JPH0252456U - - Google Patents

Info

Publication number
JPH0252456U
JPH0252456U JP1988131393U JP13139388U JPH0252456U JP H0252456 U JPH0252456 U JP H0252456U JP 1988131393 U JP1988131393 U JP 1988131393U JP 13139388 U JP13139388 U JP 13139388U JP H0252456 U JPH0252456 U JP H0252456U
Authority
JP
Japan
Prior art keywords
lead
semiconductor
semiconductor device
sandwiched
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988131393U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988131393U priority Critical patent/JPH0252456U/ja
Publication of JPH0252456U publication Critical patent/JPH0252456U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体装置の一実施例を
示す正面図、第２図は第１図の部分断面を含む平
面図である。第３図は従来の半導体装置の一例を
示す正面図、第４図は第３図の平面図である。 １０……半導体装置、１１……第１の半導体ペ
レツト、１２……第２の半導体ペレツト、１５…
…リード（外部引出し用リード）。 FIG. 1 is a front view showing an embodiment of a semiconductor device according to the present invention, and FIG. 2 is a plan view including a partial cross section of FIG. FIG. 3 is a front view showing an example of a conventional semiconductor device, and FIG. 4 is a plan view of FIG. 3. 10... Semiconductor device, 11... First semiconductor pellet, 12... Second semiconductor pellet, 15...
...Lead (lead for external drawer).

Claims (1)

【実用新案登録請求の範囲】 第１、第２の半導体ペレツトによりリードを挾
み込み、各半導体ペレツトを、 上記リードに電気的に接続したことを特徴とす
る半導体装置。[Claims for Utility Model Registration] A semiconductor device characterized in that a lead is sandwiched between first and second semiconductor pellets, and each semiconductor pellet is electrically connected to the lead.
JP1988131393U 1988-10-06 1988-10-06 Pending JPH0252456U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988131393U JPH0252456U (en) 1988-10-06 1988-10-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988131393U JPH0252456U (en) 1988-10-06 1988-10-06

Publications (1)

Publication Number Publication Date
JPH0252456U true JPH0252456U (en) 1990-04-16

Family

ID=31387418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988131393U Pending JPH0252456U (en) 1988-10-06 1988-10-06

Country Status (1)

Country Link
JP (1) JPH0252456U (en)

Similar Documents

Publication Publication Date Title
JPH01107141U (en)
JPS58103804U (en) Reiki device for rotary tiller
JPH0252455U (en)
JPS62166645U (en)
JPH0265355U (en)
JPH0468528U (en)
JPS61106038U (en)
JPH0241453U (en)
JPS64331U (en)
JPS6033451U (en) Resin-encapsulated semiconductor device
JPS6343432U (en)
JPH01176949U (en)
JPS6030210U (en) Corset with one waist belt
JPH01113367U (en)
JPS6190245U (en)
JPH01140847U (en)
JPS6049859U (en) exercise chair
JPS63105357U (en)
JPH044767U (en)
JPS63180928U (en)
JPH04759U (en)
JPH02116747U (en)
JPS6425173U (en)
JPH0428436U (en)
JPH0217856U (en)