JPH0255912B2 - - Google Patents
Info
- Publication number
- JPH0255912B2 JPH0255912B2 JP15569982A JP15569982A JPH0255912B2 JP H0255912 B2 JPH0255912 B2 JP H0255912B2 JP 15569982 A JP15569982 A JP 15569982A JP 15569982 A JP15569982 A JP 15569982A JP H0255912 B2 JPH0255912 B2 JP H0255912B2
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- noble metal
- microns
- contact
- clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 29
- 229910000510 noble metal Inorganic materials 0.000 claims description 10
- 238000004881 precipitation hardening Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 239000010970 precious metal Substances 0.000 description 9
- 238000005253 cladding Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 6
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 229910001252 Pd alloy Inorganic materials 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- VRUVRQYVUDCDMT-UHFFFAOYSA-N [Sn].[Ni].[Cu] Chemical compound [Sn].[Ni].[Cu] VRUVRQYVUDCDMT-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- QOGLYAWBNATGQE-UHFFFAOYSA-N copper;gold;silver Chemical compound [Cu].[Au][Ag] QOGLYAWBNATGQE-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Manufacture Of Switches (AREA)
- Contacts (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15569982A JPS5944722A (ja) | 1982-09-07 | 1982-09-07 | すり接点の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15569982A JPS5944722A (ja) | 1982-09-07 | 1982-09-07 | すり接点の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5944722A JPS5944722A (ja) | 1984-03-13 |
| JPH0255912B2 true JPH0255912B2 (fr) | 1990-11-28 |
Family
ID=15611582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15569982A Granted JPS5944722A (ja) | 1982-09-07 | 1982-09-07 | すり接点の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5944722A (fr) |
-
1982
- 1982-09-07 JP JP15569982A patent/JPS5944722A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5944722A (ja) | 1984-03-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4771970B2 (ja) | 接続部品用導電材料 | |
| JP2895793B2 (ja) | 摺動接点材料及びクラッド複合材ならびにそれらからなるコンミテータ及びそのコンミテータを使用した直流小型モータ | |
| JP3465876B2 (ja) | 耐摩耗性銅または銅基合金とその製造方法ならびに該耐摩耗性銅または銅基合金からなる電気部品 | |
| JPH1025562A (ja) | 銅基合金およびその製造方法 | |
| JP6451385B2 (ja) | 端子金具及びコネクタ | |
| JPH0364969B2 (fr) | ||
| JP5479789B2 (ja) | コネクタ用金属材料 | |
| JP3998731B2 (ja) | 通電部材の製造方法 | |
| JPH0255912B2 (fr) | ||
| JPS61114417A (ja) | Ａｇ−ＳｎＯ系複合電気接点材とその製法 | |
| WO2016006469A1 (fr) | Borne à ajustement serré et connecteur de carte | |
| JP4043834B2 (ja) | めっき材料とその製造方法、それを用いた電気・電子部品 | |
| JP4598238B2 (ja) | 接点部材及びその製造方法 | |
| JP3287080B2 (ja) | 電気接続具製造用複合メッキＣｕまたはＣｕ合金板 | |
| JP4219260B2 (ja) | スパークプラグ及びその製造方法 | |
| JP2006149144A (ja) | マイクロモーター、マイクロモータ用摺動接点及びその製造方法 | |
| JPS60127673A (ja) | コネクタ材料の製造方法 | |
| JPH0520949A (ja) | 電気接点材料とその製造方法 | |
| JPS62287634A (ja) | 半導体素子結線用細線 | |
| JPS6332883A (ja) | 電子部品の製法 | |
| JPS58187282A (ja) | 銀−酸化物系複合電気接点材料の製造方法 | |
| JP3061077B2 (ja) | 複合電気接点材料の製造方法 | |
| JPH0371522A (ja) | 電気接点材とその製造方法 | |
| JPH11102739A (ja) | かん合型接続端子 | |
| JPH0424808B2 (fr) |