JPH0252467A - Photosensor device - Google Patents

Abstract

PURPOSE:To make a thickness of an upper-part support part of a chassis sufficiently thick to obtain mechanical strength by a method wherein both a first substrate and a second substrate for a contact-type image sensor are supported directly by the chassis in such a way that any other member exists between both substrates and the chassis. CONSTITUTION:A chassis 1 is molded by an extrusion operation from a billet of Al; after this molding operation, a slender through hole 1b is made by a stamping operation. An LED array 3 is fixed to an inclined plane 1c inside the chassis 1 via an LED array support sheet 4; a SELFOC lens array 5 is inserted partly into the through hole 1b made from a horizontal plane 1a inside the chassis 1 and is fixed to the chassis 1. In this manner, a common substrate is not formed; a sensor substrate 7 and a substrate 13 for drive circuit use are bonded directly to the rear surface of the chassis 1. By this structure, a thickness l1 under the horizontal plane 1a inside the chassis becomes larger by a thickness of a common substrate 22; the chassis 1 becomes solid; when the through hole 1b is formed by the stamping operation, the chassis 1 is not deformed. In addition, when the chassis is worked, the chassis is not distorted.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to an optical sensor device, for example, a contact type image sensor.

BACKGROUND OF THE INVENTION In recent years, contact image sensors have been developed as image (original) reading devices in facsimile machines, image readers, and the like. This image sensor has the same size as the reading length and is configured to come into close contact with the document and perform photoelectric conversion.

Close-contact image sensor (hereinafter simply "image sensor")
) has an LED array for illumination and a SELFOC lens array supported in the chassis, a light receiving element supported in the opening on the bottom of the chassis, and a glass plate for placing documents on the top of the chassis. . Then, the light from the LED array illuminates the document, and the reflected light forms an image on the light-receiving element of the light-receiving element section by the SELFOC lens array, and the image information of the document resulting from this image formation is converted into an electrical signal and output. It looks like this.

FIG. 6 is a schematic diagram showing an example of an image sensor. 5
1 is a document, 52 is an illumination LED (light emitting diode) array, 53 is a SELFOC lens array, and 57 is a document 5
1 guide plate, 40 an image sensor module, 41
49 is a support body, 49 is an aluminum plate, A is a light receiving element portion, 1 is a wiring portion, and C is a driving IC portion of the light receiving element. In the image sensor device having such a configuration, the document 51 is
Illuminated by the ED array 52, the image on the surface of the original 51 is focused as reflected light 54 by the SELFOC lens array 53 onto the light receiving element portion A on the sensor array substrate 41 as a real image of the same size.

As the image sensor module 40 used here, for example, one having a structure as shown in FIG. 7 is known. That is, the sensor board 60 and the drive circuit board 61 are separated, and each is fixed onto a common support 41 by adhesive. On the sensor substrate 60, there is a light-receiving element part A made of a semiconductor light-receiving layer made of amorphous silicon, for example, a PIN (simply shown in the drawing) reading part 62, and a wiring 63 for drawing out the output of the reading part. A wiring section is formed.

On the other hand, a semiconductor chip 64 for driving the sensor is mounted on the drive circuit board 61, and power lines, signal lines, etc. 65 connected to the semiconductor chip are formed.

The electrical connection between both boards 60-61 is made by the drive circuit board 61.
The upper semiconductor chip 64 and the wiring 63 on the sensor board 60
This is done by wire bonding with. For this wire bonding, a gold wire 66 is used, and the first bonding (usually pole bonding onto the pad 67) is performed on the semiconductor chip 64 side, and the subsequent bonding is generally performed on the wiring part side on the sensor board 60. It is true.

In such a mounting structure, since the sensor board 60 and the drive circuit board 61 are separated, the following advantages arise. First, the manufacturing yield of the sensor substrate 60 is generally low;
Although the manufacturing yield of the drive circuit board 61 is high, since both boards can be manufactured separately and mounted after selecting good sensor boards 60, manufacturing efficiency is improved. In addition, since the area for mounting the semiconductor chip 64 on the sensor board is no longer required, and the area of the sensor board is reduced, the number of parts to be taken out increases when making multiple sensor boards, reducing manufacturing costs. do.

Furthermore, since the electrical connection between the semiconductor chip 64 on the drive circuit board 61 and the wiring part 63 on the sensor board 60 is made by one-time wire bonding, the lateral length in FIG. 7 is reduced. , a compact sensor module can be formed.

In the image sensor module 40 shown in FIG. 7, light is received from the sensor substrate 60 side, so the sensor substrate 60 is a glass substrate, and a through hole 41a is provided in the common support 41 at the position of the reading section 62. It is. The above-mentioned fusion by wire bonding is performed using ultrasonic waves as an energy source, and the common support 41 is made of metal, especially aluminum (or glass) so that the wire bonding can be performed efficiently without dispersing the ultrasonic waves. Good.).

FIG. 5 is a sectional view of the image sensor.

