JPH031945U - - Google Patents
Info
- Publication number
- JPH031945U JPH031945U JP1989061761U JP6176189U JPH031945U JP H031945 U JPH031945 U JP H031945U JP 1989061761 U JP1989061761 U JP 1989061761U JP 6176189 U JP6176189 U JP 6176189U JP H031945 U JPH031945 U JP H031945U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- circuit prevention
- view
- prevention tape
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesive Tapes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の短絡防止テープの一実施例を
示す平面図、第２図は第１図の短絡防止テープの
断面図、第３図は第１図の短絡防止テープを印刷
配線板に貼り付けた状態を示す斜視図、第４図は
はんだ付完了後の印刷配線板の取付座の断面図、
第５図は本考案の他の実施例を示す平面図、第６
図は本考案のさらに他の実施例を示す平面図、第
７図は第５図の短絡防止テープを印刷配線板に貼
り付けた状態を示す斜視図、第８図は第６図の短
絡防止テープを印刷配線板に貼り付けた状態を示
す斜視図である。
１０，３２，３４……短絡防止テープ、１２…
…本体、１４，３６，３８……穴、１６……接着
剤層。
Figure 1 is a plan view showing an embodiment of the short circuit prevention tape of the present invention, Figure 2 is a sectional view of the short circuit prevention tape of Figure 1, and Figure 3 is a printed circuit board using the short circuit prevention tape of Figure 1. A perspective view showing the pasted state, Figure 4 is a sectional view of the mounting seat of the printed wiring board after soldering is completed,
Fig. 5 is a plan view showing another embodiment of the present invention;
The figure is a plan view showing still another embodiment of the present invention, FIG. 7 is a perspective view showing the state in which the short circuit prevention tape shown in FIG. 5 is attached to a printed wiring board, and FIG. FIG. 3 is a perspective view showing a state in which the tape is attached to a printed wiring board. 10, 32, 34...Short circuit prevention tape, 12...
...Main body, 14, 36, 38... Hole, 16... Adhesive layer.
Claims (1)
れている複数の穴を有する帯状の本体と、該本体
の片面に形成されている接着剤層とを備える短絡
防止テープ。 A short-circuit prevention tape comprising a belt-shaped main body made of a heat-resistant material and having a plurality of holes arranged along the longitudinal direction, and an adhesive layer formed on one side of the main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989061761U JPH031945U (en) | 1989-05-26 | 1989-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989061761U JPH031945U (en) | 1989-05-26 | 1989-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031945U true JPH031945U (en) | 1991-01-10 |
Family
ID=31590296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989061761U Pending JPH031945U (en) | 1989-05-26 | 1989-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031945U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001051580A1 (en) * | 2000-01-13 | 2001-07-19 | Nitto Denko Corporation | Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof |
| JP2007089930A (en) * | 2005-09-30 | 2007-04-12 | Samii Kk | Variable display device for game machine |
-
1989
- 1989-05-26 JP JP1989061761U patent/JPH031945U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001051580A1 (en) * | 2000-01-13 | 2001-07-19 | Nitto Denko Corporation | Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof |
| US7056406B2 (en) | 2000-01-13 | 2006-06-06 | Nitto Denko Corporation | Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof |
| JP2007089930A (en) * | 2005-09-30 | 2007-04-12 | Samii Kk | Variable display device for game machine |