP2017028144A (en) * | 2015-07-24 | 2017-02-02 | 光洋サーモシステム株式会社 | Heat treatment device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60100682A (en) * | 1983-11-02 | 1985-06-04 | Mitsubishi Heavy Ind Ltd | Amorphous alloy coated steel plate |
| JPS6293038A (en) * | 1985-10-16 | 1987-04-28 | Mitsui Eng & Shipbuild Co Ltd | Manufacture of container or tubular member subjected to amorphous coating |
-
1988
- 1988-08-16 JP JP20345688A patent/JPH0252420A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60100682A (en) * | 1983-11-02 | 1985-06-04 | Mitsubishi Heavy Ind Ltd | Amorphous alloy coated steel plate |
| JPS6293038A (en) * | 1985-10-16 | 1987-04-28 | Mitsui Eng & Shipbuild Co Ltd | Manufacture of container or tubular member subjected to amorphous coating |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5484484A (en) * | 1993-07-03 | 1996-01-16 | Tokyo Electron Kabushiki | Thermal processing method and apparatus therefor |
| US5750436A (en) * | 1993-07-03 | 1998-05-12 | Tokyo Electron Kabushiki Kaisha | Thermal processing method and apparatus therefor |
| KR100330130B1 (en) * | 1993-07-03 | 2002-08-27 | 동경 엘렉트론 주식회사 | Heat treatment method and device |
| US5578132A (en) * | 1993-07-07 | 1996-11-26 | Tokyo Electron Kabushiki Kaisha | Apparatus for heat treating semiconductors at normal pressure and low pressure |
| JP2017028144A (en) * | 2015-07-24 | 2017-02-02 | 光洋サーモシステム株式会社 | Heat treatment device |
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