The chassis 21 is made of aluminum and is formed by extrusion. flJi slope 21c inside chassis 21
An LED array 3 is supported via an LED array support plate 4. A document supporting glass 2 is placed on the upper end of the chassis 21 . Horizontal surface 21a inside chassis 21
The SELFOC lens array 5 is partially fitted into the through-hole 21b provided in the through hole 21b and is fixed to the chassis 21. The SELFOC lens array 5 includes a large number of SELFOC lenses each having a diameter of 0.9 to 1.1 cylinders arranged in two rows within a glass epoxy frame and fixed with silicone resin. On the bottom surface of the chassis 21 is an aluminum common board 22 (seventh board).
A through hole 22a (corresponding to 41a in FIG. 7) is provided in the common substrate 22 under the SELFOC lens array 5.

The common board 22 includes a glass sensor board 7 (corresponding to 60 in FIG. 7) on which a reading section 6 (corresponding to 62 in FIG. 7) and wiring 19 (corresponding to 63 in FIG. 7) are arranged, and an IC. Chip 8 (corresponding to 64 in Fig. 7) and signal line 9 (corresponding to 64 in Fig. 7)
A glass epoxy drive circuit board 13 (corresponding to 61 in FIG. 7) on which a glass epoxy drive circuit board 13 (corresponding to 61 in FIG. 7) is arranged is fixed. IC
The chip 8 connects the wiring 19 and the signal line 9 with wires 10 and 10 (
(corresponding to 66 and 66 in FIG. 7) are connected by wire bonding. In the figure, 12 is a connector for connecting the signal line 9 to external wiring.

The light from the LED array 3 passes through the glass plate 2 and illuminates a document (not shown) that is moving on it, and the reflected light enters the SELFOC lens array 5 and the through hole 21 of the chassis.
b and passes through the sensor board 7 to form an image on the reading unit 6.

This image information is converted into an electrical signal and output to the outside via the IC chimp 8 and the connector 12. The lower side of the chassis 21 is closed by the back cover 14, and the openings on the side surfaces (the front and back sides in the figure) of the chassis 21 are closed by the lateral M15.

Although the image sensor having the structure shown in FIGS. 5 to 7 has the above-mentioned advantages, as a result of studies conducted by the present inventor, it has been found that the image sensor has the following drawbacks.

(1) Due to the presence of the common board 22, the thickness below the horizontal plane of the chassis (indicated by f!, 2 in FIG. 5) is reduced by the thickness of the common board 22. 2 becomes smaller. Since the through-hole 21b of the chassis is formed by punching an extruded material, if the thickness 2□ is small, the chassis may be deformed during the punching process.

(2) Since the sensor board 7 and the drive circuit board 13 are bonded to the common board 22 and then the common board 22 is bonded to the chassis 21, the bonding work must be performed twice, which is time consuming.

(3) Due to the above-mentioned bonding twice, errors in the vertical position of each substrate are accumulated, making it difficult to accurately position the reading section 6 and making focusing difficult.

C.1 Purpose of the Invention The present invention aims to provide an optical sensor device that has a reduced number of parts, is easy to assemble, and has high precision.

21 Structure of the Invention The present invention comprises a first base that supports a light-receiving element portion and a wiring portion of the light-receiving element portion, a second base that supports a semiconductor chip, and at least the first and first bases. The present invention relates to an optical sensor device having a supporting chassis, wherein both the first and second base bodies are directly supported by the chassis, and the wiring portion and the semiconductor chip are electrically connected.

Note that the above-mentioned "direct support" means that the first and second base bodies are supported by the chassis substantially without intervening other members, and the above-mentioned "chassis J is formed by, for example, extrusion processing. This includes not only a single member formed by molding, but also a structure in which an anti-fixing member is integrally provided on the support surface.

E, Example The present invention will be explained in detail below.

1 and 3 show image sensors, FIG. 1 is a sectional view taken along the line I-1 in FIG. 3, and FIG.
It is a 1-line arrow sectional view. Note that the parts common to those in FIG. 5 are denoted by the same reference numerals, and since their functions are the same as those described above, their description will be omitted.

FIG. 4 is a plan view of the chassis. As mentioned above, the chassis 1 is formed by extrusion processing from an aluminum billet, and after forming, the elongated through hole 1 is formed by punching.
b is formed.

Similarly to FIG. 5, the LED array 3 is fixed to the inclined surface 1c in the chassis 1 via the LED array support plate 4, and the SELFOC lens array 5 is inserted into the through hole 1b provided from the horizontal surface 1a in the chassis 1. It is partially enlarged and fixed to the chassis 1.

What should be noted in this example is that a common board (22 in FIG. 5) is not provided, and the sensor board 7 and drive circuit board 13 are directly bonded to the bottom surface of the chassis 1. An epoxy resin adhesive is used for this bonding.

With this structure, the horizontal surface 1 inside the chassis
Thickness under a! 1 is larger than the thickness 2□ in FIG. 5 by the thickness of the common substrate 22, and the chassis 1 becomes rigid, and the chassis 1 is not deformed when the through hole 1b is formed by punching. Furthermore, since the bonding is done only once, the error in the vertical position of the reading section 6 is reduced, making it possible to focus accurately and easily.This, combined with the fact that the chassis is not distorted as described above, improves accuracy. It becomes a good image sensor. Furthermore, since the common board 22 shown in FIG. 5 is not provided, the number of parts is reduced and the bonding process can be completed in one step, thereby simplifying the assembly work. In addition, wire 0.
10 wire bonding connections are made on both boards 7.13
After adhering to the chassis 1, the chassis 1 is turned upside down.

