JPH0254247U - - Google Patents

Info

Publication number
JPH0254247U
JPH0254247U JP13369388U JP13369388U JPH0254247U JP H0254247 U JPH0254247 U JP H0254247U JP 13369388 U JP13369388 U JP 13369388U JP 13369388 U JP13369388 U JP 13369388U JP H0254247 U JPH0254247 U JP H0254247U
Authority
JP
Japan
Prior art keywords
pins
package
lsi package
coarser
featuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13369388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13369388U priority Critical patent/JPH0254247U/ja
Publication of JPH0254247U publication Critical patent/JPH0254247U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係るLSIパツケージの平面
図、第2図は第1図のLSIパツケージを実装す
る多層プリント基板の平面図、第3図は従来のL
SIパツケージの平面図、第4図は第3図のLS
Iパツケージを実装する多層プリント基板の平面
図である。 11:LSIパツケージ本体、12:ピン、1
3:内層銅箔、14:内層銅箔抜き。
Fig. 1 is a plan view of an LSI package according to the present invention, Fig. 2 is a plan view of a multilayer printed circuit board on which the LSI package of Fig. 1 is mounted, and Fig. 3 is a plan view of a conventional LSI package.
A plan view of the SI package, Figure 4 is the LS of Figure 3.
FIG. 2 is a plan view of a multilayer printed circuit board on which an I-package is mounted. 11: LSI package body, 12: Pin, 1
3: Inner layer copper foil, 14: Inner layer copper foil removed.

Claims (1)

【実用新案登録請求の範囲】 LSIパツケージ本体の一面に多数のピンを配
したPGAタイプのLSIパツケージにおいて、 上記ピンは、その配列の一部に他のピン相互の
間隔より粗い部分を設けたことを特徴とするLS
Iパツケージ。
[Claims for Utility Model Registration] In a PGA type LSI package in which a large number of pins are arranged on one side of the LSI package body, the above-mentioned pins are provided with a part where the spacing between the other pins is coarser than that between the other pins. LS featuring
I package.
JP13369388U 1988-10-13 1988-10-13 Pending JPH0254247U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13369388U JPH0254247U (en) 1988-10-13 1988-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13369388U JPH0254247U (en) 1988-10-13 1988-10-13

Publications (1)

Publication Number Publication Date
JPH0254247U true JPH0254247U (en) 1990-04-19

Family

ID=31391793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13369388U Pending JPH0254247U (en) 1988-10-13 1988-10-13

Country Status (1)

Country Link
JP (1) JPH0254247U (en)

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