Next, the structure of the reading section 6 in this example will be explained.

FIG. 2 is an enlarged partial sectional view taken along the line ■--■ in FIG.

The reading unit 6 is I To (Indium Tin).
A transparent conductive film 16 made of a transparent conductive film 16 made of
The light-receiving element portion is composed of a pin semiconductor light-receiving layer 18 on which the main component is amorphous silicon containing hydrogen, and a second electrode (wiring) 19 made of chromium or aluminum connected to this layer. Configure it and set the pin. In FIG. 2, these layers are exaggerated in thickness. Wires 0.10 are wire-bonded to the driving IC chip 8, one wire 0 is connected to the wiring 19 by wire bonding, and the other wire 10 is connected to the signal line 9 by wire bonding. The driving IC chip 8 is connected to the wire 10.10.
, and are sealed and protected by, for example, silicone resin 11. A large number of reading units 6 and driving IC chips 8 are arranged in a row in the longitudinal direction of the chassis 1 and the sensor board 7, respectively.

By making the sensor substrate made of transparent glass as in this example, and using the reading section as a pin to receive light through the sensor substrate, the following advantages are brought about. [Glass substrates provided with TO transparent conductive films are commercially available, so by using them, the reading section can be formed in the same process as, for example, manufacturing solar cells, and the manufacturing cost is 1~
can be reduced. Further, when providing a protective layer (not shown in the embodiment) on the reading section, it is not necessary to make it transparent, and any protective layer can be selected.

In addition to the embodiments described above, various modifications are possible based on the technical idea of the present invention. For example, instead of the electrical connection using wire bonding, electrical connection using a film carrier tape or electrical connection using a beam lead may be used. Also, instead of forming the through hole (lb in Figure 4) in the chassis by punching, a space with the same width as the through hole is provided over the entire length of the chassis when the chassis is formed by extrusion. Also good. In this case, a canopy is integrally provided at the upper end of the chassis during chassis molding, and a slit is provided in the canopy within the width of the original for illumination of the original. In addition, the structure of the reading section can be a PIN type, a Brenna type, a Schottky barrier, or another type of sandwich structure, and the drive method can also be an IC drive type,
Matrix type etc. are possible. The reading section can also be of a type other than the contact type.

Effects of the Invention In the present invention, since both the first and second base bodies are directly supported by the chassis, there are no other members between the two base bodies and the chassis, and the upper support portion of the chassis is The thickness can be made sufficient to provide mechanical strength. Therefore, the chassis is not distorted during chassis processing, the number of parts is reduced, and errors in the position of the light receiving element supported by the first base body are reduced. As a result, the accuracy and yield of the optical sensor device are improved, and the number of parts is reduced, which simplifies the assembly process and reduces manufacturing costs.

[Brief explanation of the drawing]

1 to 4 show embodiments of the present invention, and FIG. 1 is a cross-sectional view of a contact type image sensor ([-] in FIG. 3).
Figure 2 is a cross-sectional view of the reading section (light-receiving element) and its surroundings (enlarged partial cross-sectional view of ■-■ A sectional view taken along the arrows, and FIG. 4 is a plan view of the chassis. 5 to 7 show conventional examples, in which FIG. 5 is a sectional view similar to FIG. 1 of the contact type image sensor, and FIG. 6 is a cross-sectional view for explaining the structure of the contact type image sensor. The schematic diagram, FIG. 7, is a cross-sectional view of the image sensor module μm. In addition, in the symbols shown in the drawings, 1... Chassis 1a... Horizontal surface 1b in the chassis...
・・・・・・Chassis through hole 3・・・・・・・・・L
ED array 5...Selfoc lens array 6...
...Reading section 7...Sensor board 8...Drive IC chip 0...-
... Connection wire 3 ... Drive circuit board 6 ... Transparent conductive film 7 ... First electrode 8 ... . . . Semiconductor light-receiving layer 19 . . . Second electrode (wiring). Representative Patent Attorney Hiroshi Osaka 3 Figure 6 Figure 4 Figure 7 (self-motivated) Procedural line 11 official book (1), page 11 of the specification, lines 13-14, ``transparent conductive film 9'' is referred to as ``transparent''. I corrected it to ``conductive film 16''. ), Figure 2 of the drawing will be corrected as shown in the attached sheet. Above ~ 1゜Indication of the case 1988 Patent Application No. 204330 2゜Name of the invention Optical sensor device 3゜Relationship with the person who makes the amendment

Claims (1)

[Claims] 1. A first base body that supports a light-receiving element part and a wiring part of this light-receiving element part, and a second base body that supports a semiconductor chip;
a chassis that supports at least the first and second substrates, the first and second substrates are both directly supported by the chassis, and the wiring section and the semiconductor chip are electrically connected. optical sensor device.